Multilayer substrates

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H01L23/5383

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/5383Multilayer substrates

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Conformal power delivery structure for direct chip attach architect...
- Patent number 12,288,750
- Issue date Apr 29, 2025
- Intel Corporation
- William J. Lambert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 12,288,752
- Issue date Apr 29, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,288,780
- Issue date Apr 29, 2025
- Samsung Electronics Co., Ltd.
- Ju-Youn Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies
- Patent number 12,288,751
- Issue date Apr 29, 2025
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for delivering power to semiconductors
- Patent number 12,289,050
- Issue date Apr 29, 2025
- Vicor Corporation
- Patrizio Vinciarelli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for cooling system and power module for inverte...
- Patent number 12,284,791
- Issue date Apr 22, 2025
- BorgWarner US Technologies LLC
- Bryan Rohl
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Photonic integrated package and method forming same
- Patent number 12,283,492
- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of manufacturing the same
- Patent number 12,283,545
- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yung-Chi Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density interconnection using fanout interposer chiplet
- Patent number 12,283,549
- Issue date Apr 22, 2025
- Apple Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optoelectronic device package and method of manufacturing the same
- Patent number 12,283,585
- Issue date Apr 22, 2025
- Advanced Semiconductor Engineering, Inc.
- Chi-Han Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for parameter drift correction for inverter for...
- Patent number 12,279,402
- Issue date Apr 15, 2025
- BorgWarner US Technologies LLC
- Seyed R. Zarabadi
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Semiconductor packages having wiring patterns
- Patent number 12,278,191
- Issue date Apr 15, 2025
- Samsung Electronics Co., Ltd.
- Youngchan Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
- Patent number 12,278,196
- Issue date Apr 15, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Tae Ki Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid embedded packaging structure and manufacturing method thereof
- Patent number 12,278,227
- Issue date Apr 15, 2025
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor structure including a barrier s...
- Patent number 12,278,208
- Issue date Apr 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Mao-Yen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Logic drive based on multichip package comprising standard commodit...
- Patent number 12,278,192
- Issue date Apr 15, 2025
- iCometrue Company Ltd.
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor and circuit structures, and related methods
- Patent number 12,272,691
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chang-Fen Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-output look-up table (LUT) for use in coarse-grained field-pr...
- Patent number 12,268,012
- Issue date Apr 1, 2025
- iCometrue Company Ltd.
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded component package structure and manufacturing method thereof
- Patent number 12,267,961
- Issue date Apr 1, 2025
- Advanced Semiconductor Engineering, Inc.
- Chien-Fan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated devices in semiconductor packages and methods of forming...
- Patent number 12,266,619
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 12,266,648
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sen-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 12,266,609
- Issue date Apr 1, 2025
- Samsung Electronics Co., Ltd.
- Hyung Jun Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package, electronic device, and chip package preparation method
- Patent number 12,266,617
- Issue date Apr 1, 2025
- Huawei Technologies Co., Ltd.
- Nan Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mixed density interconnect architectures using hybrid fan-out
- Patent number 12,266,611
- Issue date Apr 1, 2025
- Advanced Micro Devices, Inc.
- Rahul Agarwal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,261,126
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Hsien Chiang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor packages including antenna pattern
- Patent number 12,261,135
- Issue date Mar 25, 2025
- Samsung Electronics Co., Ltd.
- Se Ho You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for cooling system and power module for inverte...
- Patent number 12,261,558
- Issue date Mar 25, 2025
- BorgWarner US Technologies LLC
- Bryan Rohl
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Method for forming chip package structure
- Patent number 12,261,125
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Heh-Chang Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective metallization of integrated circuit packages
- Patent number 12,261,123
- Issue date Mar 25, 2025
- Advanced Technical Ceramics Company
- Aaron Fitzsimmons
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna modules employing three-dimensional (3D) build-up on mold p...
- Patent number 12,255,381
- Issue date Mar 18, 2025
- QUALCOMM Incorporated
- Ranadeep Dutta
