Additional lead-in metallisation on a device or substrate

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements

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H01L22/32Additional lead-in metallisation on a device or substrate

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor die, manufacturing method thereof, and semiconductor...
- Patent number 12,308,298
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method for manufacturing the same
- Patent number 12,300,556
- Issue date May 13, 2025
- Innolux Corporation
- Chih-Yuan Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor redistribution structure with integrated test pad and...
- Patent number 12,288,759
- Issue date Apr 29, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Chih-Cheng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor structure for detecting ve...
- Patent number 12,283,530
- Issue date Apr 22, 2025
- NANYA TECHNOLOGY CORPORATION
- Chun-Shun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of repairing through-electrodes, repair device performing th...
- Patent number 12,283,529
- Issue date Apr 22, 2025
- Samsung Electronics Co., Ltd.
- Sungho Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor device test circuits and methods of use
- Patent number 12,283,531
- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test circuit of semiconductor apparatus and test system including t...
- Patent number 12,283,533
- Issue date Apr 22, 2025
- SK Hynix Inc.
- Jong Seok Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-substrate via test structure
- Patent number 12,278,149
- Issue date Apr 15, 2025
- Powerchip Semiconductor Manufacturing Corporation
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including through-package debug features
- Patent number 12,272,609
- Issue date Apr 8, 2025
- SanDisk Technologies, Inc.
- Nir Amir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment method and alignment device
- Patent number 12,255,113
- Issue date Mar 18, 2025
- STAR TECHNOLOGIES (WUHAN) CO., LTD.
- Choon Leong Lou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tandem micro-light emitting diode redundancy architecture
- Patent number 12,254,799
- Issue date Mar 18, 2025
- Apple Inc.
- Thomas Charisoulis
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Semiconductor device
- Patent number 12,237,235
- Issue date Feb 25, 2025
- Samsung Electronics Co., Ltd.
- Seongkyung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cartridge for inspection
- Patent number 12,237,236
- Issue date Feb 25, 2025
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method of fabricating the same
- Patent number 12,232,407
- Issue date Feb 18, 2025
- Samsung Display Co., Ltd.
- Won-Kyu Kwak
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Display device and bonding detection method of display device
- Patent number 12,224,215
- Issue date Feb 11, 2025
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Chienpang Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and method of forming the same
- Patent number 12,218,105
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 12,218,016
- Issue date Feb 4, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Chen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 12,218,072
- Issue date Feb 4, 2025
- Kioxia Corporation
- Yoichi Mizuta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming the same
- Patent number 12,211,757
- Issue date Jan 28, 2025
- Micron Technology, Inc.
- Haruka Momota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having a defect detector and data storage sys...
- Patent number 12,211,758
- Issue date Jan 28, 2025
- Samsung Electronics Co., Ltd.
- Kyounghoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit die with isolation test structure
- Patent number 12,211,759
- Issue date Jan 28, 2025
- NXP USA, INC.
- Darrell Glenn Hill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure including interconnection to probe pad with...
- Patent number 12,205,856
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 12,205,854
- Issue date Jan 21, 2025
- Innolux Corporation
- Yeong-E Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for detecting resistance of side trace of display substrate...
- Patent number 12,198,989
- Issue date Jan 14, 2025
- BOE Technology Group Co., Ltd.
- Li Xiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test structure for use in dynamic random access memory and manufact...
- Patent number 12,198,991
- Issue date Jan 14, 2025
- NANYA TECHNOLOGY CORPORATION
- Chiang-Lin Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Motherboard and manufacturing method for motherboard
- Patent number 12,191,217
- Issue date Jan 7, 2025
- HEFEI BOE JOINT TECHNOLOGY CO., LTD.
- Yongqian Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with pillar array
- Patent number 12,191,162
- Issue date Jan 7, 2025
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting diode packages
- Patent number 12,176,472
- Issue date Dec 24, 2024
- CreeLED, Inc.
- Roshan Murthy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
PID test structure and semiconductor test structure
- Patent number 12,176,254
- Issue date Dec 24, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- ChihCheng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-free frame design for silicon bridges for semiconductor packages
- Patent number 12,170,253
- Issue date Dec 17, 2024
- Intel Corporation
- Dae-Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250167054
