Patent Application
20250224182
This application claims priority to Taiwan Application Serial Number 113100763, filed Jan. 8, 2024, the disclosures of which are incorporated herein by reference in their entireties.
The present disclosure relates to a vapor chamber. More particularly, the present disclosure relates to a three-dimensional vapor chamber.
With the advancement of science and technology, the computing power of the electronic devices is increasing day by day, and the temperature control of electronic components such as processors of the electronic devices is becoming more and more important. Especially, when the computing speed of the working chip in the electronic devices such as mobile phones, tablets, and notebook computers, continues to increase, the ambient temperature of the system of the electronic device may also increase, but the system stability may therefore reduce.
In order to solve the foregoing problem, various heat dissipation devices such as the heat pipes and vapor chambers are adopted to dissipate heat generated by the working chip, so that the heat of the working chip may be quickly discharged from the system of the electronic devices such as mobile phones, tablets, laptop computers or any electronic devices with higher source, e.g. server computers, network devices or wireless transmission devices, so as to control the temperature within the system and further maintain the system stability.
The three-dimensional vapor chamber combined the vapor chamber and the heat pipe may be connected to the heat source that needs to dissipate heat, and connected to the heat sink fins or other heat dissipation devices to transfer the heat to the heat sink fins or other heat dissipation devices using the three-dimensional vapor chamber so as to take the heat out of the electronic devices such as mobile phones, tablets, laptops and any electronic devices with higher source, thereby improving the working reliability of the electronic components.
Therefore, there is a need to improve the heat dissipation efficiency of the three-dimensional vapor chamber so as to improve the working efficiency of the processors and the electronic devices.
The summary of the present invention is intended to provide a simplified description of the disclosure to enable readers to have a basic understanding of the disclosure. The summary of the present invention is not a complete overview of the disclosure, and it is not intended to point out the importance of the embodiments/key elements of the present invention or define the scope of the invention.
One objective of the embodiments of the present invention is to provide a three-dimensional vapor chamber to improve the heat dissipation efficiency of the vapor chamber.
To achieve these and other advantages and in accordance with the objective of the embodiments of the present invention, as the embodiment broadly describes herein, the embodiments of the present invention provides a three-dimensional vapor chamber including a vapor chamber module and a heat pipe capillary structure. The vapor chamber module includes an upper shell structure, and the upper shell structure includes an upper shell body and an upper shell capillary structure formed in the upper shell body. The heat pipe module is fixed on the vapor chamber module and in fluid communication with the vapor chamber module. In addition, the heat pipe module includes a heat pipe shell fixed on the upper shell body and a heat pipe capillary structure formed in the heat pipe shell and connected to the upper shell capillary structure.
In some embodiments, the upper shell body includes an upper shell main body and a raised joint portion. The raised joint portion is formed in the upper shell main body, and the heat pipe shell arranged to pass through the raised joint portion.
In some embodiments, the heat pipe shell includes a heat pipe main body and an expansion joint portion. The expansion joint portion is connected to the heat pipe main body and engaged with the raised joint portion of the upper shell body.
In some embodiments, the upper shell capillary structure includes an upper shell main capillary structure and an upper shell raising capillary structure. The upper shell main capillary structure is formed on an interior surface of the upper shell main body and the upper shell raising capillary structure is connected to the upper shell main capillary structure and formed inside the raised joint portion.
In some embodiments, the heat pipe capillary structure includes a heat pipe main capillary structure and a heat pipe expansion capillary structure. The heat pipe main capillary structure is formed on an interior surface of the heat pipe main body, and the heat pipe expansion capillary structure is connected to the heat pipe main capillary structure and formed inside the expansion joint portion.
In some embodiments, an end face of the upper shell raising capillary structure is connected to end faces of the heat pipe expansion capillary structure and the expansion joint portion.
In some embodiments, the heat pipe expansion capillary structure is embedded in the upper shell raising capillary structure.
In some embodiments, the heat pipe expansion capillary structure is engaged between the upper shell raising capillary structure and the expansion joint portion.
In some embodiments, the upper shell raising capillary structure is engaged between the heat pipe expansion capillary structure and the raised joint portion.
In some embodiments, the upper shell body further includes a joint flange connected to the raised joint portion and engaged with the expansion joint portion of the heat pipe shell.
