The present invention relates to a thin plate container for housing thin plates such as semiconductor wafers, magnetic recording medium disks, optical recording medium disks, glass substrates for liquid crystal, or film substrates for flexible display devices.
In recent years, a thin plate for an electronic device, such as a semiconductor wafer, has been increased in size and decreased in thickness. For this reason, the thin plate is likely to be damaged. As a container for housing such thin plate to store and carry it, a multistage type housing cassette described in a cited reference 1 is known. The multistage type housing cassette is a cassette capable of carrying out an extremely thin wafer having a thickness of 20 to 100 μm without chipping of an outer circumferential surface of the wafer and also without erroneous suction of it on a pad. This housing cassette is one in which a plurality of housing racks are arranged at equal intervals and stacked in a multistage form through a support.
However, such multistage type housing cassette only supports a circumferential edge of the extremely thin wafer from its bottom side, but is not particularly provided with means for securely constraining the extremely thin wafer. For this reason, if the multistage type housing cassette is tilted, the extremely thin wafer may be easily displaced and damaged, so that it is necessary to carry the cassette carefully, resulting in poor workability upon carrying. Also, the cassette is not configured to seal an inside thereof to isolate the extremely thin wafer from an external environment. For this reason, the cassette can neither seal the extremely thin wafer to isolate it from an external environment, nor securely support it.
For these reasons, the present inventor has proposed a thin plate container capable of isolating thin plates such as semiconductor wafers from an external environment and securely supporting and carrying it. An example of the thin plate container is illustrated in
Patent document 1: Japanese Patent Publication No. 2004-273867.
The thin plate container 1 configured as above does not have any particular problem if it is used in a factory or the like; however, if it is carried, it has a problem in sealing performance and shock resistance.
The thin plate container 1 includes the plurality of loading trays 2 coupled with each other with being stacked, so that if it is externally shocked, each of the loading trays 2 may be slightly displaced, or the sealing performance between the respective loading trays 2 may be reduced.
The present invention is made in consideration of the above-described points, and is improved so that the sealing performance and shock resistance are enhanced to be able to securely house and carry the thin plates.
A thin plate container according to the present invention includes: a tray stack, having a plurality of mutually removable loading trays stacked to couple with each other with the loading trays being stacked, for housing a thin plate being held in a space between the respective loading trays; and an external container for housing therein the tray stack.
Based on this configuration, the thin plate is housed in the space between the respective loading trays of the tray stack and then housed in the external container. Accordingly, the thin plate is housed on the basis of the double structure.
The thin plate container preferably includes a pair of grips fitted with and gripped by a processing arm of external equipment provided at both opposite ends of each of the loading trays of the tray stack; and the external container includes: a container body formed in a bag-like shape having an opening at one end; a lid for covering the opening of the container body; a sealing material, provided between the lid and the container body, for airtightly isolating an inside of the container body from an external environment; and a pair of tray stack supporters, respectively provided on two opposite inner surfaces of the container body, for supporting the tray stack.
Based on this configuration, the tray stack is housed in the external container with the thin plate being housed in the tray stack. At this time, the pair of tray stack supporters supports the tray stack. The external container for housing and supporting therein the tray stack is sealed by the sealing material.
It is preferable in the thin plate container that the tray stack airtightly retains the space, located between the respective loading trays coupled with each other, for housing the thin plate.
Based on this configuration, the thin plate is doubly sealed by the tray stack and the external container to be isolated from an external environment.
It is preferable in the thin plate container that the tray stack includes: coupling/decoupling means adapted to independently couple/decouple between any of the plurality of loading trays coupled to each other and an adjacent one of the loading trays; and a loading portion, provided on each of the loading trays, for loading the thin plate upon holding of the thin plate in collaboration between the adjacent two of the loading trays.
Based on this configuration, the adjacent two loading trays are coupled with each other by the coupling/decoupling means to hold the thin plate with the thin plate being loaded on the loading portion.
It is preferable in the thin plate container that the tray stack includes: one or a pair of base trays having a mechanical interface for fitting the tray stack to the external equipment side; one or more loading trays coupled with one surface of the base tray or inserted between the respective base trays to be coupled with each other; coupling/decoupling means adapted to independently couple/decouple between the respective loading trays or between the base tray and the loading tray; and a loading portion, provided on each of the loading trays, for loading the thin plate upon holding of the thin plate in collaboration between adjacent two of the loading trays or between the loading tray and the base tray.
Based on this configuration, the adjacent two loading trays or the loading tray and the base tray are coupled with each other by the coupling/decoupling means to hold the thin plate with the thin plate being loaded on the loading portion. The base tray is fitted to the external equipment via the mechanical interface to support, on the external equipment side, the tray stack including the loading tray and the base tray.
It is preferable in the thin plate container that a sealing material for airtightly isolating from an external environment the thin plate housed on the loading portion with two of the loading trays or the loading tray and the base tray being coupled with each other is provided around the loading portion of the loading tray.
Based on this configuration, the sealing material seals the thin plate housed on the loading portion from a surrounding environment to airtightly isolate it from an external environment. This enables the thin plate to be kept clean.
It is preferable in the thin plate container that tray stack retainers for holding the tray stack housed in the container body from a bottom surface side of the container body and from the container body of the lid to support the tray stack upon fitting of the lid onto the container body are respectively provided on the bottom surface inside the container body of the external container and on a surface on the container body of the lid, and fitting portions fitted to the tray stack retainers are provided at an end portion on the container body bottom surface side of each of the loading trays of the tray stack housed in the container body and at an end portion on the lid side.
