Additional lead-in metallisation on a device or substrate

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements

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H01L22/32Additional lead-in metallisation on a device or substrate

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Patents Grantslast 30 patents

Information Patent Grant
Display device, and tiled display device including the display device
- Patent number 12,368,135
- Issue date Jul 22, 2025
- Samsung Display Co., Ltd.
- Hyun Joon Kim
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Semiconductor structure and method for forming a semiconductor stru...
- Patent number 12,362,241
- Issue date Jul 15, 2025
- Intel Corporation
- Richard Geiger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test structure of wafer and method of manufacturing test structure...
- Patent number 12,362,242
- Issue date Jul 15, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Hongcheng Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 12,362,261
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assemblies including TSVs of different lengths...
- Patent number 12,362,243
- Issue date Jul 15, 2025
- Micron Technology, Inc.
- Kunal R. Parekh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer structure including probe marked test pads
- Patent number 12,354,921
- Issue date Jul 8, 2025
- Powerchip Semiconductor Manufacturing Corporation
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device
- Patent number 12,347,736
- Issue date Jul 1, 2025
- Lite-On Opto Technology (Changzhou) Co., Ltd.
- Chen-Hsiu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Probe pad with built-in interconnect structure
- Patent number 12,327,770
- Issue date Jun 10, 2025
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer reconstitution and die-stitching
- Patent number 12,322,730
- Issue date Jun 3, 2025
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing die stack structure
- Patent number 12,322,728
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shifted via-chain electrical-test measurements for hybrid bonding a...
- Patent number 12,322,661
- Issue date Jun 3, 2025
- Tokyo Electron Limited
- Kevin Ryan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit
- Patent number 12,322,665
- Issue date Jun 3, 2025
- NXP B.V.
- Denizhan Karaca
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,322,742
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hsiang-Tai Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die, manufacturing method thereof, and semiconductor...
- Patent number 12,308,298
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method for manufacturing the same
- Patent number 12,300,556
- Issue date May 13, 2025
- Innolux Corporation
- Chih-Yuan Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor redistribution structure with integrated test pad and...
- Patent number 12,288,759
- Issue date Apr 29, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Chih-Cheng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor structure for detecting ve...
- Patent number 12,283,530
- Issue date Apr 22, 2025
- NANYA TECHNOLOGY CORPORATION
- Chun-Shun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of repairing through-electrodes, repair device performing th...
- Patent number 12,283,529
- Issue date Apr 22, 2025
- Samsung Electronics Co., Ltd.
- Sungho Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor device test circuits and methods of use
- Patent number 12,283,531
- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test circuit of semiconductor apparatus and test system including t...
- Patent number 12,283,533
- Issue date Apr 22, 2025
- SK Hynix Inc.
- Jong Seok Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-substrate via test structure
- Patent number 12,278,149
- Issue date Apr 15, 2025
- Powerchip Semiconductor Manufacturing Corporation
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including through-package debug features
- Patent number 12,272,609
- Issue date Apr 8, 2025
- SanDisk Technologies, Inc.
- Nir Amir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment method and alignment device
- Patent number 12,255,113
- Issue date Mar 18, 2025
- STAR TECHNOLOGIES (WUHAN) CO., LTD.
- Choon Leong Lou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tandem micro-light emitting diode redundancy architecture
- Patent number 12,254,799
- Issue date Mar 18, 2025
- Apple Inc.
- Thomas Charisoulis
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Semiconductor device
- Patent number 12,237,235
- Issue date Feb 25, 2025
- Samsung Electronics Co., Ltd.
- Seongkyung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cartridge for inspection
- Patent number 12,237,236
- Issue date Feb 25, 2025
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method of fabricating the same
- Patent number 12,232,407
- Issue date Feb 18, 2025
- Samsung Display Co., Ltd.
- Won-Kyu Kwak
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Display device and bonding detection method of display device
- Patent number 12,224,215
- Issue date Feb 11, 2025
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Chienpang Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and method of forming the same
- Patent number 12,218,105
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 12,218,016