In some embodiments, a part of the heat pipe expansion capillary structure of the heat pipe capillary structure is connected to the upper shell raising capillary structure of the upper shell capillary structure.
In some embodiments, the vapor chamber module further includes a lower shell structure closely connected to the upper shell structure, and the lower shell structure includes a lower shell body and a lower shell capillary structure formed on an interior surface of the lower shell body, and a peripheral area of the upper shell capillary structure is connected to the lower shell capillary structure.
Therefore, according to the structures of the above three-dimensional vapor chambers of the present invention, the three-dimensional vapor chamber may utilize the heat pipe expansion capillary structure of the heat pipe capillary structure to partially or annularly connect to the upper shell raising capillary structure of the upper shell capillary structure to increase the flowing efficiency of the cooling fluid and improve the heat dissipation efficiency of the three-dimensional vapor chamber.
The disclosure can be more fully understood by reading the following detailed description of the embodiment, with reference made to the accompanying drawings as follows:
The following is a detailed description of the embodiments in conjunction with the accompanying drawings, but the provided embodiments are not intended to limit the scope of the disclosure, and the description of the structure and operation is not used to limit the execution sequence thereof. The structure of the recombination of components and the resulting devices with equal functions are all within the scope of this disclosure. In addition, the drawings are for illustration purposes only, and are not drawn according to the original scale. For ease of understanding, the same reference numbers are used in the drawings and the description to refer to the same or like parts.
In addition, the terms used in the entire description and the scope of the patent application, unless otherwise specified, usually have the usual meaning of each term used in this field, in the content disclosed here and in the special content. Some terms used to describe the disclosure are discussed below or elsewhere in this specification to provide additional guidance to those skilled in the art in the disclosure.
In the implementation mode and the scope of the present application, unless the article is specifically limited in the context, “a” and “the” can generally refer to a single or pluralities. In the steps, the numbering is only used to conveniently describe the steps, rather than to limit the sequence and implementation.
Secondly, the words “comprising”, “including”, “having”, “containing” and the like used in the present application are all open language, meaning including but not limited to.
Referring to
In addition, the heat pipe module 106 is fixed on the vapor chamber module 102 and is in fluid communication with the vapor chamber module 102 to allow the cooling fluid flowing between the vapor chamber module 102 and the heat pipe module 106. In addition, the heat pipe module 106 includes a heat pipe shell 130 fixed on the upper shell body 120 and a heat pipe capillary structure 160 formed in the heat pipe shell 130 and connected to the upper shell capillary structure 150. In addition, the heat pipe shell 130 and the heat pipe capillary structure 160 may be integrally formed, or may be independently formed and assembly together. In some embodiments, the heat pipe shell 130 can be formed first and then the heat pipe capillary structure 160 is formed in the heat pipe shell 130, for example, through a sintering process or a bonding process, without departing from the spirit and protection scope of the present invention.
In some embodiments, the lower shell body 110 and the upper shell body 120 are sealed to form a sealed chamber and the cooling fluid is disposed in the sealed chamber to cool a heat source. The heat pipe shell 130 is fixed on the upper shell body 120 and is in fluid communication with the sealed chamber to allow the cooling fluid flowing between the heat pipe shell 130 and the sealed chamber between the lower shell body 110 and the upper shell body 120.
In addition, an upper shell capillary structure 150 is formed on the interior surface of the upper shell body 120, a heat pipe capillary structure 160 is formed in the heat pipe shell 130, and the heat pipe capillary structure 160 is connected to the upper shell capillary structure 150 to increase the flowing velocity and efficiency of the cooling fluid in the three-dimensional vapor chamber 100 so as to improve the heat dissipation efficiency of the three-dimensional vapor chamber 100.
In addition, a lower shell capillary structure 140 is formed on the interior surface of the lower shell body 110 to increase the flowing velocity and efficiency of the cooling fluid in the three-dimensional vapor chamber 100. In some embodiments, the peripheral area 156 of the upper shell capillary structure 150 is preferably connected to the lower shell capillary structure 140 to increase the flowing velocity and efficiency of the cooling fluid.
In some embodiments, the lower shell body 110 and the upper shell body 120 may be sealed together through brazing, soldering, high-frequency welding, laser welding, and resistance welding. In some embodiments, an adhesive may also be used to seal the lower shell body 110 and the upper shell body 120.