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Duckgyu KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING TEST STRUCTURE AND METHOD
- Publication number 20250167055
- Publication date May 22, 2025
- Micron Technology, Inc.
- Mithun Kumar Ramasahayam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER RECONSTITUTION AND DIE-STITCHING
- Publication number 20250157991
- Publication date May 15, 2025
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR INTERCONNECTING DIES
- Publication number 20250157940
- Publication date May 15, 2025
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARTRIDGE FOR INSPECTION
- Publication number 20250157861
- Publication date May 15, 2025
- VueReal Inc.
- Gholamreza CHAJI
- G01 - MEASURING TESTING
Information Patent Application
WAFER PROCESS FOR PROBING BUMP PLACEMENT ON MULTIPLE SMALL POWER PA...
- Publication number 20250149390
- Publication date May 8, 2025
- Xilinx, Inc.
- Andy WIDJAJA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250149464
- Publication date May 8, 2025
- KIOXIA Corporation
- Yoichi MIZUTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLIES WITH WIRE-BONDED TRACES, AND METHODS FOR M...
- Publication number 20250149416
- Publication date May 8, 2025
- Micron Technology, Inc.
- Faxing Che
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20250149391
- Publication date May 8, 2025
- Micron Technology, Inc.
- Haruka Momota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE CARRIER HAVING LARGE CORNER LEADS WITH LEAD TIP INSPECTION...
- Publication number 20250140654
- Publication date May 1, 2025
- INFINEON TECHNOLOGIES AG
- Jing GUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DELAMINATION DETECTION STRUCTURE
- Publication number 20250140684
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Hui Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR TEST APPARATUS
- Publication number 20250130268
- Publication date Apr 24, 2025
- Samsung Electronics Co., Ltd.
- Chunghyun KIM
- G01 - MEASURING TESTING
Information Patent Application
SACRIFICIAL TEST PAD
- Publication number 20250132208
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Ting Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEVICE ASSEMBLIES WITH INK-...
- Publication number 20250132209
- Publication date Apr 24, 2025
- Micron Technology, Inc.
- Kunal R. Parekh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250118605
- Publication date Apr 10, 2025
- InnoLux Corporation
- Yeong-E CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE AND METHODS OF FORMATION
- Publication number 20250112183
- Publication date Apr 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- CHERN-YOW HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER INCLUDING A TEST STRUCTURE
- Publication number 20250112097
- Publication date Apr 3, 2025
- Infineon Technologies Austria AG
- Nicole Schulze-Ollmert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MISALIGNMENT MEASUREMENT METHOD FOR SEMICO...
- Publication number 20250105062
- Publication date Mar 27, 2025
- LAPIS Semiconductor Co., Ltd.
- Takumi TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY TILE WITH PROBE PAD ARRANGEMENT AND STACKED MEMORY DEVICE
- Publication number 20250105123
- Publication date Mar 27, 2025
- Powerchip Semiconductor Manufacturing Corporation
- Takeo Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF TESTING THE SAME
- Publication number 20250096047
- Publication date Mar 20, 2025
- Samsung Electronics Co., Ltd.
- YEONGSEON KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250096169
- Publication date Mar 20, 2025
- Fuji Electric Co., Ltd.
- Tohru SHIRAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEST STRUCTURE FOR USE IN DYNAMIC RANDOM ACCESS MEMORY AND MANUFACT...
- Publication number 20250096048
- Publication date Mar 20, 2025
- NANYA TECHNOLOGY CORPORATION
- Chiang-Lin SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SCAN TESTABLE THROUGH SILICON VIAS
- Publication number 20250087539
- Publication date Mar 13, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Lee D. Whetsel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT FOR DETECTING DEFECTS
- Publication number 20250085340
- Publication date Mar 13, 2025
- Samsung Electronics Co., Ltd.
- Takuya FAUTATSUYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TESTING ACCESS FOR STACKED SEMICONDUCTOR DEVICES AND ASSOCIATED SYS...
- Publication number 20250087537
- Publication date Mar 13, 2025
- Micron Technology, Inc.
- Lingming Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250081668
- Publication date Mar 6, 2025
- XINTEC INC.
- Wei-Luen SUEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER AND OPERATING METHOD OF TEST CIRCUIT OF SEMICON...
- Publication number 20250069961
- Publication date Feb 27, 2025
- Samsung Electronics Co., Ltd.
- Jinyong Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENABLING MICRO-BUMP ARCHITECTURES WITHOUT THE USE OF SACRIFICIAL PA...
- Publication number 20250070067
- Publication date Feb 27, 2025
- Microsoft Technology Licensing, LLC
- Rahul AGARWAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20250069960
- Publication date Feb 27, 2025
- Samsung Electronics Co., Ltd.
- SUNJAE KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-FREE FRAME DESIGN FOR SILICON BRIDGES FOR SEMICONDUCTOR PACKAGES
- Publication number 20250070056
- Publication date Feb 27, 2025
- Intel Corporation
- Dae-Woo KIM
- H01 - BASIC ELECTRIC ELEMENTS