Based on this configuration, the tray stack retainer on the bottom surface inside the container body and that on the container body side of the lid are fitted to the fitting portions of the loading tray to support the tray stack inserted into the container body of the external container.
It is preferable in the thin plate container that the tray stack retainers and the fitting portions have concave portions and convex portions to be fitted to each other, and abutting surfaces of the concave portions and the convex portions are formed wedgewise so as to slope.
Based on this configuration, the convex portions of the tray stack retainers and the concave portions of the fitting portions are fitted to each other, and thereby the abutting surfaces sloping wedgewise of the concave portions and the convex portions are brought into abutting contact with each other. If the concave portions and the convex portions are deeply coupled with each other in the above state, alignment corrections are made on the abutting surfaces sloping wedgewise, and then the tray stack is supported by the tray stack retainers.
It is preferable in the thin plate container that a latch mechanism for pressing and constraining the lid to the container body side and deeply coupling the tray stack retainers and the fitting portions with each other with the lid being fitted onto the container body and the tray stack retainers and the fitting portions being fitted to each other is provided between the container body and the lid.
Based on this configuration, if the latch mechanism presses and constrains the lid to the container body side with the lid being fitted onto the container body and the tray stack retainers and the fitting portions being fitted to each other, the tray stack retainers and the fitting portions are deeply coupled with each other.
It is preferable in the thin plate container that the tray stack retainers are formed of an elastic body and elastically support the tray stack.
Based on this configuration, the tray stack retainers elastically support the tray stack, so that the tray stack retainers absorbs external vibration or shock to prevent the vibration or the like from transmitting to the thin plate.
It is preferable in the thin plate container that a space for inserting the processing arm of the external equipment and a space for allowing the tray stack supported by the processing arm to be lifted are provided between the tray stack and the container body with the tray stack being housed in the container body and supported by the tray stack supporters.
Based on this configuration, the processing arm of the external equipment is inserted to be coupled with the tray stack with the tray stack being supported by the tray stack supporters. Then, the tray stack supported by the processing arm is lifted and carried outside.
It is preferable in the thin plate container that the tray stack supporters supporting the tray stack housed in the container body are slidably or rotatably supported, and spaces for inserting the processing arm of the external equipment are provided between the tray stack supporters and the tray stack with the tray stack supporters being separated.
Based on this configuration, the processing arm of the external equipment is inserted between the tray stack supporters and the tray stack, and decouples and separates any of the loading trays of the tray stack at any position to take in and out the thin plate inside the loading tray, with the tray stack supporters being separated.
It is preferable in the thin plate container that the container body of the external container is provided with a grip mechanism gripped by a transfer arm of a transfer robot.
Based on this configuration, the transfer arm of the transfer robot grips the grip mechanism to lift and transfer the external container.
It is preferable in the thin plate container that a door guide for guiding the lid upon fitting of the lid onto the container body, and supporting the lid so as to prevent the lid from being misaligned with respect to the container body is provided between the container body of the external container and the lid.
Based on this configuration, the lid is guided by the door guide and then fitted onto the container body, as well as being supported so as not to be misaligned with respect to the container body.
It is preferable in the thin plate container that the container body of the external container is provided with a handle for lifting the external container. The handle is often handled with both hands, so that a pair of the handles is provided on an outer side of the external container.
Based on this configuration, a worker holds the handles to lift and carry the external container.
It is preferable in the thin plate container that a part or a whole of the external container is formed of an ESD (electrostatic discharge) or electrically conductive material.
Based on this configuration, attachment or the like of dust onto the external container due to charging can be prevented.
It is preferable in the thin plate container that at least the loading tray of the tray stack is formed of an ESD or electrically conductive material.
Based on this configuration, attachment or the like of dust onto the loading tray due to charging can be prevented.
It is preferable in the thin plate container that any one or both of the tray stack and the external container are formed with a transparent window.
Based on this configuration, an internal state is checked through the transparent window.
As described above in detail, the loading tray and thin plate container according to the present invention can produce the following effects.
The tray stack for housing the thin plate in the space between the respective loading trays is housed in the external container to house the thin plate on the basis of the double structure, so that the thin plate can be securely and firmly housed and supported.
The tray stack for housing the thin plate is housed and supported in the external container with the grips of the loading tray being gripped by the pair of tray stack supporters, so that the tray stack housed in the external container can be firmly supported. As a result, the thin plate can be securely and firmly supported against the external vibration or shock. Also, the inside of the external container is sealed by the sealing material, so that the inside can be kept clean.
The space that is located between the respective loading trays of the tray stack, which are coupled with each other, and intended for housing the thin plate is airtightly retained, so that the thin plate can be doubly sealed by the tray stack and the external container, and therefore sealing performance can be significantly improved.
Adjacent two of the loading trays are coupled with each other by the coupling/decoupling means to hold the thin plate with the thin plate being loaded on the loading portion, so that any of the plurality of stacked loading trays can be decoupled at any position by the coupling/decoupling means to take in and out the thin plate.
