Claims
- 1. A fire-resistant thin wall housing comprising a homogeneous polycarbonate resin comprising
- A) 5-50 parts by weight of a liquid crystal polymer,
- B) 90-40 parts by weight of a polycarbonate resin, produced by hot-melt polymerization of an aromatic dihydroxy compound and a diester carbonate, having phenolic and nonphenolic end groups and having an equivalence ratio of phenolic end group (I) and nonphenolic end group (II), (I)/(II), which is greater than 1/19,
- C) 2-20 parts by weight of a flame retardant, and
- D) 0.1-1.0 part by weight of polytetrafluoroethylene
- wherein the housing meets a UL-94 flame-retardant standard of at least V-II at a thickness of 1/16 inch and has a flexural modulus at least equal to the flexural modulus of a thin wall housing of substantially the same thickness which contains no flame retardant.
- 2. The housing of claim 1 wherein flame retardant C) is a phosphate compound.
- 3. The housing of claim 1 wherein flame retardant C) is a brominated epoxy.
- 4. The housing of claim 1 wherein flame retardant C) is a brominated polycarbonate.
- 5. The housing of claim 1 wherein flame retardant C) is a combination of a phosphate and a brominated epoxy or a brominated polycarbonate.
- 6. The housing of claim 1 wherein the liquid crystal polymer is a thermotropic liquid crystal polyester.
- 7. The housing of claim 6 wherein the polyester contains segments with the structure
- --O--R--O--,
- --CO--RCO-- or
- --O--R--CO--
- wherein R is selected from ##STR11##
- 8. The housing of claim 6 wherein the polyester contains segments with the structure --O--R--O--,
- --CO--RCO-- or
- --O--R--CO--
- wherein R is selected from ##STR12## and wherein the aromatic rings, aliphatic groups or alicyclic groups of R are substituted with --BR, --Cl, --COOH, --COHN.sub.2, --CH.sub.3, --C(CH3).sub.3, ##STR13## or combinations thereof.
- 9. The housing of claim 1 wherein the equivalence ratio is greater than 1/10.
- 10. The housing of claim 9 wherein the equivalence ratio is greater than 1/5.
- 11. The composition of claim 1 wherein the phenolic end group (I) has the formula ##STR14## and the nonphenolic end group (II) has the formula ##STR15## wherein R.sup.1 and R.sup.2 each represent a hydrogen atom, a linear or branched alkyl group with less than 20 carbons, unsubstituted or substituted with halogen atoms.
- 12. The housing of claim 1 wherein the polycarbonate resin comprises a branched polycarbonate.
- 13. The housing of claim 1 wherein the diester carbonate is diphenyl carbonate.
- 14. The housing of claim 1 wherein the aromatic dihydroxy compound is 2,2-bis(4-hydroxyphenyl)propane.
- 15. The housing of claim 14 wherein the diester carbonate is a combination of carbonates.
- 16. The housing of claim 14 wherein the diester carbonate is diphenyl carbonate.
- 17. The housing of claim 1, in which the flame retardant C) is one, or a combination, of a) phosphate compounds, b) brominated epoxies, or c) brominated polycarbonates.
- 18. A fire-resistant thin wall housing consisting essentially of a homogeneous polycarbonate resin consisting essentially of
- A) 5-50 parts by weight of a liquid crystal polymer,
- B) 90-40 parts by weight of a polycarbonate resin, produced by hot-melt polymerization of an aromatic dihydroxy compound and a diester carbonate, having phenolic and nonphenolic end groups and having an equivalence ratio of phenolic end group (I) and nonphenolic end group (II), (I)/(II), which is greater than 1/19,
- C) 2-20 parts by weight of a flame retardant, and
- D) 0.1-1.0 part by weight of polytetrafluoroethylene
- wherein the housing meets a UL-94 flame-retardant standard of at least V-II at a thickness of 1/16 inch and has a flexural modulus at least equal to the flexural modulus of a thin wall housing of substantially the same thickness which contains no flame retardant.
- 19. The housing of claim 18 which is a computer housing.
- 20. The housing of claim 18 which is a case for a small portable machine.
Priority Claims (1)
Number |
Date |
Country |
Kind |
6-142627 |
May 1994 |
JPX |
|
Parent Case Info
This is a continuation of application Ser. No. 08/443,971 filed on May 18, 1995, now abandoned.
US Referenced Citations (9)
Foreign Referenced Citations (6)
Number |
Date |
Country |
0 265 791 |
May 1988 |
EPX |
0 389 055 |
Sep 1990 |
EPX |
0 434 998 |
Jul 1991 |
EPX |
0 605 157 |
Jul 1994 |
EPX |
0 297 353 |
Jan 1989 |
DEX |
40 40 243 A1 |
Dec 1990 |
DEX |
Non-Patent Literature Citations (2)
Entry |
WO-A-93 18090 (The Dow Chemical Comp) Sep. 16, 1993. |
Chemical Abstracts, vol. 118, No. 10, Mar. 1993 Abstracts No. 82164, Abstract JP-A-04-225 054 Aug. 14, 1992. |
Continuations (1)
|
Number |
Date |
Country |
Parent |
443971 |
May 1995 |
|