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE INCLUDING CONDUCTIVE STUD ON PAD STRUCTURE
- Publication number 20250140700
- Publication date May 1, 2025
- QUALCOMM Incorporated
- Joan Rey Villarba BUOT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH SHUNT AND PATTERNED METAL TRACE
- Publication number 20250140708
- Publication date May 1, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250140749
- Publication date May 1, 2025
- NANYA TECHNOLOGY CORPORATION
- Ping HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE WITH THERMOELECTRIC COOLING
- Publication number 20250140642
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Ming Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FORMATION METHOD THEREOF
- Publication number 20250140647
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jhih-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND METHOD FOR PRODUCING A POWER MODULE
- Publication number 20250140701
- Publication date May 1, 2025
- ROBERT BOSCH GmbH
- Irfan AYDOGMUS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE HAVING A FIRST CIRCUIT CARRIER CONTAINING A CARRIER SU...
- Publication number 20250140702
- Publication date May 1, 2025
- ROBERT BOSCH GmbH
- Irfan AYDOGMUS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250140747
- Publication date May 1, 2025
- NANYA TECHNOLOGY CORPORATION
- Ping HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR PA...
- Publication number 20250140709
- Publication date May 1, 2025
- Samsung Electronics Co., Ltd.
- Junghoon Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES INCLUDING PASSIVE DEVICES AND METHODS OF FOR...
- Publication number 20250140744
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20250132268
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Ming Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE WITH SIDE-BY-SIDE INTEGRATED CIRCUIT DEVICES
- Publication number 20250132262
- Publication date Apr 24, 2025
- QUALCOMM Incorporated
- Joan Rey Villarba BUOT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR ADAPTIVE GATE DRIVER FOR INVERTER FOR ELECT...
- Publication number 20250133708
- Publication date Apr 24, 2025
- BorgWarner US Technologies LLC
- Seyed R. Zarabadi
- B60 - VEHICLES IN GENERAL
Information Patent Application
Semiconductor Package And Method Of Fabricating The Same
- Publication number 20250132263
- Publication date Apr 24, 2025
- Samsung Electronics Co., Ltd.
- Hae-Jung YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH MULTI-ALLOY BALL GRID ARRAY
- Publication number 20250125235
- Publication date Apr 17, 2025
- Micron Technology, Inc.
- Steve D. ABRAHAMSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING ADHESIVE LAYER AND METHOD FOR MANUF...
- Publication number 20250125271
- Publication date Apr 17, 2025
- Samsung Electronics Co., Ltd.
- Yeohoon YOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR INTEGRATED GATE DRIVER FOR INVERTER FOR ELE...
- Publication number 20250126762
- Publication date Apr 17, 2025
- BorgWarner US Technologies LLC
- Mark Wendell Gose
- B60 - VEHICLES IN GENERAL
Information Patent Application
PACKAGE SUBSTRATE, SEMICONDUCTOR DEVICE, AND METHOD FOR FORMING PAC...
- Publication number 20250125276
- Publication date Apr 17, 2025
- AP MEMORY TECHNOLOGY CORPORATION
- RU-YI CAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF PACKAGING SUBSTRATE AND PACKAGING SUBSTRATE...
- Publication number 20250125270
- Publication date Apr 17, 2025
- ABSOLICS INC.
- Chae Mook LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE WITH HIGH DENSITY INTERCONNECTS
- Publication number 20250125275
- Publication date Apr 17, 2025
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES INCLUDING INTERCONNECTS WITH DIFFERENT S...
- Publication number 20250125307
- Publication date Apr 17, 2025
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250125299
- Publication date Apr 17, 2025
- Samsung Electronics Co., Ltd.
- Do Hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD
- Publication number 20250125269
- Publication date Apr 17, 2025
- LG Innotek Co., Ltd.
- Se Woong NA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS CORE LAMINATE STRUCTURE AND PRODUCTION METHOD FOR GLASS CORE...
- Publication number 20250125272
- Publication date Apr 17, 2025
- TOPPAN Holdings Inc.
- Masashi SAWADAISHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND STACKED PACKAGE MODULE INCLUDING THE SAME
- Publication number 20250125317
- Publication date Apr 17, 2025
- Samsung Electronics Co., Ltd.
- Daeho LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250118678
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chi Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE WITH A THERMAL CARRIER
- Publication number 20250118706
- Publication date Apr 10, 2025
- ADVANCED MICRO DEVICES, INC.
- Manish DUBEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NESTED INTERPOSER WITH THROUGH-SILICON VIA BRIDGE DIE
- Publication number 20250118647
- Publication date Apr 10, 2025
- Intel Corporation
- Srinivas V. PIETAMBARAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20250118697
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jui Shen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20250118682
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jhih-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS

Multilayer substrates

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Conformal power delivery structure for direct chip attach architect...