Adjacent two of the loading trays or the loading tray and the base tray are coupled with each other by the coupling/decoupling means to hold the thin plate with the thin plate being loaded on the loading portion, so that any of the plurality of stacked loading trays coupled with the base tray can be decoupled at any position by the coupling/decoupling means to take in and out the thin plate. Also, the base tray is fitted to the external equipment via the mechanical interface to support the tray stack including the loading tray and the base tray on the external equipment, so that the tray stack can be easily and surely taken in and out of the external equipment.
The sealing material is provided around the loading portion of the loading tray to airtightly isolate, from an external environment, the thin plate housed on the loading portion with the two loading trays or the loading tray and the base tray being coupled with each other, so that the thin plate can be kept clean. Also, the thin plate can be doubly sealed in combination with the seal on the external container.
The tray stack retainer on the bottom surface inside the container body and that on the surface on the container body of the lid are fitted to the fitting portions of each of the loading trays to support the tray stack inserted into the container body of the external container, so that the tray stack can be stably supported inside the external container.
The abutting surfaces of the concave portions and the convex portions of the tray stack retainers and the fitting portions are formed wedgewise so as to slope, and the concave portions and the convex portions are fitted to and deeply coupled with each other, whereby the alignment corrections are made on the abutting surfaces, and the tray stack is supported by the tray stack retainers, so that the tray stack can be stably supported at a correct position in the external container.
The latch mechanism presses and constrained the lid to the container body and deeply couples the tray stack retainers and the fitting portions with each other with the lid being fitted onto the container body and the tray stack retainers and the fitting portions being fitted to each other, so that the tray stack can be stably supported at the correct position in the external container.
The space for inserting the processing arm of the external equipment, and the space for allowing the tray stack supported by the processing arm to be lifted are provided between the tray stack and the container body with the tray stack being housed in the container body and supported by the tray stack supporters, so that the processing arm of the external equipment can be inserted into the space and coupled with the tray stack to lift the tray stack and transfer it outside, and therefore taking in/out of the tray stack is easily automated.
The processing arm of the external equipment is inserted between the tray stack supporters and the tray stack, and any of the loading trays of the tray stack is decoupled and separated at any position to take out the thin plate inside the loading tray, with the tray stack supporters being separated, so that the thin plate can be taken in and out with the tray stack being housed in the external equipment.
The transfer arm of the transfer robot grips the grip mechanism to lift and transfer the external container, so that the thin plate container can be used in an automated factory without modification.
The lid is guided by the door guide and then fitted onto the container body, as well as being supported so as not to be misaligned with respect to the container body, so that the lid can be easily and accurately fitted onto the container body and also supported stably against the external vibration or shock with the misalignment of the lid being suppressed.
The worker holds the handles to lift the external container, and therefore can easily carry the container.
The attachment of dust onto the external container due to charging, or the like can be prevented, so that the thin plate can be kept clean.
The attachment of dust onto the loading trays due to charging, or the like can be prevented, so that the thin plate can be kept clean.
The internal state can be checked through the transparent window, so that a situation where the worker carries an empty container or the like by mistake can be eliminated.
An embodiment of the present invention will hereinafter be described on the basis of the accompanying drawings. The thin plate container of the present invention is a container for housing thin plates for electronic devices, such as semiconductor wafers, magnetic recording medium disks, optical recording medium disks, glass substrates for liquid crystal, or film substrates for flexible display devices, to be provided for use in a carrying, storage, or processing step (manufacturing line, or the like). In the present embodiment, a thin plate container for housing a semiconductor wafer is taken as an example to give a description. For this reason, an after-mentioned loading tray is configured to be of an almost circular shape. Note that for a plate material having a rectangular shape, such as a glass substrate for liquid crystal, the loading tray is also configured to be of a rectangular shape.
A thin plate container 11 mainly consists of a tray stack 12 and an external container 13 as illustrated in
The tray stack 12 is a container for directly housing semiconductor wafers W. The tray stack 12 has a plurality of mutually removable loading trays 16 stacked to couple to be described later with each other with being stacked, and is adapted to hold and house the semiconductor wafers W in respective spaces between any adjacent two of the loading trays 16. As illustrated in
The base trays 15 are trays that are respectively provided at end portions above and below the one or more stacked loading trays 16 to protect upper and lower end surfaces of the loading trays, and to engage with external equipment (not shown) for taking in/out the tray stack 12 or processing. The base tray 15 includes an upper base tray 15A and a lower base tray 15B. The respective base trays 15A and 15B are formed in an almost disk-like shape in accordance with the loading trays 16. The lower base tray 15B is, or the upper and lower base trays 15A and 15B are provided with a mechanical interface for fitting the trays to the external equipment. The mechanical interface is coupling means or the like such as a pin groove fitted with a kinematic pin (not shown) to align the tray stack 12, or a hook hole coupled with a transfer arm on the external equipment. The mechanical interface is added with a function necessary depending on a use mode.
A lower side surface of the upper base tray 15A is formed similarly to a second loading portion 19 on a lower side surface of the after-mentioned loading tray 16 as necessary. An upper side surface of the lower base tray 15B is provided with a first loading portion similar to a first loading portion 18 on an upper side surface of the after-mentioned loading tray 16 as necessary. A seal holding groove is also provided.
Any one or both of the upper and lower base trays 15A and 15B are provided with any one or all of a barcode, wireless tag, and InfoPad for managing information on the base trays 15. Based on this, various pieces of information are managed with any one of the barcode, wireless tag, or InfoPad, or sorted into the barcode, wireless tag, and InfoPad for management.
