Patent Application
20230193473
Titanium contacts can be used to provide electrically conductive connections to silicon germanium (SiGe) or silicon source/drain regions of field-effect transistors. Titanium contacts have an associated parasitic resistance that, if large enough, can affect transistor performance.
The source/drain regions of PMOSFETs (p-type metal-oxide-silicon field-effect transistors (FETs)) can comprise p-type silicon germanium (SiGe) layers epitaxially grown on a bulk silicon, silicon-on-insulator or another suitable substrate. Silicon germanium source/drain regions can introduce strain into the channel region of a MOSFET and the induced strain can cause the silicon atoms in the channel to stretch further apart than they would be in the absence of strain. This increased atomic spacing results in increased charge carrier mobility in the channel region, which can translate into increased transistor drive current.
The formation of a titanium contact to a silicon germanium layer can comprise the formation of a titanium silicide layer positioned adjacent to the silicon germanium layer. The titanium silicide aids in forming a titanium contact with low electrical resistance. In existing processes, the titanium silicide can be formed using a salicide process in which the silicon used to form the titanium silicide comes from the silicon germanium layer.
Titanium contacts formed via a process that comprises forming a titanium layer on crystalline silicon germanium can be thermally unstable in that their resistance (contact resistance) increases after being subjected to subsequent annealing and other high-temperature processing steps that occur in a semiconductor device manufacturing process after contact formation. The back end of line (BEOL) portion of a semiconductor device manufacturing process can involve numerous annealing and other high-temperature processing steps, the cumulative effect of which can cause titanium contact resistance to increase by more than 50% in some cases. The creation of voids in the silicon germanium layer at the titanium silicide-silicon germanium interface during the annealing and other high-temperature processing steps is understood to be at least partially responsible for titanium contact thermal instability. The increased resistance of titanium contacts due to their thermal instability can impact the performance of transistors having silicon germanium layer source/drain regions.
Described herein are titanium contacts in which contact formation comprises the formation of a titanium silicide layer from a titanium layer in which the silicon for the titanium silicide layer is provided by exposure of the titanium layer to a silicon precursor, such as silane (disilane, trisilane, etc.) at an elevated temperature. A titanium silicide layer formed as such can help limit the amount of titanium and germanium interdiffusion that can occur at the titanium silicide-silicon germanium interface (and the resulting formation of voids in the silicon germanium layer) during subsequent annealing and other high-temperature processing steps. A titanium silicide formation process that does not scavenge silicon from a silicon germanium layer adjacent to a titanium layer can further reduce the creation of voids in the silicon germanium. Moreover, a surface region of a silicon germanium layer upon which a titanium layer is formed as part of a contact formation process can be preamorphized via boron and germanium implantation to further improve the robustness of the SiGe layer against microvoid development in subsequent annealing processing steps. The titanium contacts formed as described herein are thermally stable in that their resistance remains substantially unchanged after being subjected to downstream annealing and other high-temperature processes.
In the following description, specific details are set forth, but embodiments of the technologies described herein may be practiced without these specific details. Well-known circuits, structures, and techniques have not been shown in detail to avoid obscuring an understanding of this description. Phrases such as “an embodiment,” “various embodiments,” “some embodiments,” and the like may include features, structures, or characteristics, but not every embodiment necessarily includes the particular features, structures, or characteristics.
Some embodiments may have some, all, or none of the features described for other embodiments. “First,” “second,” “third,” and the like describe a common object and indicate different instances of like objects being referred to. Such adjectives do not imply objects so described must be in a given sequence, either temporally or spatially, in ranking, or any other manner. “Connected” may indicate elements are in direct physical or electrical contact with each other and “coupled” may indicate elements co-operate or interact with each other, but they may or may not be in direct physical or electrical contact. Furthermore, the terms “comprising,” “including,” “having,” and the like, as used with respect to embodiments of the present disclosure, are synonymous. synonymous.
Terms modified by the word “substantially” include arrangements, orientations, spacings, or positions that vary slightly from the meaning of the unmodified term. For example, the portion of a first layer or feature that is substantially perpendicular to a second layer or feature can include a first layer or feature that is +/−20 degrees from a second layer or feature, a first surface that is substantially parallel to a second surface can include a first surface that is within several degrees of parallel from the second surface, a volume that is substantially filled by a via can comprise voids in the via, and a first edge that is substantially aligned with a second edge can be misaligned on the order of ones of nanometers, a contact resistance value that is substantially unchanged after one or more annealing processes include contact resistance values that change by 5% or less relative to their value prior to being subjected to one or more annealing processes. As used herein, the term “about” in reference to a value of a feature (e.g., height, width, spacing) or upper and lower limits of a range of values for a feature includes features values that are within several percent of the stated feature value, feature value lower range limit, or feature value upper range limit.
In the following description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding thereof. It may be evident, however, that the novel embodiments can be practiced without these specific details. In other instances, well known structures and devices are shown in block diagram form in order to facilitate a description thereof. The intention is to cover all modifications, equivalents, and alternatives within the scope of the claims.
As used herein, the phrase “located on” in the context of a first layer or component located on a second layer or component refers to the first layer or component being directly physically attached to the second part or component (no layers or components between the first and second layers or components) or physically attached to the second layer or component with one or more intervening layers or components. For example, with reference to
As used herein, the term “adjacent” refers to layers or components that are in physical contact with each other. That is, there is no layer or component between the stated adjacent layers or components. For example, a layer X that is adjacent to a layer Y refers to a layer that is in physical contact with layer Y.
