Patent Application
20110108261
The present invention relates to a three-layered cold/hot controller including a semiconductor plate used for heat exchange when being electrified, where the semiconductor plate is combined with two metal plates for increasing or decreasing temperature rapidly. The three-layered cold/hot controller has simple structure and is compact, highly stable, and suitable for various electrical products.
With the rapid development of technology in modern times, various electrical products (such as personal computers, notebook computers, or other household appliances in daily lives) are essential to the lives of human beings. No matter being at work or at home, people spend more time to use electrical products.
Since the tendency is to make electrical products lighter, thinner, shorter, and smaller, the requirements for the extent of precision or size of various elements or processing apparatus become much stricter. In addition to being designed for protecting structure and providing appealing appearance for attracting consumers to purchase, the outer casings of various electrical products are also designed for heat dissipation.
For electrical products, heat is typically dissipated into internal space thereof or dissipated into outer environment. As shown in
An object of the present invention is to provide a three-layered cold/hot controller, which has simple structure and is compact and highly stable.
In order to achieve above object, the present invention provides a three-layered cold/hot controller comprising a semiconductor plate, a first metal plate, and a second metal plate. The semiconductor plate has a top and a bottom contact surface and is connected with a power source. When the semiconductor plate is electrified, the top contact surface of the semiconductor plate forms a contact surface for decreasing temperature while the bottom contact surface of the semiconductor plate forms a contact surface for elevating temperature. The first metal plate is combined to the top contact surface of the semiconductor plate for conducting the heat between the first metal plate and the top contact surface. The second metal plate is combined to the bottom contact surface of the semiconductor plate for conducting the heat between the second metal plate and the bottom contact surface.
In practice, the first and the second metal plates are copper alloy plates with high thermal conductivity coefficient.
In practice, the second metal plate is further connected with a heat dissipation device thereon and the heat dissipation device is at least a heat sink made of aluminum alloy.
The following detailed description, given by way of examples or embodiments, will best be understood in conjunction with the accompanying drawings.
Please refer to
The semiconductor plate 1 has a top contact surface 11 and a bottom contact surface 12 and is connected with a power source 4. When the semiconductor plate 1 is electrified, the top contact surface 11 of the semiconductor plate 1 forms a contact surface for decreasing temperature while the bottom contact surface 12 of the semiconductor plate 1 forms a contact surface for elevating temperature. The first metal plate 2 is combined to the top contact surface 11 of the semiconductor plate 1 for conducting the heat between the first metal plate 2 and the top contact surface 11. The second metal plate 3 is combined to the bottom contact surface 12 of the semiconductor plate 1 for conducting the heat between the second metal plate 3 and the bottom contact surface 12. Besides, the first and the second metal plates 2, 3 are all copper alloy plates with high thermal conductivity coefficient.
Therefore, in practice, a semiconductor plate 1 is taken first. The top contact surface 11 of the semiconductor plate 1 forms a contact surface for decreasing temperature and is combined with the first metal plate 2. The bottom contact surface 12 of the semiconductor plate 1 forms a contact surface for elevating temperature and is combined with the second metal plate 3. Consequently, when the semiconductor plate 1 is electrified, heat will be conducted between the first, second metal plates 2, 3 and the top, bottom contact surfaces 11, 12. There would be a temperature decrease of about 65˜70° C. on the first metal plate 2 and a temperature increase of about 80˜100° C. on the second metal plate 3. Accordingly, when the three-layered cold/hot controller of the present invention is used for heat dissipation of CPU5 in a computer, where the first metal plate 2 is in direct contact with the CPU5, the heat produced from the CPU5 can be dissipated via the first metal plate 2. In other words, the heat produced from the CPU5 can be neutralized on the first metal plate 2 to fulfill the heat dissipation purpose. On the contrary, if it is required to elevate the temperature of an electrical product, the temperature of the electrical product can be elevated rapidly by contacting the electrical product directly with the second metal plate 3.
Moreover, as shown in
Therefore, the present invention has following advantages:
As disclosed in the above description and attached drawings, the present invention can provide a three-layered cold/hot controller. It is new and can be put into industrial use.
Although the embodiments of the present invention have been described in detail, many modifications and variations may be made by those skilled in the art from the teachings disclosed hereinabove. Therefore, it should be understood that any modification and variation equivalent to the spirit of the present invention be regarded to fall into the scope defined by the appended claims.