Note that if there is only one base tray 15, the base tray 15 is fitted onto one of the surfaces of the loading tray 16, and supports the loading tray 16 from the one of the surfaces.
The loading tray 16 is a tray that is inserted between the respective base trays 15 and intended for housing and supporting the semiconductor wafer W. The loading tray 16 is formed in an almost disc-like shape with a portion of an after-mentioned grip 20 being linearly cut. Any number of the loading trays 16 may be stacked. The loading trays 16 of which the number corresponds to the number of the semiconductor wafers W are stacked to constitute the tray stack 12 along with the base trays 15.
The loading tray 16 is configured to include the first loading portion 18, the second loading portion 19, the coupling/decoupling means 17, the grip 20, an fitting portion 21, and an air intake passage 22.
The first loading portion 18 is a portion for loading the semiconductor wafer W. The first loading portion 18 is formed on the upper side surface of the loading tray 16 being concaved in accordance with a size and shape of the semiconductor wafer W. The semiconductor waferr W is of a circular shape, so that the first loading portion 18 is formed in a circular shape in accordance with the shape of the semiconductor wafer W.
An outer circumferential edge of the first loading portion 18 is provided with a seal holding groove 23. The seal holding groove 23 is a groove for holding a sealing material 24. The seal holding groove 23 is formed in an annular shape along an outer circumferential edge of the first loading portion 18. Based on this, a housing space is formed by the first loading portion 18, the second loading portion 19, the sealing material 24, and a wall portion of a tray body. The sealing material 24 is provided to surround the housing space formed when two of the loading trays 16 are stacked and coupled with each other, with being fitted in the seal holding groove 23, and adapted to isolate the housing space from an external environment to keep it airtight. The housing space is set to have a size capable of housing at least one semiconductor wafer W. The housing space may simultaneously house two or more semiconductor wafers W depending on the intended use. In such a case, the housing space is set to have a dimension corresponding to a thickness of the two or more semiconductor wafers W being stacked.
The second loading portion 19 is a portion that is fitted to the first loading portion 18 of an adjacent loading tray 16 to form the housing space isolated from an external environment, and intended for loading and supporting the semiconductor waferr W when the semiconductor waferr W is sandwiched and turned upside down in the housing space. The second loading portion 19 houses and supports the semiconductor waferr W loaded on the first loading portion 18 in the housing space formed by covering the semiconductor waferr W from above. The second loading portion 19 is formed to have a same dimension as that of the first loading portion 18.
On surfaces of the first and second loading portions 18 and 19, loading convex portions (not shown) for pressing and supporting the semiconductor waferr W housed inside from both sides of it are provided. The loading convex portion is formed in a web shape in order to come into contact with the semiconductor waferr W through the minimum area to uniformly press an entire surface of the semiconductor wafer W. This allows the extremely thin semiconductor waferr W to be sandwiched and firmly supported in a housing space between the first and second loading portions 18 and 19.
An outer circumferential edge of the second loading portion 19 is provided with a seal receiving groove 25. The seal receiving groove 25 is a portion with which the sealing material 24 held in the seal holding groove 23 on the first loading portion 18 comes into close contact to improve airtightness inside the housing space.
The coupling/decoupling means 17 is means adapted to couple/decouple any adjacent two of the loading trays 16 with each other. Based on the coupling/decoupling means 17, any of the plurality of stacked loading trays 16 is adapted to be decoupled and opened at any position to take out the semiconductor waferr W inside the loading tray 16 or house the semiconductor waferr W in the loading tray 16 and couple the loading tray 16 with the others. As the coupling/decoupling means 17, any publicly known mechanism can be used. For example, it substantially consists of: a hook (not shown); a hook locking mechanism (not shown) for locking the hook to be coupled with it; and a removal operation hole 26 for inserting an operation key (not shown) for operating the hook locking mechanism to decouple the coupled hook. Note that the coupling/decoupling means 17 may be any means if it can couple/decouple any adjacent two of the loading trays 16 with each other, and any publicly known structural coupling/decoupling means can be used.
The removal operation hole 26 is a hole for inserting the operation key for performing the removal operation of the hook locking mechanism. The removal operation hole 26 is formed to face to a lateral surface of the loading tray 16. The operation key is adapted to be inserted into the removal operation hole 26 from a lateral surface of the loading tray 16 to separate the hook from an internal hook locking mechanism and unconstrain the coupling/decoupling means 17.
Based on this, when the base trays 15 and the loading trays 16 are stacked, the coupling/decoupling means 17 constrains the respective loading trays 16 to each other or the base tray 15 and the loading tray 16 to each other to constitute the tray stack 12. Also, by inserting the operation key into the removal operation hole 26 located at any position to unconstrain the coupling/decoupling means 17, the base tray 15 and the loading tray 16 are adapted to be able to be separated or recoupled at the any position.
The grip 20 is a portion fitted with and gripped by a processing arm of the external equipment. As illustrated in
The fitting portion 21 is a portion to be fitted to an after-mentioned tray stack retainer 35. The fitting portions 21 are provided at end portions on bottom and lid sides of an after-mentioned container body 31 (end portions on both sides respectively orthogonal to the grips 20 of the loading tray 16) with a corresponding one of the loading trays 16 being housed in the external container 13. The fitting portion 21 has a convex or concave portion to be fitted to the after-mentioned tray stack retainer 35. Note that in the present embodiment, the fitting portion 21 has the convex portion, whereas the tray stack retainer 35 has the concave portion. Also, such relationship may be reversed. That is, the fitting portion 21 may have the concave portion, whereas the tray stack retainer 35 may have the convex portion.