As used herein, the term “integrated circuit component” refers to a packaged or unpacked integrated circuit product. A packaged integrated circuit component comprises one or more integrated circuit dies mounted on a package substrate with the integrated circuit dies and package substrate encapsulated in a casing material, such as a metal, plastic, glass, or ceramic. In one example, a packaged integrated circuit component contains one or more processor units mounted on a substrate with an exterior surface of the substrate comprising a solder ball grid array (BGA). In one example of an unpackaged integrated circuit component, a single monolithic integrated circuit die comprises solder bumps attached to contacts on the die. The solder bumps allow the die to be directly attached to a printed circuit board. An integrated circuit component can comprise one or more of any computing system component described or referenced herein or any other computing system component, such as a processor unit (e.g., system-on-a-chip (SoC), processor core, graphics processor unit (GPU), accelerator, chipset processor), I/O controller, memory, or network interface controller.
Reference is now made to the drawings, which are not necessarily drawn to scale, wherein similar or same numbers may be used to designate same or similar parts in different figures. The use of similar or same numbers in different figures does not mean all figures including similar or same numbers constitute a single or same embodiment. Like numerals having different letter suffixes may represent different instances of similar components. The drawings illustrate generally, by way of example, but not by way of limitation, various embodiments discussed in the present document.
The isolation regions 112 can comprise any suitable nitride or oxide, such as silicon dioxide (SiO2, which is a material that comprises silicon and oxygen), carbon-doped silicon dioxide (C-doped SiO2, also known as CDO or organosilicate glass, which is a material that comprises silicon, oxygen, and carbon), fluorine-doped silicon dioxide (F-doped SiO2, also known as fluorosilicate glass, which is a material that comprises fluorine, silicon, and oxygen), hydrogen-doped silicon dioxide (H-doped SiO2, which is a material that comprises silicon, oxygen, and hydrogen), or silicon nitride (Si3N4, which is a material that comprises silicon and nitrogen).
In some embodiments, the thickness of the titanium silicide layer (e.g., thickness 140 of the titanium silicide layer 128) or the combined thickness of multiple titanium silicide layers (e.g., combined thickness 244 of the titanium silicide layers 228 and 236) is about 5-6 nm. In some embodiments, this thickness is about 2-6 nm. Thus, in titanium contact formation processes where multiple titanium silicide layers are formed, the individual titanium silicide layers may be thinner than those formed in titanium contact formation processes where only one titanium silicide layer is formed. The formation of titanium contacts formed by the titanium contact formation technologies herein can allow for titanium silicide layers thicknesses (e.g., thickness 140, 244) that are greater than titanium silicide layer thicknesses in titanium contacts formed by other approaches.
Titanium contacts formed by the titanium contact formation technologies described herein can be thermally stable in that their contact resistance remains substantially unchanged after being subjected to subsequent annealing and other high-temperature processes. The thermal stability of the titanium contacts formed as described herein is understood to be at least the result of reduced interdiffusion between titanium and germanium across the titanium silicide-silicon germanium interface, which can reduce the creation of voids in the silicon germanium layer. The reduced interdiffusion is understood to be the result of a low amount (or no amount) of titanium in the titanium layer being left unreacted after formation of the titanium silicide layer. Thus, under similar processing conditions, the formation of multiple titanium silicide layers may be advantageous in that less titanium in a thinner titanium layer may be left unreacted after the titanium silicide formation process than one in a process in which a single thicker titanium layer is formed. With less titanium-germanium interdiffusion, the titanium silicide formation processes described herein may form a purer form of titanium silicide relative to existing titanium contact formation processes. This may provide for a lower titanium silicide layer resistance if the purer titanium silicide layer comprises a single phase of titanium silicide. Further, with the reduction (or absence) of voids at the titanium silicide-silicon germanium interface, the titanium silicide layer may have a substantially uniform thickness and consistent electrical conductivity across the span of the titanium silicide-silicon germanium interface.
The formation of titanium contacts using the technologies described herein may result in titanium silicide layers that have sharp interfaces with adjacent silicon germanium layers and trench metals due to a reduced amount of interdiffusion. For example, in some embodiments, the amount of germanium across a titanium silicide-silicon germanium boundary can decrease from a first germanium percentage concentration (e.g., 50% of the silicon germanium layer) on the silicon germanium layer-side of the boundary (e.g., boundaries 128-132, 228-240) to a second germanium percentage concentration of ten percent of the titanium silicide layer within 1.5 nm of the titanium silicide-silicon germanium boundary on the titanium silicide side of the boundary. Similarly, in some embodiments, the amount of trench metal across a titanium silicide layer-trench metal layer boundary can decrease from a first metal percentage concentration (e.g., 50% or more of the trench metal layer) on the trench metal layer-side of the boundary (e.g., boundaries 128-108, 228-208) to a second trench metal percentage concentration of ten percent of the titanium silicide layer within 1.5 nm from the titanium silicide-silicon germanium boundary on the titanium silicide side of the boundary.
In some embodiments, the silicon germanium layer (e.g., 108, 208) can be amorphized prior to formation of a titanium layer on the silicon germanium layer through the implantation of boron (e.g., boron-11) and germanium into the silicon germanium layer. In other embodiments, another element or combination of elements can be implanted into a SiGe layer to amorphize a portion of the SiGe layer. The dose and energy of the implanted boron and germanium are such that a region of the silicon germanium layer extends from a surface of the silicon germanium layer to a depth within the silicon germanium layer is amorphized. Amorphization of the silicon germanium layer prior to formation of the titanium layer can aid in the robustness of the silicon germanium layer against microvoid growth during subsequent annealing and other high-temperature processes and can thus contribute to the thermal stability of the titanium contacts.
Although the titanium contacts illustrated in
The technologies for forming titanium contacts described herein can be utilized to form titanium contacts to SiGe layers that that are part of a source region or a drain region of a transistor, such as a planar FET, a FinFET, a gate-all-around FET (GAAFET), a stacked GAAFET, or another type of transistor. In other embodiments, the titanium contact formation technologies disclosed herein can be utilized to form titanium contacts to a backside of a wafer (the side of a wafer opposite to the side of the wafer upon which a plurality of active devices (e.g., electronic transistors, spintronic devices) are located).