- Issue date Feb 4, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Chen Huang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DIE AND WAFER BONDING CRACK DETECTOR STRUCTURES AND M...
- Publication number 20250239495
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- Ming Jun Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL WIRING OF A SEMICONDUCTOR COMPONENT
- Publication number 20250239489
- Publication date Jul 24, 2025
- Siemens Healthineers AG
- Michael HOSEMANN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO-LED WAFER TESTING DEVICE AND MICRO-LED WAFER TESTING METHOD
- Publication number 20250233028
- Publication date Jul 17, 2025
- INGENTEC CORPORATION
- Yi-Chuan HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF REPAIRING THROUGH-ELECTRODES, REPAIR DEVICE PERFORMING TH...
- Publication number 20250226268
- Publication date Jul 10, 2025
- Samsung Electronics Co., Ltd.
- Sungho Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEST PAD STRUCTURE AND METHOD OF MANUFACTURING AND OPERATING THE SAME
- Publication number 20250226269
- Publication date Jul 10, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- MING-CHUNG WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20250226270
- Publication date Jul 10, 2025
- MEDIATEK SINGAPORE PTE LTD
- Lian DUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250218875
- Publication date Jul 3, 2025
- MEDIATEK INC.
- Cing-Yao JHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DEVICE TEST CIRCUITS AND METHODS OF USE
- Publication number 20250218876
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE AND METHODS OF FORMATION
- Publication number 20250218793
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufactacturing Company, Ltd.
- I-Chun WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASIC INTEGRATED MEMS DEVICE WITH EXPOSED BOND PADS FROM BOTTOM ATTA...
- Publication number 20250210590
- Publication date Jun 26, 2025
- SD Optics, Inc.
- KYUNG PYO HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND PACKAGE MODULE INCLUDING THE SAME
- Publication number 20250210418
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- Yongmin YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, AND ELECTRONIC...
- Publication number 20250201639
- Publication date Jun 19, 2025
- Sony Semiconductor Solutions Corporation
- HIROTAKA YOSHIOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20250201650
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES FOR IN-SITU TESTING OF STACKED SEMICONDUCTOR COMPONENTS
- Publication number 20250191982
- Publication date Jun 12, 2025
- Micron Technology, Inc.
- Yeon Seung Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE
- Publication number 20250185318
- Publication date Jun 5, 2025
- Fuji Electric Co., Ltd.
- Keiji OKUMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20250183104
- Publication date Jun 5, 2025
- Advanced Semiconductor Engineering, Inc.
- Ya-Yu HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20250183207
- Publication date Jun 5, 2025
- SOCIONEXT INC.
- Toru MATSUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH SYSTEM TEST RING
- Publication number 20250174500
- Publication date May 29, 2025
- MEDIATEK INC.
- Cing-Yao Jhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROBING BUMP PLACEMENT OVER MULTIPLE VIA OPENINGS
- Publication number 20250174501
- Publication date May 29, 2025
- Xilinx, Inc.
- Andy WIDJAJA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250174572
- Publication date May 29, 2025
- Samsung Electronics Co., Ltd.
- Hyun Ung Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250167054
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Duckgyu KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING TEST STRUCTURE AND METHOD
- Publication number 20250167055
- Publication date May 22, 2025
- Micron Technology, Inc.
- Mithun Kumar Ramasahayam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER RECONSTITUTION AND DIE-STITCHING
- Publication number 20250157991
- Publication date May 15, 2025
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR INTERCONNECTING DIES
- Publication number 20250157940
- Publication date May 15, 2025
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARTRIDGE FOR INSPECTION
- Publication number 20250157861
- Publication date May 15, 2025
- VueReal Inc.
- Gholamreza CHAJI
- G01 - MEASURING TESTING
Information Patent Application
WAFER PROCESS FOR PROBING BUMP PLACEMENT ON MULTIPLE SMALL POWER PA...
- Publication number 20250149390
- Publication date May 8, 2025
- Xilinx, Inc.
- Andy WIDJAJA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250149464
- Publication date May 8, 2025
- KIOXIA Corporation
- Yoichi MIZUTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLIES WITH WIRE-BONDED TRACES, AND METHODS FOR M...
- Publication number 20250149416
- Publication date May 8, 2025
- Micron Technology, Inc.
- Faxing Che
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20250149391
- Publication date May 8, 2025
- Micron Technology, Inc.
- Haruka Momota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE CARRIER HAVING LARGE CORNER LEADS WITH LEAD TIP INSPECTION...
- Publication number 20250140654
- Publication date May 1, 2025
- INFINEON TECHNOLOGIES AG
- Jing GUO
- H01 - BASIC ELECTRIC ELEMENTS