The convex fitting portion 21 is formed so that a cross-sectional shape of an arc-like circumferential edge is sloped wedgewise. Based on this, the fitting portion 21 comes into contact with the sloping surface of the convex portion of the after-mentioned tray stack retainer 35 while sliding on it, and is deeply coupled with the tray stack retainer 35, and thereby alignment in one direction (vertically in
The air intake passage 22 is a passage for sucking air inside the housing space in which the semiconductor waferr W is housed. The air intake passage 22 substantially consists of a first air intake passage 22A and a second air intake passage 22B. The first air intake passage 22A is provided so as to make a communicative connection between the first loading portion 18 of the loading tray 16 and an external environment. The second air intake passage 22B is provided so as to make a communicative connection between the second loading portion 19 of the loading tray 16 and an external environment. Each of the air intake passages 22 is connected to a suction tube (not shown) of an external suction device (not shown) to suck the air inside the housing space.
The air intake passage 22 is fitted with a filter and a cap as necessary. The filter is a member for keeping the inside of the housing space clean. As the filter, a filter having performance depending on a use mode is used. The cap is a member for sealing the inside of the housing space to keep the inside clean or keep the inside in a negative pressure state.
The loading tray 16 having the configuration is formed of a static-free or electrically conductive polymer material or an electrically conductive material. Also, as necessary, the loading tray 16 is formed of a transparent polymer material so that the first and second loading portions 18 and 19 of the loading tray 16 are visible to the outside.
As a specific material for the loading tray 16, a thermoplastic polymer material such as a polycarbonate based resin, polybutylene terephthalate based resin, polymethyl methacrylate based resin, cycloolefin based resin, or polypropylene based resin, and a fluorine based resin, or the like can be used. By mixing, into such polymer material, an electrically conductive material such as carbon fiber or metal powder, a surfactant, or the like, electrically conductive property or static-free property can be provided.
The transparent material includes a polycarbonate based resin, polymethyl methacrylate based resin, cycloolefin based resin, or polyethylene based resin.
The loading tray 16 is provided with the wireless tag (not shown). The wireless tag is recorded with the management information on the loading tray 16 or on the housed semiconductor wafer W, or the both pieces of information. The wireless tag may be a read-only tag or readable/writable tag. A function depending on the intended use is selected. Also, a fitting position for the wireless tag may be on an upper surface, a lateral surface, or lower surface of the loading tray 16. The fitting position is only required to be a position capable of transmitting/receiving the information to/from an external device for reading/writing the information from/in the wireless tag. Note that a barcode or InfoPad recorded with the same information may be provided, instead of the wireless tag. Alternatively, part or all of them may be provided. Such configuration is appropriately made to depend the management information.
The external container 13 is a container for housing therein the tray stack 12. The external container 13 substantially consists of: a container body 31 formed in a bag-like shape having an opening 31F at one end; a lid 32 for covering the opening 31F of the container body 31; a sealing material 33 that is provided between the lid 32 and the container body 31 and is intended for airtightly isolating an inside of the container body 31 from the an external environment; a pair of the tray stack supporters 34 that are respectively provided on two opposite inner surfaces of the container body 31, and intended for gripping the grips 20 of all or part of the loading trays 16 of the tray stack 12 to support the tray stack 12; the tray stack retainers 35 for holding and supporting the tray stack 12 from a bottom surface side of the container body 31 and from the container body 31 of the lid 32; a grip mechanism 36 gripped by a transfer arm of a transfer robot (not shown) in a factory to lift the external container 13; and a handle (not shown) gripped by a worker's hand to lift the external container 13.
The container body 31 is formed in an almost cubic shape as a whole. The container body 31 substantially consists of four sidewalls 31A, 31B, 31C, and 31D, and a bottom plate 31E, and provided with the opening 31F at an upper portion thereof. The container body 31 is installed sideways if it is installed so as to face to a wafer transfer device (not shown) in a manufacturing line for the semiconductor wafers W, or the like. An outer side of the sidewall 31B, which corresponds to the bottom in the sideways state (state illustrated in
At end portions (corresponding to the opening 31F portion) of the respective sidewalls 31A, 31B, 31C, and 31D of the container body 31, a lid receiving portion 31G in which the lid 32 is to be fitted is provided. At four corners of the lid receiving portion 31G, fitted portions 3111 are provided, which are concave portions fitted with an after-mentioned latch mechanism 41 of the lid 32 to constrain the lid 32 to the container body 31 side.
The lid 32 is a member for covering the opening 31F of the container body 31. The lid 32 is formed in an almost flat plate shape as illustrated in
The latch mechanism 41 is a mechanism for pressing and constraining the lid 32 to the container body 31 and deeply coupling the tray stack retainer 35 and the fitting portion 21 with each other with the lid 32 being fitted onto the container body 31 and the tray stack retainer 35 and the fitting portion 21 being fitted to each other. As illustrated in
The locking member 42 is a member projected to the container body 31 and fitted to the fitted portion 31H of the lid receiving portion 31G with the lid 32 being fitted to the lid receiving portion 31G of the container body 31.
The feeding member 43 is a member connected to the locking member 42 to make the locking member 42 appear or disappear. The feeding member 43 is rotatably fitted within the lid 32.