The titanium contacts formed using the titanium contact formation technologies described herein can be used in any processor unit, integrated circuit component, or computing system described or referenced herein. Such titanium contacts can be fabricated as part of an integrated circuit structure. The integrated circuit structure can comprise a die substrate, such as a die substrate comprising silicon, and one or more interconnect or metal layers. A titanium contact formed as described herein can connect to a line of an interconnect or metal layer by a via or by being positioned adjacent to a line of a metal layer. The integrated circuit structure can comprise other types of devices, such as electronic transistors (transistors such as CMOS transistors that operate through control of the flow of electric current and that do not rely upon the switching of the magnetization of a layer or component for operation) and/or magnetoelectric spin-orbit (MESO) devices that use magnetoelectric switching to convert an input voltage/charge into a magnetic spin state (e.g., charge-to-spin conversion) and further uses spin-orbit transduction to convert the magnetic spin state back into an output charge/voltage (e.g., spin-to-charge conversion). An integrated circuit component comprising titanium contacts formed as described herein can be attached to a printed circuit board. In some embodiments, one or more additional integrated circuit components can be attached to the circuit board. In some embodiments, the printed circuit board and the integrated circuit component can be located in a computing device that comprises a housing that encloses the printed circuit board and the integrated circuit component.
In some embodiments, the method 300 can comprise additional elements. For example, the silicon precursor of element 320 can be a first silicon precursor, the method 300 further comprising, after the first silicon precursor flows over the first layer and prior to forming the second layer: forming a third layer comprising titanium, the third layer positioned adjacent to the first layer; and flowing a second silicon precursor over the third layer, at least a portion of the third layer after flowing the silicon precursor over the second layer comprising titanium and silicon, the third layer located between the first layer and the second layer.
In some embodiments, the method can further comprise, after flowing the second silicon precursor over the third layer and prior to forming the second layer: forming a fourth layer comprising titanium, the fourth layer positioned adjacent to the third layer; and flowing a third silicon precursor over the fourth layer, at least a portion of the fourth layer after flowing the silicon precursor over the fourth layer comprising titanium and silicon, the third layer located between the first layer and the second layer.
The integrated circuit device 500 may include one or more device layers 504 disposed on the die substrate 502. The device layer 504 may include features of one or more transistors 540 (e.g., metal oxide semiconductor field-effect transistors (MOSFETs)) formed on the die substrate 502. The transistors 540 may include, for example, one or more source and/or drain (S/D) regions 520, a gate 522 to control current flow between the S/D regions 520, and one or more S/D contacts 524 to route electrical signals to/from the S/D regions 520. The S/D contacts 624 may be formed using any of the titanium contacts formation technologies described herein. The transistors 540 may include additional features not depicted for the sake of clarity, such as device isolation regions, gate contacts, and the like. The transistors 540 are not limited to the type and configuration depicted in
Returning to
The high-k dielectric material may include elements such as hafnium, silicon, oxygen, titanium, tantalum, lanthanum, aluminum, zirconium, barium, strontium, yttrium, lead, scandium, niobium, and zinc. Examples of high-k materials that may be used in the gate dielectric include, but are not limited to, hafnium oxide, hafnium silicon oxide, lanthanum oxide, lanthanum aluminum oxide, zirconium oxide, zirconium silicon oxide, tantalum oxide, titanium oxide, barium strontium titanium oxide, barium titanium oxide, strontium titanium oxide, yttrium oxide, aluminum oxide, lead scandium tantalum oxide, and lead zinc niobate. In some embodiments, an annealing process may be carried out on the gate dielectric to improve its quality when a high-k material is used.
The gate electrode may be formed on the gate dielectric and may include at least one p-type work function metal or n-type work function metal, depending on whether the transistor 540 is to be a p-type metal oxide semiconductor (PMOS) or an n-type metal oxide semiconductor (NMOS) transistor. In some implementations, the gate electrode may consist of a stack of two or more metal layers, where one or more metal layers are work function metal layers and at least one metal layer is a fill metal layer. Further metal layers may be included for other purposes, such as a barrier layer.
For a PMOS transistor, metals that may be used for the gate electrode include, but are not limited to, ruthenium, palladium, platinum, cobalt, nickel, conductive metal oxides (e.g., ruthenium oxide), and any of the metals discussed below with reference to an NMOS transistor (e.g., for work function tuning). For an NMOS transistor, metals that may be used for the gate electrode include, but are not limited to, hafnium, zirconium, titanium, tantalum, aluminum, alloys of these metals, carbides of these metals (e.g., hafnium carbide, zirconium carbide, titanium carbide, tantalum carbide, and aluminum carbide), and any of the metals discussed above with reference to a PMOS transistor (e.g., for work function tuning).
In some embodiments, when viewed as a cross-section of the transistor 540 along the source-channel-drain direction, the gate electrode may consist of a U-shaped structure that includes a bottom portion substantially parallel to the surface of the die substrate 502 and two sidewall portions that are substantially perpendicular to the top surface of the die substrate 502. In other embodiments, at least one of the metal layers that form the gate electrode may simply be a planar layer that is substantially parallel to the top surface of the die substrate 502 and does not include sidewall portions substantially perpendicular to the top surface of the die substrate 502. In other embodiments, the gate electrode may consist of a combination of U-shaped structures and planar, non-U-shaped structures. For example, the gate electrode may consist of one or more U-shaped metal layers formed atop one or more planar, non-U-shaped layers.
In some embodiments, a pair of sidewall spacers may be formed on opposing sides of the gate stack to bracket the gate stack. The sidewall spacers may be formed from materials such as silicon nitride, silicon oxide, silicon carbide, silicon nitride doped with carbon, and silicon oxynitride. Processes for forming sidewall spacers are well known in the art and generally include deposition and etching process steps. In some embodiments, a plurality of spacer pairs may be used; for instance, two pairs, three pairs, or four pairs of sidewall spacers may be formed on opposing sides of the gate stack.
