Patent Application
20250189239
This disclosure is directed to a three-dimensional vapor chamber device, particularly directed to a three-dimensional vapor chamber device having a vertical thermal plate, the vertical thermal plate has a flow channel structure capable of guiding a working fluid to flow along a specific path.
A related art three-dimensional vapor chambers generally has a base plate and a vertical plate up-right arranged on the base plate. The base plate and the vertical plate are hollow and communicated to each other. A liquid working fluid accommodated in the base plate. When the base plate is contacts a heat source and absorbs heat, the liquid working fluid in the base plate is vaporized to diffuse into the vertical plate and falls into the base plate after cooling. According to the related art three-dimensional vapor chamber, the diffusion of the vaporized working fluid and the returning of the liquid working fluid are performed in the same space in the vertical plate, and the working fluids at different temperatures are mixed so that the heat flowing back to the heat source. Therefore, a heat dissipation performance of the related art three-dimensional vapor chamber is not effective.
This disclosure is directed to a three-dimensional vapor chamber device having a vertical thermal plate, which has a flow channel structure capable of guiding a working fluid to flow along a specific path.
This disclosure is directed to a three-dimensional vapor chamber device having a thermal conductive base, a vertical thermal plate and a working fluid. The thermal conductive base has a heat exchanging surface and a heat defusing surface opposite to the heat exchanging surface, a heat exchanging area is defined on the heat exchanging surface, a first chamber is defined in the thermal conductive base, and a first capillary structure is attached on an internal surface of the first chamber. The vertical thermal plate is up-right disposed on the heat defusing surface. A second chamber is defined in the vertical thermal plate, a second capillary structure is attached on an internal surface of the second chamber, the first chamber communicates with the second chamber through an inlet and a return port, a flow channel structure is defined in the second chamber, the flow channel structure communicates between the inlet and the return port. The working fluid is accommodated in the first chamber and capable of flowing to the second chamber through the inlet, passing the flow channel structure and flowing back to the first chamber through the return port.
In an embodiment, a flow resistance of the working fluid from the heat exchanging area to the return port is greater than a flow resistance of the working fluid from the heat exchanging area to the inlet. A distance between the heat exchanging area and the inlet is less than a distance between the heat exchanging area and the return port. A resistance structure is arranged at the return port. The resistance structure has a plurality of pores. The resistance structure is extended from the first capillary structure.
In an embodiment, the three-dimensional vapor chamber device further has a fin assembly, and the fin assembly disposed on an external surface of the vertical thermal plate. The vertical thermal plate has an extended segment, the extended segment is parallel to the heat defusing surface, and the fin assembly arranged on the extended segment.
In an operating status of the three-dimensional vapor chamber device according to this disclosure, the working fluid is vaporized at the heat exchanging area by heat absorbed from a heat source, the vaporized working fluid flows into the vertical thermal plates so as to transfer the heat to the fin assembly, and the heat is further dissipated to environment air. A period of the working fluid lingering in the vertical thermal plates is extended by the flow channel structures so as to enhance the heat exchanging of the working fluid in the vertical thermal plates. Moreover, a flow resistance of the working fluid from the heat exchanging area to the return port is greater than a flow resistance of the working fluid from the heat exchanging area to the inlet, and this arrangement leads to a flow of the working fluid along a specific path namely far from the heat source. Accordingly, the working fluid is guided by the flow channel structure to bring the heat away from the heat exchanging area, where the heat source is located. The working fluid has a specific flow path, thereby having a better and more stable heat transfer efficient.
The features of the disclosure believed to be novel are set forth with particularity in the appended claims. The disclosure itself, however, may be best understood by reference to the following detailed description of the disclosure, which describes a number of exemplary embodiments of the disclosure, taken in conjunction with the accompanying drawings, in which:
The technical contents of this disclosure will become apparent with the detailed description of embodiments accompanied with the illustration of related drawings as follows. It is intended that the embodiments and drawings disclosed herein are to be considered illustrative rather than restrictive.