The cam mechanism 44 is a member for coming into abutting contact with an upper surface of the fitted portion 31H to press and constrain the lid 32 down to the container body 31 with a tip fitting portion 47 of the locking member 42 fed by the feeding member 43 being fitted to the fitted portion 3111 of the lid receiving portion 31G.
The holding cover 45 is a member for holding the locking member 42 and the feeding member 43. The cover retainer 46 is a member for constraining the holding cover 45 to the lid 32.
The cam mechanism 44 is adapted to press up the tip fitting portion 47 of the locking member 42 fed by the feeding member 43 to bring it into abutting contact with an upper surface of the fitted portion 31H, as well as being adapted to press down a base end portion to thereby press down and constrain the lid 32 to the container body 31 on the basis of the principle of leverage. Based on this, the tray stack retainer 35 and the fitting portion 21 are adapted to be deeply coupled with each other.
The sealing material 33 is provided between the lid 32 and the container body 31. The sealing material 33 is, as specifically illustrated in
The tray stack supporters 34 are members for supporting the tray stack 12. The tray stack supporters 34 are, as illustrated in
Between the tray stack 12 and the container body 31 (between the tray stack 12 and the container body 31 in a vertical direction in
Also, between the tray stack supporters 34 and the tray stack 12 in a state where the tray stack supporters 34 are separated, there are provided spaces for inserting the processing arm of the external equipment. Based on these spaces, it is adapted so that the processing arm of the external equipment is inserted between the tray stack supporters and the tray stack 12 to decouple and separate any of the loading trays 16 of the tray stack 12 at any position, and the thin plate inside the tray 16 is taken out, with the tray stack supporters 34 being separated.
Now, another example of the tray stack supporters 34 is illustrated in
As a slide mechanism for supporting the sliding of the tray stack supporters 34, a publicly known mechanism can be used. For example, as illustrated in
Also, as illustrated in
The tray stack retainers 35 are members for holding and supporting the tray stack 12 therebetween. The tray stack retainers 35 are, as illustrated in
The tray stack retainer 35 substantially consists of a base plate 61, an elastic support 62, and a curved fitting portion 63, as illustrated in
Based on this, the V-grooves 64 of the curved fitting portions 63 of the two tray stack retainers 35 on the bottom surface side inside the container body 31 and on the container body 31 of the lid 32 are respectively fitted onto the fitting portions 21 of the tray stack 12 to thereby elastically support the tray stack 12 while longitudinally, laterally and vertically aligning the tray stack 12 with respect to the external container 13. Regarding the tray stack retainer 35, the elastic support 62 is formed of a material such as a synthetic resin having elasticity. The curved fitting portion 63 is preferably molded from a material such as a hard synthetic resin so as to be firmly fitted onto the respective fitting portions 21 of the tray stack 12. The base plate 61 is only required to be made of a material capable of supporting the elastic support 62 and the curved fitting portion 63. Note that the elastic support 62 and the curved fitting portion 63 may be adapted to be firmly supported by a hard synthetic resin or the like. If the thin plate container 11 is frequently vibrated or shocked during transfer thereof, the elastic support 62, curved fitting portion 63, and the like are made elastic to elastically support the tray stack 12, and thereby the tray stack retainers 35 are adapted to absorb the external vibration or the like. If there is less vibration or the like, the elastic support 62, the curved fitting portion 63, and the like are formed of a hard material to firmly support the tray stack 12. Depending on a use mode, the hard or elastic material is used.
As illustrated in
The supporting part 68 is a member for supporting the lid 32. The supporting part 68 is provided on each of four sides of the lid receiving portion 31G of the container body 31. Note that the supporting part 68 is preferably provided on at least one of the four sides of the lid receiving portion 31G, which corresponds to a lower side when the container body 31 is turned sideways.
The supporting part 68 is formed in a wedge-like shape. In the center on an upper side of the supporting part 68, a protruding portion 70 is provided throughout the length of the supporting part 68. The protruding portion 70 is a portion for directly coming into abutting contact with the abutting part 69 to support it.
The abutting part 69 is a member for coming into abutting contact with the supporting part 68 to support the lid 32. The abutting parts 69 are provided at positions of four corners of a circumferential edge of the lid 32, which face to the supporting parts 68. The abutting parts 69 come into abutting contact with the supporting parts 68 of the container body 31 to support the lid 32. The abutting part 69 is formed in a curved shape so as to cover the corner of the lid 32.
Note that the door guide 67 may be adapted to be only provided with any one of the supporting part 68 or the abutting part 69.
The external container 13 is partially or wholly formed of an ESD or electrically conductive material. Also, a portion of the external container may be formed with a transparent window. The transparent window is a window for checking the internal tray stack 12. The transparent window may be provided at a position aligned with that of a transparent window of the loading tray 16 of the tray stack 12. Based on this, it can be checked through the transparent window of the external container 13 whether or not there is the tray stack 12 in the external container 13, and also the semiconductor waferr W can be checked through the transparent window of the external container 13 and that of the loading tray 16.
On an outer side of the sidewall 31A corresponding to a ceiling portion of the container body 31 being turned sideways, the grip mechanism 36 is removably fitted as illustrated in
On outer sides of the sidewalls 31C and 31D corresponding to lateral wall portions of the container body 31 being turned sideways, carrying handles (not shown) are removably fitted. It is adapted so that a worker grips the handles to lift the external container. Depending on the intended use, the handles are provided or not provided appropriately. Note that the handles may be integrally provided. The grip mechanism may also be integrally provided.