The S/D regions 520 may be formed within the die substrate 502 adjacent to the gate 522 of individual transistors 540. The S/D regions 520 may be formed using an implantation/diffusion process or an etching/deposition process, for example. In the former process, dopants such as boron, aluminum, antimony, phosphorous, or arsenic may be ion-implanted into the die substrate 502 to form the S/D regions 520. An annealing process that activates the dopants and causes them to diffuse farther into the die substrate 502 may follow the ion-implantation process. In the latter process, the die substrate 502 may first be etched to form recesses at the locations of the S/D regions 520. An epitaxial deposition process may then be carried out to fill the recesses with material that is used to fabricate the S/D regions 520. In some implementations, the S/D regions 520 may be fabricated using a silicon alloy such as silicon germanium or silicon carbide. In some embodiments, the epitaxially deposited silicon alloy may be doped in situ with dopants such as boron, arsenic, or phosphorous. In some embodiments, the S/D regions 520 may be formed using one or more alternate semiconductor materials such as germanium or a group III-V material or alloy. In further embodiments, one or more layers of metal and/or metal alloys may be used to form the S/D regions 520.
Electrical signals, such as power and/or input/output (I/O) signals, may be routed to and/or from the devices (e.g., transistors 540) of the device layer 504 through one or more interconnect layers disposed on the device layer 504 (illustrated in
The interconnect structures 528 may be arranged within the interconnect layers 506-510 to route electrical signals according to a wide variety of designs; in particular, the arrangement is not limited to the particular configuration of interconnect structures 528 depicted in
In some embodiments, the interconnect structures 528 may include lines 528a and/or vias 528b filled with an electrically conductive material such as a metal. The lines 528a may be arranged to route electrical signals in a direction of a plane that is substantially parallel with a surface of the die substrate 502 upon which the device layer 504 is formed. For example, the lines 528a may route electrical signals in a direction in and out of the page and/or in a direction across the page from the perspective of
The interconnect layers 506-510 may include a dielectric material 526 disposed between the interconnect structures 528, as shown in
A first interconnect layer 506 (referred to as Metal 1 or “M1”) may be formed directly on the device layer 504. In some embodiments, the first interconnect layer 506 may include lines 528a and/or vias 528b, as shown. The lines 528a of the first interconnect layer 506 may be coupled with contacts (e.g., the S/D contacts 524) of the device layer 504. The vias 528b of the first interconnect layer 506 may be coupled with the lines 528a of a second interconnect layer 508.
The second interconnect layer 508 (referred to as Metal 2 or “M2”) may be formed directly on the first interconnect layer 506. In some embodiments, the second interconnect layer 508 may include via 528b to couple the lines 528 of the second interconnect layer 508 with the lines 528a of a third interconnect layer 510. Although the lines 528a and the vias 528b are structurally delineated with a line within individual interconnect layers for the sake of clarity, the lines 528a and the vias 528b may be structurally and/or materially contiguous (e.g., simultaneously filled during a dual-damascene process) in some embodiments.
The third interconnect layer 510 (referred to as Metal 3 or “M3”) (and additional interconnect layers, as desired) may be formed in succession on the second interconnect layer 508 according to similar techniques and configurations described in connection with the second interconnect layer 508 or the first interconnect layer 506. In some embodiments, the interconnect layers that are “higher up” in the metallization stack 519 in the integrated circuit device 500 (i.e., farther away from the device layer 504) may be thicker that the interconnect layers that are lower in the metallization stack 519, with lines 528a and vias 528b in the higher interconnect layers being thicker than those in the lower interconnect layers.
The integrated circuit device 500 may include a solder resist material 534 (e.g., polyimide or similar material) and one or more conductive contacts 536 formed on the interconnect layers 506-510. In
In some embodiments in which the integrated circuit device 500 is a double-sided die, the integrated circuit device 500 may include another metallization stack (not shown) on the opposite side of the device layer(s) 504. This metallization stack may include multiple interconnect layers as discussed above with reference to the interconnect layers 506-510, to provide conductive pathways (e.g., including conductive lines and vias) between the device layer(s) 504 and additional conductive contacts (not shown) on the opposite side of the integrated circuit device 500 from the conductive contacts 536.
In other embodiments in which the integrated circuit device 500 is a double-sided die, the integrated circuit device 500 may include one or more through silicon vias (TSVs) through the die substrate 502; these TSVs may make contact with the device layer(s) 504, and may provide conductive pathways between the device layer(s) 504 and additional conductive contacts (not shown) on the opposite side of the integrated circuit device 500 from the conductive contacts 536. In some embodiments, TSVs extending through the substrate can be used for routing power and ground signals from conductive contacts on the opposite side of the integrated circuit device 500 from the conductive contacts 536 to the transistors 540 and any other components integrated into the die 500, and the metallization stack 519 can be used to route I/O signals from the conductive contacts 536 to transistors 540 and any other components integrated into the die 500.
Multiple integrated circuit devices 500 may be stacked with one or more TSVs in the individual stacked devices providing connection between one of the devices to any of the other devices in the stack. For example, one or more high-bandwidth memory (HBM) integrated circuit dies can be stacked on top of a base integrated circuit die and TSVs in the HBM dies can provide connection between the individual HBM and the base integrated circuit die. Conductive contacts can provide additional connections between adjacent integrated circuit dies in the stack. In some embodiments, the conductive contacts can be fine-pitch solder bumps (microbumps).
