Claims
- 1. A tool for tab application and removal to a semiconductor die of tabs to associated die pads comprising:
- (a) a fixture having a planar surface having thereon groove means and having means for removably securing said die to said surface adjacent said groove means;
- (b) a tool having an inclined forward surface;
- (c) means to secure said die to said fixture; and
- (d) means to move said tool along said groove means to apply a force to each said tab serially of sufficient force to serially sever said bond between said tab and said pads.
- 2. The tool of claim 1 wherein said inclined forward surface makes an angle of about 24 degrees with an adjacent surface.
- 3. The tool of claim 1 wherein said groove means includes a first pair of spaced apart parallel grooves, a second pair of spaced apart parallel grooves normal to said first pair of spaced apart parallel grooves and means in the region bounded by said grooves to removably secure said die to said surface.
- 4. The tool of claim 2 wherein said groove means includes a first pair of spaced apart parallel grooves, a second pair of spaced apart parallel grooves normal to said first pair of spaced apart parallel grooves and means in the region bounded by said grooves to removably secure said die to said surface.
Parent Case Info
This is a continuation of application Ser. No. 08/375,462, filed Jan. 19, 1995, U.S. Pat. No. 5,591,649.
US Referenced Citations (14)
Foreign Referenced Citations (1)
Number |
Date |
Country |
2186663 |
Jul 1990 |
JPX |
Non-Patent Literature Citations (1)
Entry |
IBM Technical Disclosure Bulletin; "Chip/Tape of Tape/Lead Frame Interface Delamination Technique"; vol. 32, No. 8A, Jan., 1990, p. 468. |
Continuations (1)
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Number |
Date |
Country |
Parent |
375462 |
Jan 1995 |
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