Semiconductor packages

Semiconductor package

Microelectronic assemblies

Method and apparatus for delivering power to semiconductors

Systems and methods for cooling system and power module for inverte...

Photonic integrated package and method forming same

Package structure and method of manufacturing the same

High density interconnection using fanout interposer chiplet

Optoelectronic device package and method of manufacturing the same

Systems and methods for parameter drift correction for inverter for...

Semiconductor packages having wiring patterns

Semiconductor devices and methods of manufacturing semiconductor de...

Hybrid embedded packaging structure and manufacturing method thereof

Method of fabricating semiconductor structure including a barrier s...

Logic drive based on multichip package comprising standard commodit...

Semiconductor and circuit structures, and related methods

Multi-output look-up table (LUT) for use in coarse-grained field-pr...

Embedded component package structure and manufacturing method thereof

Integrated devices in semiconductor packages and methods of forming...

Package structure

Semiconductor device and method for fabricating the same

Chip package, electronic device, and chip package preparation method

Mixed density interconnect architectures using hybrid fan-out

Semiconductor package

Semiconductor packages including antenna pattern

Systems and methods for cooling system and power module for inverte...

Method for forming chip package structure

Selective metallization of integrated circuit packages

Antenna modules employing three-dimensional (3D) build-up on mold p...

Patents Applicationslast 30 patents

SUBSTRATE INCLUDING CONDUCTIVE STUD ON PAD STRUCTURE

SEMICONDUCTOR PACKAGE WITH SHUNT AND PATTERNED METAL TRACE

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

INTEGRATED CIRCUIT DEVICE WITH THERMOELECTRIC COOLING

SEMICONDUCTOR PACKAGE AND FORMATION METHOD THEREOF

POWER MODULE AND METHOD FOR PRODUCING A POWER MODULE

POWER MODULE HAVING A FIRST CIRCUIT CARRIER CONTAINING A CARRIER SU...

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR PA...

SEMICONDUCTOR PACKAGES INCLUDING PASSIVE DEVICES AND METHODS OF FOR...

PACKAGE STRUCTURE

DEVICE WITH SIDE-BY-SIDE INTEGRATED CIRCUIT DEVICES

SYSTEMS AND METHODS FOR ADAPTIVE GATE DRIVER FOR INVERTER FOR ELECT...

Semiconductor Package And Method Of Fabricating The Same

SEMICONDUCTOR DEVICE WITH MULTI-ALLOY BALL GRID ARRAY

SEMICONDUCTOR PACKAGE INCLUDING ADHESIVE LAYER AND METHOD FOR MANUF...

SYSTEMS AND METHODS FOR INTEGRATED GATE DRIVER FOR INVERTER FOR ELE...

PACKAGE SUBSTRATE, SEMICONDUCTOR DEVICE, AND METHOD FOR FORMING PAC...

MANUFACTURING METHOD OF PACKAGING SUBSTRATE AND PACKAGING SUBSTRATE...

MULTI-CHIP PACKAGE WITH HIGH DENSITY INTERCONNECTS

MICROELECTRONIC ASSEMBLIES INCLUDING INTERCONNECTS WITH DIFFERENT S...

SEMICONDUCTOR PACKAGE

CIRCUIT BOARD

GLASS CORE LAMINATE STRUCTURE AND PRODUCTION METHOD FOR GLASS CORE...

SEMICONDUCTOR PACKAGE AND STACKED PACKAGE MODULE INCLUDING THE SAME

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

CHIP PACKAGE WITH A THERMAL CARRIER

NESTED INTERPOSER WITH THROUGH-SILICON VIA BRIDGE DIE

PACKAGE STRUCTURE AND METHODS OF FORMING THE SAME

PACKAGE STRUCTURE