In some embodiments, the circuit board 702 may be a printed circuit board (PCB) including multiple metal (or interconnect) layers separated from one another by layers of dielectric material and interconnected by electrically conductive vias. The individual metal layers comprise conductive traces. Any one or more of the metal layers may be formed in a desired circuit pattern to route electrical signals (optionally in conjunction with other metal layers) between the components coupled to the circuit board 702. In other embodiments, the circuit board 702 may be a non-PCB substrate. The integrated circuit device assembly 700 illustrated in
The package-on-interposer structure 736 may include an integrated circuit component 720 coupled to an interposer 704 by coupling components 718. The coupling components 718 may take any suitable form for the application, such as the forms discussed above with reference to the coupling components 716. Although a single integrated circuit component 720 is shown in
The integrated circuit component 720 may be a packaged or unpacked integrated circuit product that includes one or more integrated circuit dies (e.g., the die 402 of
In embodiments where the integrated circuit component 720 comprises multiple integrated circuit dies, they dies can be of the same type (a homogeneous multi-die integrated circuit component) or of two or more different types (a heterogeneous multi-die integrated circuit component). A multi-die integrated circuit component can be referred to as a multi-chip package (MCP) or multi-chip module (MCM).
In addition to comprising one or more processor units, the integrated circuit component 720 can comprise additional components, such as embedded DRAM, stacked high bandwidth memory (HBM), shared cache memories, input/output (I/O) controllers, or memory controllers. Any of these additional components can be located on the same integrated circuit die as a processor unit, or on one or more integrated circuit dies separate from the integrated circuit dies comprising the processor units. These separate integrated circuit dies can be referred to as “chiplets”. In embodiments where an integrated circuit component comprises multiple integrated circuit dies, interconnections between dies can be provided by the package substrate, one or more silicon interposers, one or more silicon bridges embedded in the package substrate (such as Intel® embedded multi-die interconnect bridges (EMIBs)), or combinations thereof.
Generally, the interposer 704 may spread connections to a wider pitch or reroute a connection to a different connection. For example, the interposer 704 may couple the integrated circuit component 720 to a set of ball grid array (BGA) conductive contacts of the coupling components 716 for coupling to the circuit board 702. In the embodiment illustrated in
In some embodiments, the interposer 704 may be formed as a PCB, including multiple metal layers separated from one another by layers of dielectric material and interconnected by electrically conductive vias. In some embodiments, the interposer 704 may be formed of an epoxy resin, a fiberglass-reinforced epoxy resin, an epoxy resin with inorganic fillers, a ceramic material, or a polymer material such as polyimide. In some embodiments, the interposer 704 may be formed of alternate rigid or flexible materials that may include the same materials described above for use in a semiconductor substrate, such as silicon, germanium, and other group III-V and group IV materials. The interposer 704 may include metal interconnects 708 and vias 710, including but not limited to through hole vias 710-1 (that extend from a first face 750 of the interposer 704 to a second face 754 of the interposer 704), blind vias 710-2 (that extend from the first or second faces 750 or 754 of the interposer 704 to an internal metal layer), and buried vias 710-3 (that connect internal metal layers).
In some embodiments, the interposer 704 can comprise a silicon interposer. Through silicon vias (TSV) extending through the silicon interposer can connect connections on a first face of a silicon interposer to an opposing second face of the silicon interposer. In some embodiments, an interposer 704 comprising a silicon interposer can further comprise one or more routing layers to route connections on a first face of the interposer 704 to an opposing second face of the interposer 704.
The interposer 704 may further include embedded devices 714, including both passive and active devices. Such devices may include, but are not limited to, capacitors, decoupling capacitors, resistors, inductors, fuses, diodes, transformers, sensors, electrostatic discharge (ESD) devices, and memory devices. More complex devices such as radio frequency devices, power amplifiers, power management devices, antennas, arrays, sensors, and microelectromechanical systems (MEMS) devices may also be formed on the interposer 704. The package-on-interposer structure 736 may take the form of any of the package-on-interposer structures known in the art. In embodiments where the interposer is a non-printed circuit board.
The integrated circuit device assembly 700 may include an integrated circuit component 724 coupled to the first face 740 of the circuit board 702 by coupling components 722. The coupling components 722 may take the form of any of the embodiments discussed above with reference to the coupling components 716, and the integrated circuit component 724 may take the form of any of the embodiments discussed above with reference to the integrated circuit component 720.
The integrated circuit device assembly 700 illustrated in
Additionally, in various embodiments, the electrical device 800 may not include one or more of the components illustrated in
The electrical device 800 may include one or more processor units 802 (e.g., one or more processor units). As used herein, the terms “processor unit”, “processing unit” or “processor” may refer to any device or portion of a device that processes electronic data from registers and/or memory to transform that electronic data into other electronic data that may be stored in registers and/or memory. The processor unit 802 may include one or more digital signal processors (DSPs), application-specific integrated circuits (ASICs), central processing units (CPUs), graphics processing units (GPUs), general-purpose GPUs (GPGPUs), accelerated processing units (APUs), field-programmable gate arrays (FPGAs), neural network processing units (NPUs), data processor units (DPUs), accelerators (e.g., graphics accelerator, compression accelerator, artificial intelligence accelerator), controller cryptoprocessors (specialized processors that execute cryptographic algorithms within hardware), server processors, controllers, or any other suitable type of processor units. As such, the processor unit can be referred to as an XPU (or xPU).
The electrical device 800 may include a memory 804, which may itself include one or more memory devices such as volatile memory (e.g., dynamic random access memory (DRAM), static random-access memory (SRAM)), non-volatile memory (e.g., read-only memory (ROM), flash memory, chalcogenide-based phase-change non-voltage memories), solid state memory, and/or a hard drive. In some embodiments, the memory 804 may include memory that is located on the same integrated circuit die as the processor unit 802. This memory may be used as cache memory (e.g., Level 1 (L1), Level 2 (L2), Level 3 (L3), Level 4 (L4), Last Level Cache (LLC)) and may include embedded dynamic random access memory (eDRAM) or spin transfer torque magnetic random access memory (STT-MRAM).