Simultaneously referring to
In some embodiments, the heat pipe shell 130 includes a heat pipe main body 132 and an expansion joint portion 134. The expansion joint portion 134 is connected to the heat pipe main body 132, and the expansion joint portion 134 is engaged with the raised joint portion 124 of the upper shell body 120 to closely connect the heat pipe shell 130 to the upper shell body 120.
In some embodiments, the heat pipe shell 130 and the upper shell body 120 may be sealed together through brazing, soldering, high-frequency welding, laser welding, and resistance welding. In some embodiments, an adhesive may also be used to seal the heat pipe shell 130 and the upper shell body 120.
In some embodiments, the upper shell capillary structure 150 includes an upper shell main capillary structure 152 and an upper shell raising capillary structure 154. The upper shell main capillary structure 152 is formed on the interior surface of the upper shell main body 122. The upper shell raising capillary structure 154 is connected to the upper shell main capillary structure 152 and is formed inside the raised joint portion 124.
In addition, the heat pipe capillary structure 160 includes a heat pipe main capillary structure 162 and a heat pipe expansion capillary structure 164. The heat pipe main capillary structure 162 is formed on the interior surface of the heat pipe main body 132. The heat pipe expansion capillary structure 164 is connected to the heat pipe main capillary structure 162 and formed inside the expansion joint portion 134.
Further referring to
Referring to
Further referring to
In addition, referring to
In some embodiments, referring to
In some embodiments, it is worth noting that, the upper shell body 120 further includes a joint flange 126 connected to the raised joint portion 124 to engaged with the expansion joint portion 134 of the heat pipe shell 130. In some embodiments, the inner diameter of the joint flange 126 is approximately equal to the outer diameter of the heat pipe main body 132, for example, 2 mm or above, to effectively transmit the cooling fluid and improve the working efficiency.
In addition, in some embodiments, the heat pipe expansion capillary structure 164 of the heat pipe capillary structure 160 is connected to the upper shell raising capillary structure 154 of the upper shell capillary structure 150 all around, for example, connected in an annular shape to increase heat dissipation efficiency.
In some embodiments, the annular perimeter of the heat pipe expansion capillary structure 164 of the heat pipe capillary structure 160 is not completely connected to the upper shell raising capillary structure 154 of the upper shell capillary structure 150. That is to say, only a part of the heat pipe expansion capillary structure 164 of the heat pipe capillary structure 160 is connected to the upper shell raising capillary structure 154 of the upper shell capillary structure 150, and therefore only some positions of the heat pipe expansion capillary structure 164 of the heat pipe capillary structure 160 are connected to the upper shell raising capillary structure 154 of the upper shell capillary structure 150 to conveniently manufacture the three-dimensional vapor chamber 100 and also improve the heat dissipation efficiency of the three-dimensional vapor chamber 100.
In some embodiments, the heat pipe expansion capillary structure 164 and the upper shell raising capillary structure 154 are connected together by a single or multiple point connection, line connection, surface connection, end face connection or overlapping connection, or a full circumference connection, without departing from the spirit and protection scope of the present invention.
In some embodiments, the heat pipe capillary structure 160 and the upper shell capillary structure 150 may include, but are not limited to, porous capillary structure, powder sintered capillary structure, fine groove capillary structure, braided mesh capillary structure, braided strip capillary structure, any material with the capillary phenomena, or a composite capillary structure including any of the above, without departing from the spirit and protection scope of the present invention.
Hence, according to the structures of the above three-dimensional vapor chambers of the present invention, the three-dimensional vapor chamber may utilize the heat pipe expansion capillary structure of the heat pipe capillary structure to partially or annularly connect to the upper shell raising capillary structure of the upper shell capillary structure to increase the flowing efficiency of the cooling fluid and improve the heat dissipation efficiency of the three-dimensional vapor chamber.
Although the present disclosure has been disclosed above in terms of implementation, it is not intended to limit the present disclosure. Any person with ordinary knowledge in the field may make various variations and modifications without departing from the spirit and scope of the disclosure. Therefore, the spirit and scope of the appended claims should not be limited to the description of the embodiments contained herein.
| Number | Date | Country | Kind |
|---|---|---|---|
| 113100763 | Jan 2024 | TW | national |