Additional lead-in metallisation on a device or substrate

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor die, manufacturing method thereof, and semiconductor...

Electronic device and method for manufacturing the same

Semiconductor redistribution structure with integrated test pad and...

Method for manufacturing a semiconductor structure for detecting ve...

Method of repairing through-electrodes, repair device performing th...

Stacked semiconductor device test circuits and methods of use

Test circuit of semiconductor apparatus and test system including t...

Through-substrate via test structure

Semiconductor device including through-package debug features

Alignment method and alignment device

Tandem micro-light emitting diode redundancy architecture

Semiconductor device

Cartridge for inspection

Display device and method of fabricating the same

Display device and bonding detection method of display device

Package and method of forming the same

Semiconductor structure

Semiconductor device and method for manufacturing the same

Semiconductor device and method of forming the same

Semiconductor devices having a defect detector and data storage sys...

Circuit die with isolation test structure

Semiconductor structure including interconnection to probe pad with...

Electronic device

Method for detecting resistance of side trace of display substrate...

Test structure for use in dynamic random access memory and manufact...

Motherboard and manufacturing method for motherboard

Semiconductor device assembly with pillar array

Light-emitting diode packages

PID test structure and semiconductor test structure

Metal-free frame design for silicon bridges for semiconductor packages

Patents Applicationslast 30 patents

SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR DEVICE INCLUDING TEST STRUCTURE AND METHOD

WAFER RECONSTITUTION AND DIE-STITCHING

SYSTEMS AND METHODS FOR INTERCONNECTING DIES

CARTRIDGE FOR INSPECTION

WAFER PROCESS FOR PROBING BUMP PLACEMENT ON MULTIPLE SMALL POWER PA...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR ASSEMBLIES WITH WIRE-BONDED TRACES, AND METHODS FOR M...

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

PACKAGE CARRIER HAVING LARGE CORNER LEADS WITH LEAD TIP INSPECTION...

DELAMINATION DETECTION STRUCTURE

SEMICONDUCTOR TEST APPARATUS

SACRIFICIAL TEST PAD

SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEVICE ASSEMBLIES WITH INK-...

ELECTRONIC DEVICE

SEMICONDUCTOR DIE AND METHODS OF FORMATION

SEMICONDUCTOR WAFER INCLUDING A TEST STRUCTURE

SEMICONDUCTOR DEVICE AND MISALIGNMENT MEASUREMENT METHOD FOR SEMICO...

MEMORY TILE WITH PROBE PAD ARRANGEMENT AND STACKED MEMORY DEVICE

SEMICONDUCTOR PACKAGE AND METHOD OF TESTING THE SAME

SEMICONDUCTOR DEVICE

TEST STRUCTURE FOR USE IN DYNAMIC RANDOM ACCESS MEMORY AND MANUFACT...

SCAN TESTABLE THROUGH SILICON VIAS

CIRCUIT FOR DETECTING DEFECTS

TESTING ACCESS FOR STACKED SEMICONDUCTOR DEVICES AND ASSOCIATED SYS...

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR WAFER AND OPERATING METHOD OF TEST CIRCUIT OF SEMICON...

ENABLING MICRO-BUMP ARCHITECTURES WITHOUT THE USE OF SACRIFICIAL PA...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

METAL-FREE FRAME DESIGN FOR SILICON BRIDGES FOR SEMICONDUCTOR PACKAGES