In some embodiments, the electrical device 800 can comprise one or more processor units 802 that are heterogeneous or asymmetric to another processor unit 802 in the electrical device 800. There can be a variety of differences between the processing units 802 in a system in terms of a spectrum of metrics of merit including architectural, microarchitectural, thermal, power consumption characteristics, and the like. These differences can effectively manifest themselves as asymmetry and heterogeneity among the processor units 802 in the electrical device 800.
In some embodiments, the electrical device 800 may include a communication component 812 (e.g., one or more communication components). For example, the communication component 812 can manage wireless communications for the transfer of data to and from the electrical device 800. The term “wireless” and its derivatives may be used to describe circuits, devices, systems, methods, techniques, communications channels, etc., that may communicate data through the use of modulated electromagnetic radiation through a nonsolid medium. The term “wireless” does not imply that the associated devices do not contain any wires, although in some embodiments they might not.
The communication component 812 may implement any of a number of wireless standards or protocols, including but not limited to Institute for Electrical and Electronic Engineers (IEEE) standards including Wi-Fi (IEEE 802.11 family), IEEE 802.16 standards (e.g., IEEE 802.16-2005 Amendment), Long-Term Evolution (LTE) project along with any amendments, updates, and/or revisions (e.g., advanced LTE project, ultra mobile broadband (UMB) project (also referred to as “3GPP2”), etc.). IEEE 802.16 compatible Broadband Wireless Access (BWA) networks are generally referred to as WiMAX networks, an acronym that stands for Worldwide Interoperability for Microwave Access, which is a certification mark for products that pass conformity and interoperability tests for the IEEE 802.16 standards. The communication component 812 may operate in accordance with a Global System for Mobile Communication (GSM), General Packet Radio Service (GPRS), Universal Mobile Telecommunications System (UMTS), High Speed Packet Access (HSPA), Evolved HSPA (E-HSPA), or LTE network. The communication component 812 may operate in accordance with Enhanced Data for GSM Evolution (EDGE), GSM EDGE Radio Access Network (GERAN), Universal Terrestrial Radio Access Network (UTRAN), or Evolved UTRAN (E-UTRAN). The communication component 812 may operate in accordance with Code Division Multiple Access (CDMA), Time Division Multiple Access (TDMA), Digital Enhanced Cordless Telecommunications (DECT), Evolution-Data Optimized (EV-DO), and derivatives thereof, as well as any other wireless protocols that are designated as 3G, 4G, 5G, and beyond. The communication component 812 may operate in accordance with other wireless protocols in other embodiments. The electrical device 800 may include an antenna 822 to facilitate wireless communications and/or to receive other wireless communications (such as AM or FM radio transmissions).
In some embodiments, the communication component 812 may manage wired communications, such as electrical, optical, or any other suitable communication protocols (e.g., IEEE 802.3 Ethernet standards). As noted above, the communication component 812 may include multiple communication components. For instance, a first communication component 812 may be dedicated to shorter-range wireless communications such as Wi-Fi or Bluetooth, and a second communication component 812 may be dedicated to longer-range wireless communications such as global positioning system (GPS), EDGE, GPRS, CDMA, WiMAX, LTE, EV-DO, or others. In some embodiments, a first communication component 812 may be dedicated to wireless communications, and a second communication component 812 may be dedicated to wired communications.
The electrical device 800 may include battery/power circuitry 814. The battery/power circuitry 814 may include one or more energy storage devices (e.g., batteries or capacitors) and/or circuitry for coupling components of the electrical device 800 to an energy source separate from the electrical device 800 (e.g., AC line power).
The electrical device 800 may include a display device 806 (or corresponding interface circuitry, as discussed above). The display device 806 may include one or more embedded or wired or wirelessly connected external visual indicators, such as a heads-up display, a computer monitor, a projector, a touchscreen display, a liquid crystal display (LCD), a light-emitting diode display, or a flat panel display.
The electrical device 800 may include an audio output device 808 (or corresponding interface circuitry, as discussed above). The audio output device 808 may include any embedded or wired or wirelessly connected external device that generates an audible indicator, such speakers, headsets, or earbuds.
The electrical device 800 may include an audio input device 824 (or corresponding interface circuitry, as discussed above). The audio input device 824 may include any embedded or wired or wirelessly connected device that generates a signal representative of a sound, such as microphones, microphone arrays, or digital instruments (e.g., instruments having a musical instrument digital interface (MIDI) output). The electrical device 800 may include a Global Navigation Satellite System (GNSS) device 818 (or corresponding interface circuitry, as discussed above), such as a Global Positioning System (GPS) device. The GNSS device 818 may be in communication with a satellite-based system and may determine a geolocation of the electrical device 800 based on information received from one or more GNSS satellites, as known in the art.
The electrical device 800 may include an other output device 810 (or corresponding interface circuitry, as discussed above). Examples of the other output device 810 may include an audio codec, a video codec, a printer, a wired or wireless transmitter for providing information to other devices, or an additional storage device.
The electrical device 800 may include an other input device 820 (or corresponding interface circuitry, as discussed above). Examples of the other input device 820 may include an accelerometer, a gyroscope, a compass, an image capture device (e.g., monoscopic or stereoscopic camera), a trackball, a trackpad, a touchpad, a keyboard, a cursor control device such as a mouse, a stylus, a touchscreen, proximity sensor, microphone, a bar code reader, a Quick Response (QR) code reader, electrocardiogram (ECG) sensor, PPG (photoplethysmogram) sensor, galvanic skin response sensor, any other sensor, or a radio frequency identification (RFID) reader.