According to
According to this embodiment, the thermal conductive base 100 is a hollow plate having a plurality of housing parts assembled with each other, but scopes of this disclosure should not be limited to this embodiment. The thermal conductive base 100 has a heat exchanging surface 111 and a heat defusing surface 112 opposite to the heat exchanging surface 111, and at least one heat exchanging area 102 for contacting with a heat source is defined on the heat exchanging surface 111. According to this embodiment, a plurality of heat exchanging areas 102,102a are defined on the heat exchanging surface 111 for contacting a plurality of heat sources, but scopes of this disclosure should not be limited to this embodiment. A first chamber 101 is defined in the thermal conductive base 100, and a first capillary structure 121 is attached on an internal surface of the first chamber 101. The first capillary structure 121 has a plurality of pores, and the pores may generate capillary force for transferring liquid working fluid 400. According to this embodiment, the first capillary structure 121 is made of sintered metal powder and therefore having the plurality of pores, but scopes of this disclosure should not be limited to this embodiment. For example, other feasible approaches to form the pores in the first capillary structure 121 may be woven copper mesh, metal fiber or etching.
According to
The three-dimensional vapor chamber device according to this disclosure further has at least one fin assembly 300, the fin assembly 300 is arranged on an external surface of the vertical thermal plate 200/200a. According to this embodiment, the three-dimensional vapor chamber device further has a plurality of fin assemblies 300 and the fin assemblies 300 are respectively arranged on the external surface of the vertical thermal plates 200, 200a corresponding thereto. The fin assembly 300 is capable of exchanging heat with the environment air.
According to
According to this embodiment, correspondingly, a distance between the heat exchanging area 102/102a and the inlet 211/211a is less than a distance between the heat exchanging area 102/102a and the return port 212/212a, so that a flow resistance of the vaporized working fluid 400a from the heat exchanging areas 102/102a to the return ports 212b/212c is greater than a flow resistance of the vaporized working fluid 400a from the heat exchanging areas 102/102a to the inlet 211b/211c. A resistance structure 122/122a is disposed at each return port 212/212a, so that a flow resistance of the vaporized working fluid 400a from the heat exchanging area 102/102a toward the return port 212/212a is greater than a flow resistance of the vaporized working fluid 400a from the heat exchanging areas 102/102a toward the inlet 211/211a. The resistance structures 122, 122a may be made of sintered metal powder and therefore having the plurality of pores therein, and the resistance structures 122, 122a may be extended from the first capillary structure 121.
In an operated status of the three-dimensional vapor chamber device according to this disclosure, the liquid working fluid 400a may be vaporized by heat absorbed from the heat source at the heat exchanging areas 102, 102a respectively, the vaporized working fluid 400a flows into the vertical thermal plates 200, 200a to transfer the heat to the air fin assembly 300 and dissipate it to the environment. A period of the vaporized working fluid 400a lingering in the vertical thermal plate 200/200a is extended by the flow channel structure 210/210a so as to enhance the heat exchanging of the vaporized working fluid 400a in the vertical thermal plates 200, 200a. Moreover, a flow resistance of the working fluid 400a from the heat exchanging area 102/102a to the return port 212/212a is larger than the flow resistance of the working fluid 400a from the heat exchanging area 102/102a to the inlet 211, and this arrangement make the working fluid 400a to correspondingly flows in to the vertical thermal plates 200/200a via the inlets 211/211a and pass the flow channel structure 210/210a along a specific path namely away from the heat source, so that the working fluid 400a may be guided by the flow channel structure 210/210a to bring the heat away from the heat exchanging area 102, where the heat source is located.
According to
According to this embodiment, the thermal conductive base 100 is a hollow plate having a plurality of housing parts assembled with each other, but scopes of this disclosure should not be limited to this embodiment. The thermal conductive base 100 has a heat exchanging surface 111 and a heat defusing surface 112 opposite to the heat exchanging surface 111, and a heat exchanging area 102 for contacting with a heat source is defined on the heat exchanging surface 111. A first chamber 101 is defined in the thermal conductive base 100, and a first capillary structure 121 is attached on an internal surface of the first chamber 101. The first capillary structure 121 is made of sintered metal powder and therefore having the plurality of pores.