Additional lead-in metallisation on a device or substrate

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Display device, and tiled display device including the display device

Semiconductor structure and method for forming a semiconductor stru...

Test structure of wafer and method of manufacturing test structure...

Semiconductor device and method of manufacture

Semiconductor device assemblies including TSVs of different lengths...

Wafer structure including probe marked test pads

Light emitting device

Probe pad with built-in interconnect structure

Wafer reconstitution and die-stitching

Method of manufacturing die stack structure

Shifted via-chain electrical-test measurements for hybrid bonding a...

Integrated circuit

Semiconductor structure and manufacturing method thereof

Semiconductor die, manufacturing method thereof, and semiconductor...

Electronic device and method for manufacturing the same

Semiconductor redistribution structure with integrated test pad and...

Method for manufacturing a semiconductor structure for detecting ve...

Method of repairing through-electrodes, repair device performing th...

Stacked semiconductor device test circuits and methods of use

Test circuit of semiconductor apparatus and test system including t...

Through-substrate via test structure

Semiconductor device including through-package debug features

Alignment method and alignment device

Tandem micro-light emitting diode redundancy architecture

Semiconductor device

Cartridge for inspection

Display device and method of fabricating the same

Display device and bonding detection method of display device

Package and method of forming the same

Semiconductor structure

Patents Applicationslast 30 patents

SEMICONDUCTOR DIE AND WAFER BONDING CRACK DETECTOR STRUCTURES AND M...

VERTICAL WIRING OF A SEMICONDUCTOR COMPONENT

MICRO-LED WAFER TESTING DEVICE AND MICRO-LED WAFER TESTING METHOD

METHOD OF REPAIRING THROUGH-ELECTRODES, REPAIR DEVICE PERFORMING TH...

TEST PAD STRUCTURE AND METHOD OF MANUFACTURING AND OPERATING THE SAME

SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR DEVICE

STACKED SEMICONDUCTOR DEVICE TEST CIRCUITS AND METHODS OF USE

SEMICONDUCTOR DIE AND METHODS OF FORMATION

ASIC INTEGRATED MEMS DEVICE WITH EXPOSED BOND PADS FROM BOTTOM ATTA...

SEMICONDUCTOR PACKAGE AND PACKAGE MODULE INCLUDING THE SAME

SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, AND ELECTRONIC...

CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

TECHNIQUES FOR IN-SITU TESTING OF STACKED SEMICONDUCTOR COMPONENTS

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE

SEMICONDUCTOR PACKAGE STRUCTURE

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

SEMICONDUCTOR PACKAGE WITH SYSTEM TEST RING

PROBING BUMP PLACEMENT OVER MULTIPLE VIA OPENINGS

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR DEVICE INCLUDING TEST STRUCTURE AND METHOD

WAFER RECONSTITUTION AND DIE-STITCHING

SYSTEMS AND METHODS FOR INTERCONNECTING DIES

CARTRIDGE FOR INSPECTION

WAFER PROCESS FOR PROBING BUMP PLACEMENT ON MULTIPLE SMALL POWER PA...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR ASSEMBLIES WITH WIRE-BONDED TRACES, AND METHODS FOR M...

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

PACKAGE CARRIER HAVING LARGE CORNER LEADS WITH LEAD TIP INSPECTION...