The electrical device 800 may have any desired form factor, such as a hand-held or mobile electrical device (e.g., a cell phone, a smart phone, a mobile internet device, a music player, a tablet computer, a laptop computer, a 2-in-1 convertible computer, a portable all-in-one computer, a netbook computer, an ultrabook computer, a personal digital assistant (PDA), an ultra mobile personal computer, a portable gaming console, etc.), a desktop electrical device, a server, a rack-level computing solution (e.g., blade, tray or sled computing systems), a workstation or other networked computing component, a printer, a scanner, a monitor, a set-top box, an entertainment control unit, a stationary gaming console, smart television, a vehicle control unit, a digital camera, a digital video recorder, a wearable electrical device or an embedded computing system (e.g., computing systems that are part of a vehicle, smart home appliance, consumer electronics product or equipment, manufacturing equipment). In some embodiments, the electrical device 800 may be any other electronic device that processes data. In some embodiments, the electrical device 800 may comprise multiple discrete physical components. Given the range of devices that the electrical device 800 can be manifested as in various embodiments, in some embodiments, the electrical device 800 can be referred to as a computing device or a computing system.
As used in this application and the claims, a list of items joined by the term “and/or” can mean any combination of the listed items. For example, the phrase “A, B and/or C” can mean A; B; C; A and B; A and C; B and C; or A, B and C. As used in this application and the claims, a list of items joined by the term “at least one of” can mean any combination of the listed terms. For example, the phrase “at least one of A, B or C” can mean A; B; C; A and B; A and C; B and C; or A, B, and C. Moreover, as used in this application and the claims, a list of items joined by the term “one or more of” can mean any combination of the listed terms. For example, the phrase “one or more of A, B and C” can mean A; B; C; A and B; A and C; B and C; or A, B, and C.
As used in this application and the claims, a list of items stated or recited as having a trait, feature, etc. preceded by the word “individual” or “respective” means that all of the items in the list possess the stated or recited trait, feature, etc. For example, the phrase “individual of A, B, or C, comprise a sidewall” or “respective of A, B, or C, comprise a sidewall” means that A comprises a sidewall, B comprises sidewall, and C comprises a sidewall.
The disclosed methods, apparatuses, and systems are not to be construed as limiting in any way. Instead, the present disclosure is directed toward all novel and nonobvious features and aspects of the various disclosed embodiments, alone and in various combinations and subcombinations with one another. The disclosed methods, apparatuses, and systems are not limited to any specific aspect or feature or combination thereof, nor do the disclosed embodiments require that any one or more specific advantages be present or problems be solved.
Theories of operation, scientific principles, or other theoretical descriptions presented herein in reference to the apparatuses or methods of this disclosure have been provided for the purposes of better understanding and are not intended to be limiting in scope. The apparatuses and methods in the appended claims are not limited to those apparatuses and methods that function in the manner described by such theories of operation.
Although the operations of some of the disclosed methods are described in a particular, sequential order for convenient presentation, it is to be understood that this manner of description encompasses rearrangement, unless a particular ordering is required by specific language set forth herein. For example, operations described sequentially may in some cases be rearranged or performed concurrently. Moreover, for the sake of simplicity, the attached figures may not show the various ways in which the disclosed methods can be used in conjunction with other methods.
The following examples pertain to additional embodiments of technologies disclosed herein.
Example 1 is a method comprising: forming a first layer comprising titanium, the first layer located on a substrate comprising silicon; flowing a silicon precursor over the first layer, at least a portion of the first layer after flowing the silicon precursor over the first layer comprising titanium and silicon; forming a second layer comprising a metal, the second layer located on the first layer; and performing one or more annealing processes on the first layer, the second layer, and the substrate.
Example 2 comprises the method of example 1, wherein the portion of the first layer comprising titanium and silicon after flowing the silicon precursor over the first layer comprises titanium silicide.
Example 3 comprises the method of example 1 or 2, wherein flowing the silicon precursor over the first layer is performed within a chamber, a temperature within the chamber held at a temperature of about 375-475° C. during the flowing of the silicon precursor over the first layer.
Example 4 comprises the method of any of examples 1-3, wherein the silicon precursor comprises silane.
Example 5 comprises the method of any of examples 1-3, wherein the silicon precursor comprises disilane.
Example 6 comprises the method of any of examples 1-3, wherein the silicon precursor comprises trisilane.
Example 7 comprises the method of any of examples 1-3, wherein the silicon precursor comprises tetrasilane.
Example 8 comprises the method of any of examples 1-3, wherein a thickness of the first layer is in a range of about 5-6 nm.
Example 9 comprises the method of any of examples 1-8, wherein a thickness of the first layer is in a range of about 2-6 nm.
Example 10 comprises the method of any of examples 1-9, wherein the silicon precursor is a first silicon precursor, the method further comprising, after flowing the first silicon precursor over the first layer and prior to forming the second layer: forming a third layer comprising titanium, the third layer positioned adjacent to the first layer; and flowing a second silicon precursor over the third layer, at least a portion of the third layer after flowing the silicon precursor over the second layer comprising titanium and silicon, the third layer located between the first layer and the second layer.
Example 11 comprises the method of example 10, wherein the first silicon precursor comprises silane, disilane, trisilane, or tetrasilane and the second silicon precursor comprises silane, disilane, trisilane, or tetrasilane.
Example 12 comprises the method of example 11, wherein the first silicon precursor is the same as the second silicon precursor.
Example 13 comprises the method of example 11, wherein the first silicon precursor is different than the second silicon precursor.
Example 14 comprises the method of example 10, the method further comprising, after flowing the second silicon precursor over the third layer and prior to forming the second layer: forming a fourth layer comprising titanium, the fourth layer positioned adjacent to the third layer; and flowing a third silicon precursor over the fourth layer, at least a portion of the fourth layer after flowing the silicon precursor over the fourth layer comprising titanium and silicon, the fourth layer located between the third layer and the second layer.
Example 15 comprises the method of example 14, wherein the first silicon precursor comprises silane, disilane, trisilane, or tetrasilane, the second silicon precursor comprises silane, disilane, trisilane, or tetrasilane, and the third silicon precursor comprises silane, disilane, trisilane, or tetrasilane.
Example 16 comprises the method of example 15, wherein the first silicon precursor, the second silicon precursor, and the third silicon precursor are the same.