According to this embodiment, the vertical thermal plates 200b/200c are hollow plates, and the vertical thermal plates 200b,200c are respectively combined with one of housing parts of the thermal conductive base 100, but scopes of this disclosure should not be limited to this embodiment. The vertical thermal plate 200b,200c are up-right arranged on the heat defusing surface 112 of the thermal conductive base 100, and a second chamber 201/201a is defined in each vertical thermal plate 200b/200c. A second capillary structure 221b/221c is attached on an internal surface of each second chamber 201b/201c, each second capillary structure 221b/221c is made of sintered metal powder and therefore having the plurality of pores. The first chamber 101 respectively communicates to each second chamber 201b/201c through an inlet 211b/211c and a return port 212b/212c. A flow channel structure 210b/210c is defined in each second chamber 201b/201c, and each flow channel structures 210b/210c is correspondingly connected between inlet 211b/211c of the second chamber 201b/201c and the return ports 212b/212c.
The three-dimensional vapor chamber device according to this disclosure further has at least one fin assembly 300/300a, the fin assembly 300/300a is arranged on an external surface of the vertical thermal plate 200b/200c. According to this embodiment, the three-dimensional vapor chamber device further has a plurality of fin assemblies 300, 300a, and the fin assemblies 300, 300a are respectively arranged on the external surfaces of the vertical thermal plate 200b/200c corresponding thereto. The vertical thermal plate 200b/200c may has an extended segment 230b/230c, the extended segment 230b/230c is parallel to the heat defusing surface 112, some of the fin assemblies 300a are respectively arranged on the extended segments 230b/230c corresponding thereto. The extended segment 230b/230c provides a space allowing another fin assembly 300a additionally arranged in a direction parallel to the thermal conductive base 100 so as to improve a heat exchange efficiency between the three-dimensional vapor chamber device and the environment air.
The liquid working fluid 400 accommodated in the first chamber 101 may be vaporized to flow to the second chambers 201b, 201c through the inlets 211b/211c, pass the flow channel structure 210b/210c, and then flow back to the first chamber 101 through the return ports 212b/212c, respectively. A flow resistance of the vaporized working fluid 400a from the heat exchanging area 102 to the return ports 212b/212c is greater than a flow resistance of the vaporized working fluid 400a from the heat exchanging area 102 to the inlet 211b/211c, so that the vaporized working fluid 400a flows toward the inlet 211b/211c corresponding thereto and enter the vertical thermal plate 200b/200c corresponding thereto.
According to this embodiment, a distance between the heat exchanging area 102 and each of the inlets 211b/211c is less than a distance between the heat exchanging area 102 and each of the return ports 212b/212c correspondingly, so that the flow resistances of the vaporized working fluid 400a from the heat exchanging area 102 to the return ports 212b/212c is greater than the flow resistances of the vaporized working fluid 400a from the heat exchanging area 102 to the inlets 211b/211c. A resistance structure 122b/122c is disposed at each return port 212b/212c, so that a flow resistance of the vaporized working fluid 400a from the heat exchanging area 102 toward the return ports 212b/212c is greater than a flow resistance of the vaporized working fluid 400a from the heat exchanging area 102 toward the inlets 211b/211c. The resistance structure 122b/122c may be made of sintered metal powder and therefore having the plurality of pores, and the resistance structure 122b/122c may be extended from the first capillary structure 121.
In an operating status of the three-dimensional vapor chamber device according to this disclosure, the liquid working fluid 400 is vaporized at the heat exchanging area 102 by heat absorbed from a heat source, the vaporized working fluid 400a flows into the vertical thermal plates 200b/200c so as to transfer the heat to the fin assembly 300/300a, and the heat is further dissipated to environment air. A period of the vaporized working fluid 400a lingering in the vertical thermal plate 200b/200c is extended by the flow channel structures 210b/210c so as to enhance the heat exchanging of the vaporized working fluid 400a in the vertical thermal plates 200b, 200c. Moreover, a flow resistance of the vaporized working fluid 400a from the heat exchanging area 102 to the return port 212b/212c is greater than a flow resistance of the vaporized working fluid 400a from the heat exchanging area 102 to the inlet 211b/211c, and this arrangement leads to a flow of the vaporized working fluid 400a along a specific path namely away from the heat source. Accordingly, the vaporized working fluid 400a is guided by the flow channel structures 210b, 210c to bring the heat away from the heat exchanging area 102, where the heat source is located. The working fluid has a specific flow path, thereby having a better and more stable heat transfer efficiency.