[Working]
The thin plate container 11 configured as above is used in a following manner.
The loading trays 16 of which the number corresponds to that of the semiconductor wafers W to be held are first stacked. On the first loading portion 18 of each of the loading trays 16, each of the semiconductor wafers W is loaded, and various pieces of information on each of the loading trays 16 and the corresponding semiconductor wafer W are recorded in the associated wireless tag. The loading trays 16 and the like are stacked and coupled with each other by the coupling/decoupling means 17 to configure the tray stack 12.
The tray stack 12 is inserted into the container body 31 of the external container 13, and supported from the both sides thereof by the tray stack supporters 34. Also, the lid receiving portion 31G of the container body 31 is fitted with the lid 32 automatically or manually, and the latch mechanism 41 constrains the lid 32 to the container body 31. Based on this, the two tray stack retainers 35 are fitted onto the fitting portions 21 of the tray stack 12 to accurately align the tray stack 12 longitudinally, laterally, and vertically in the container body 31 and support it. At this time, the tray stack 12 is kept in a slightly floating state with respect to the tray stack supporters 34. This makes a contact area small to thereby suppress dust generation due to friction. In addition, it may include the flanges 20A of the grips 20 brought into contact with and supported by the tray stack supporters 34 with the tray stack 12 being supported by the two tray stack retainers 35. If the support is given against the external vibration or shock, the floating state should be configured. If the firm support is given, a contact state should be configured.
In addition, if the tray stack 12 is housed in the external container 13, the base tray 15 is not necessarily present. To support upon taking in and taking out, only the lower base tray 15 may be provided.
In such state, the thin plate container 11 is delivered to a factory or the like. The thin plate container 11 can be loaded so as to face to any direction, such as sideways or lengthways. A plurality of the thin plate containers 11 may be stacked. In the factory or the like, the semiconductor wafers W in the thin plate container 11 are taken out. At this time, if the tray stack 12 is taken from the external container 13, the transfer arm 72 is inserted in a state illustrated in
Also, if the tray stack 12 is opened inside the container body 31 of the external container 13, opening/closing arms 73 are inserted with the tray stack 12 being supported by the transfer arm 72 as illustrated in
In addition, there may be a case where the semiconductor waferr W is taken in and out together with the loading tray 16, with the semiconductor waferr W being loaded on the loading tray 16, other than a case where the semiconductor waferr W is only taken in and out.
[Effect]
Based on the above, the thin plate container 11 produces the following effects.
The tray stack 12 for housing the semiconductor wafers W in the respective spaces between any adjacent two of the loading trays 16 is housed in the external container 13, i.e., the semiconductor wafers W are housed on the basis of the double structure, so that the semiconductor wafers W can be securely and firmly housed and supported.
The tray stack 12 for housing the semiconductor wafers W is housed in the external container 13, and the grips 20 of the loading trays 16 are gripped by the pair of tray stack supporters 34 to support the tray stack 12, so that the tray stack 12 housed in the external container 13 can be firmly supported. Also, it can be supported with being longitudinally, laterally, and vertically aligned. As a result, the semiconductor wafers W can be securely and firmly supported with the tray stack supporters 34 absorbing the external vibration or shock. Further, the inside of the external container 13 is sealed by the sealing material 33, so that the inside can be kept clean.
The spaces that are located between any adjacent two of the loading trays 16 coupled with each other in the tray stack 12 and intended for housing the semiconductor wafers W are airtightly retained, so that the semiconductor wafers W can be doubly sealed by the tray stack 12 and external container 13, and therefor sealing performance can be significantly improved. As a result, even if sealing performance of the external container 13 is reduced, the semiconductor wafers W can be kept clean.
Any adjacent two of the loading trays 16 are coupled with each other by the coupling/decoupling means 17 to hold the semiconductor wafers W with the semiconductor wafers W being loaded on the loading portions 18, so that any of the plurality of stacked loading trays 16 can be decoupled at any position by the coupling/decoupling means 17 to take in and out the semiconductor wafer W. As a result, workability of the work to take in and out the semiconductor wafers W is improved.
Any adjacent two of the loading trays 16, or the loading tray 16 and the base tray 15 are coupled with each other by the coupling/decoupling means 17 to hold the semiconductor wafers W with the semiconductor wafers W being loaded on the loading portions 18, so that any of the plurality of stacked loading trays 16 coupled with the base tray 15 can be decoupled at any position by the coupling/decoupling means 17 to take in and out the semiconductor wafer W. Also, in the tray stack 12 including the loading trays 16 and the base trays 15, the base trays 15 are fitted on the external equipment via the mechanical interface to support the tray stack 12 on the external equipment, so that the tray stack 12 can be easily and surely taken in and out of the external equipment.
The sealing material 24 is provided around the loading portion 18 of the loading tray 16, and the semiconductor waferr W housed on the loading portion 18 is airtightly isolated from an external environment with two of the loading trays 16 or the loading tray 16 and the base tray 15 being coupled with each other, so that the semiconductor wafers W can be kept clean. Also, the semiconductor wafers W can be doubly sealed in combination with the seal of the external container 13. As a result, even if the sealing performance of any one of the seals is reduced, the other one of the seals can keep the semiconductor wafers W clean.