Example 17 comprises the method of example 15, wherein two of the first silicon precursor, the second silicon precursor, and the third silicon precursor are the same.
Example 18 comprises the method of example 15, wherein the first silicon precursor, the second silicon precursor, and the third silicon precursor are all different.
Example 19 comprises the method of any one of examples 1-18, wherein forming the first layer and flowing the silicon precursor over the first layer is performed by a manufacturing tool and the substrate is not removed from the manufacturing tool between the forming the first layer and the flowing the silicon precursor over the first layer.
Example 20 comprises the method of any one of examples 1-10, wherein the first layer is adjacent to a third layer comprising silicon and germanium, the third layer positioned between the first layer and the substrate, the third layer positioned adjacent to the substrate.
Example 21 comprises the method of example 20, wherein there are no voids in the third layer after performing the one or more annealing processes.
Example 22 comprises the method of example 20, further comprising, prior to forming the first layer: implanting boron into the third layer; and implanting germanium into the third layer, the implanting the boron and implanting the germanium resulting in an amorphized region of the third layer extending from a surface of the third layer, the first layer positioned adjacent to the amorphized region of the third layer.
Example 23 comprises the method of example 22, wherein the boron implanted into the third layer is boron-11.
Example 24 comprises the method of example 20, wherein the third layer is formed via epitaxial growth.
Example 25 comprises the method of example 20, wherein the third layer comprises a p-type dopant.
Example 26 comprises the method of example 25, wherein the third layer comprises boron, gallium, or indium.
Example 27 comprises the method of example 1, wherein the first layer is positioned adjacent to a first region of the substrate, the first region comprising an n-type dopant or a p-type dopant.
Example 28 comprises the method of example 27, wherein the p-type dopant is boron, gallium, or indium.
Example 29 comprises the method of example 27, wherein the n-type dopant is phosphorous, arsenic, or antimony.
Example 30 comprises the method of any one of examples 1-29, wherein the metal of the second layer comprises cobalt.
Example 31 comprises the method of any one of examples 1-29 example 1, wherein the metal of the second layer comprises tungsten.
Example 32 comprises the method of any one of example 1-10 further comprising forming a third layer comprising titanium and nitrogen, the forming the second layer performed after flowing the silicon precursor over the first layer and before forming the second layer, the third layer positioned between the first layer and the second layer.
Example 33 is An apparatus comprising: a substrate comprising silicon; a first layer positioned adjacent to the substrate, the first layer comprising silicon and germanium; a second layer, a portion of which is positioned adjacent to the first layer, the second layer comprising titanium and silicon, wherein a germanium percentage concentration on a second layer-side of a boundary between the first layer and the second layer decreases from a first germanium percentage concentration at a boundary between the first layer and second layer to a second germanium percentage of ten percent within 1.5 nm from the boundary between the first layer and the second layer; and a third layer comprising a metal, the third layer located on the second layer.
Example 34 comprises the apparatus of example 33, wherein a metal percentage concentration of the second layer decreases from a first metal percentage concentration on a third layer-side of a boundary between the third layer and second layer to a second metal percentage of ten percent within 1.5 nm from the boundary between the third layer and the second layer on a second layer-side of the boundary between the third layer and the second layer.
Example 35 comprises the apparatus of example 32 or 33, wherein the second layer comprises a plurality of sublayers comprising titanium and silicon, individual of the sublayers positioned adjacent to another one of the sublayers.
Example 36 comprises the apparatus of any one of examples 33-35, wherein the first layer comprises boron-11.
Example 37 comprises the apparatus of any one of examples 33-36, wherein the second layer has a thickness in a range of about 5-6 nm.
Example 38 comprises the apparatus of any one of examples 33-36, wherein the second layer has a thickness in a range of about 2-6 nm.
Example 39 comprises the apparatus of any one of examples 33-38, wherein the third layer comprises tungsten.
Example 40 comprises the apparatus of any one of examples 33-38, wherein the third layer comprises cobalt.
Example 41 comprises the apparatus of any one of examples 33-40, wherein there is an absence of voids in a region of the first layer positioned adjacent to the portion of the second layer positioned adjacent to the first layer.
Example 42 comprises the apparatus of any one of examples 33-41, further comprising a fourth layer positioned between the second layer and the third layer, the fourth layer comprising titanium and nitrogen.
Example 43 comprises the apparatus of any one of examples 33-41, further comprising a fourth layer positioned between the second layer and the third layer, the fourth layer comprising: indium and oxygen; tungsten and nitrogen; titanium and nitrogen; or ruthenium.
Example 44 comprises the apparatus of any one of examples 33-43, wherein the first layer is at least part of a source region or a drain region of a transistor.
Example 45 comprises the apparatus of example 44, wherein the transistor is a planar field-effect transistor (FET), a FinFET, a gate-all-around FET, or a stacked gate-all-around FET.
Example 46 comprises the apparatus of any one of examples 33-45, wherein the first layer is positioned adjacent to a first surface of the substrate, the substrate further comprising a second surface opposite the first surface, the apparatus further comprising a plurality of transistors and/or spintronic devices located on the second surface of the substrate.
Example 47 comprises the apparatus of any one of examples 33-46, wherein the apparatus is a processor unit.
Example 48 comprises the apparatus of any one of examples 33-46, wherein the apparatus is an integrated circuit component.
Example 49 comprises the apparatus of any one of examples 33-46, wherein the apparatus further comprises: a printed circuit board; and a first integrated circuit component attached to the printed circuit board, the first integrated circuit component comprising the substrate, the first layer, the second layer, and the third layer.
Example 50 comprises the apparatus of example 49, wherein the apparatus further comprises one or more second integrated circuit components attached to the printed circuit board.
Example 51 comprises the apparatus of example 49, wherein the apparatus further comprises a housing enclosing the printed circuit board and the first integrated circuit component.