The tray stack retainer 35 on the bottom surface inside the container body 31 and that 35 on the container body 31 of the lid 32 are fitted onto the fitting portions 21 of the respective loading trays 16 to support the tray stack 12 inserted into the container body 31 of the external container 13, so that the tray stack 12 can be stably and firmly supported inside the external container 13.
The abutting surfaces of the concave and convex portions of the tray stack retainers 35 and fitting portions 21 are formed so as to slope wedgewise, and the concave and convex portions are fitted to each other and deeply coupled, whereby the alignment corrections are made on the abutting surfaces, and the tray stack 12 is supported by the tray stack retainers 35, so that the tray stack 12 can be stably supported at a correct position in the external container 13.
The latch mechanism 41 presses and constrains the lid 32 to the container body 31, and deeply couples the tray stack retainers 35 and the fitting portions 21 with each other, with the lid 32 being fitted onto the container body 31 and the tray stack retainers 35 and the fitting portions 21 being fitted to each other, so that the tray stack 12 can be stably supported at a correct position in the external container 13.
The space for inserting the processing arm of the external equipment, and that for allowing the tray stack supported by the processing arm to be lifted are provided between the tray stack 12 and the container body 31, with the tray stack 12 being housed in the container body 31 and supported by the tray stack supporters 34, so that the processing arm of the external equipment can be inserted into the space and coupled with the tray stack 12 to lift the tray stack 12 and transfer it outside, and therefore taking in/out of the tray stack 12 is easily automated. As a result, the thin plate container can be simply used even in an automatically controlled manufacturing line.
The processing arm of the external equipment is inserted between the tray stack supporters 34 and the tray stack 12, and any of the loading trays 16 of the tray stack 12 is decoupled and separated at any position to take out the semiconductor waferr W inside the loading tray 16, with the tray stack supporters 34 being separated, so that the semiconductor wafers W can be taken in and out with the tray stack 12 being housed in the external container 13. As a result, the thin plate container can be used in an existing manufacturing line of an automated factory without modification.
The transfer arm of the transfer robot grips the grip mechanism 36 to lift and transfer the external container 13, so that the thin plate container can be used in the automated factory without modification.
The lid 32 is guided by the door guides 67 and then fitted onto the container body 31, as well as being supported so as not to be misaligned with respect to the container body 31, so that the lid 32 can be easily and accurately fitted onto the container body 31 and also supported stably against the external vibration or shock with the misalignment of the lid 32 being suppressed. As a result, the internal semiconductor wafers W can be protected, and the reduction in internal airtightness due to the misalignment of the lid 32 can be prevented.
The handles are provided on the external container 13, so that a worker can hold the handles to easily lift the external container 13, and therefore easily carry the container 13. Also, the attachment of dust onto the external container 13 due to charging, or the like can be prevented, so that the semiconductor wafers W can be kept clean. Further, the attachment of dust onto the loading trays 16 due to charging, or the like can be prevented, so that the semiconductor wafers W can be kept clean.
The external container 13 or the like is provided with the transparent window to be able to check the internal state, so that a situation where the worker carries an empty container or the like by mistake can be eliminated.
[Variations]
In the above-described embodiment, the two base trays 15 are provided above and below; however, only the lower one may be provided. Alternatively, only the upper one may be provided. If the tray stack 12 is supported from below, the base tray 15 is provided on the lower side. On the other hand, if the tray stack 12 is supported from above, the base trays 15 are provided above and below.
In the above-described embodiment, the fitting portions 21 or the like are formed in the wedge-like shape sharpened in the V-shape; however, they may be formed in another shape such as a cross-sectionally trapezoidal shape. It is only necessary to be a shape fittable to that of the counterportions. That is, one position where force is balanced in an alignment direction upon the fitting is only required to be present.
The loading tray 16 and the external container 13 may be formed of different materials portionially. For example, an ESD or electrically conductive material and a transparent material may be appropriately used. This enables adsorption of dust onto surfaces of the semiconductor wafers W to be prevented, and therefore the semiconductor wafers W can be kept clean. Also, the loading tray 16 and the like can be formed of various materials with a function of keeping the semiconductor wafers W clean being retained. As a result, various functions can be given on the loading plate portion 62 with the function of keeping the semiconductor wafers W clean, which is a basic function, being given on the loading tray 16, and therefore the loading tray 16 can be configured to be a tray provided with a wide variety of functions, and used for various applications depending on the functions.
The external container 13 may be provided with a breather valve or filter as necessary. If a change in atmospheric pressure is large upon transfer, the external container 13 is provided with the breather valve or filter.
The above-described embodiment is configured to doubly seal the tray stack 12 and external container 13; however, any one of them may be adapted to be sealed. In portionicular, the seal for the tray stack 12 is not provided in some cases. Such sealing configuration is made depending on required sealing performance.
The thin plate container 11 having the above-described embodiment can be used both for transfer and in factory.
In the above-described embodiment, the lid 32 is also provided with the tray stack retainer 35; however, regarding to the lid 32, a lower surface of the lid 32 may be concavely formed in accordance with the fitting portions 21.
Number | Date | Country | Kind |
---|---|---|---|
2006-038445 | Feb 2006 | JP | national |
Filing Document | Filing Date | Country | Kind | 371c Date |
---|---|---|---|---|
PCT/JP2007/002528 | 2/13/2007 | WO | 00 | 7/21/2008 |