Patent Application
20150016171
The present application is based on and claims priority of Japanese patent application No. 2013-144102 filed on Jul. 10, 2013, the entire contents of which are hereby incorporated by reference.
1. Field of the Invention
The present invention relates to a traction converter, and particularly to a traction converter for an electric railway vehicle.
2. Description of the Related Art
In an electric railway vehicle, traction converters such as converters and inverters are mounted for controlling an electric motor to drive the vehicle. These traction converters perform traction conversion by performing a switching at a radio frequency with semiconductor elements such as an IGBT (Insulated Gate Bipolar Transistor) and a GTO (Gate Turn Off Thyristor).
In the semiconductor elements, heat is generated at the times of current-carrying and switching. When the semiconductor elements become at a high temperature by this heat, there are fears of a decrease in conversion efficiency and an element breakdown, and therefore, the semiconductor elements need to be cooled so as to be in a predetermined temperature range. The traction converter is mounted mainly under the floor of the vehicle or the like, in which a mounting space is limited, and therefore, a cooler is provided for efficiently cooling the plural semiconductor elements in a small and lightweight device configuration.
When cooling wind is supplied to the cooler, the cooling wind receives the heat from semiconductor elements provided at the up-wind side, and thereby becomes at a higher temperature as going to the down-wind side. In connection with this, semiconductor elements at the down-wind side tend to be at a high temperature. Therefore, for efficiently cooling the semiconductor elements, it is necessary to configure the cooler such that the temperatures of the semiconductor elements are equalized.
As a component of the cooler, a heat pipe is often used. The heat pipe, in which coolant such as pure water is encapsulated in the interior, is a device to efficiently transport heat in a cycle in which the coolant is evaporated at a heat receiving part and the heat is transported to a heat radiation part, then the coolant is condensed at the heat radiation part and is returned to the heat receiving part. As a cooler intended for a temperature equalization by a combination of the heat pipe and heat radiation fins, there is known a cooler shown in Japanese Patent Laid-Open No. 2000-161880 (Patent Document 1). The cooler is constituted by plural heat radiation fins that are provided roughly vertically and that radiate the heat by the natural convection cooling to the air, a single heat receiving block to which plural semiconductor elements are attached, and plural heat pipes that connect the heat radiation fins and the heat receiving block. The plural heat pipes are provided so as to be inclined relative to the horizontal, for placing the evaporation part side below the condensation part. Further, the plural heat radiation fins are provided such that the interval of heat radiation fins at the upper side is smaller than that of heat radiation fins at the lower side, and the number of the heat radiation fins at the upper side is greater than that of the heat radiation fins at the lower side.
Meanwhile, a cooler shown in Japanese Patent No. 4948625 (Patent Document 2) is also known. The cooler is constituted by a heat receiving block that is thermally connected with heat generation elements, plural heat pipes that are erectly provided on a surface of the heat receiving block, and heat radiation fin groups each of which has plural fins attached to the heat pipe, and cooling wind flows in the direction parallel to the heat receiving block. The heat radiation fin groups are arranged plurally and tandemly along the flow direction of the cooling wind. Of the plural heat radiation fin groups, a heat radiation fin group arranged at the up-wind side of the cooling wind has a larger fin pitch than the fin pitch of a heat radiation fin group arranged at the down-wind side of the cooling wind. Further, assuming that the heat radiation fin groups constitute a single heat radiation fin group that is formed by a plurality of single-fins extending from the up-wind to the down-wind, the positions of group gaps between the plural heat radiation fin groups are positions of the surface temperature of the heat radiation fin of the single heat radiation fin group at which the temperature difference between the up-wind and down-wind of the fin surface of the single heat radiation fin group is evenly divided by the number of the plural heat radiation fin groups.
In the cooler described in Japanese Patent Laid-Open No. 2000-161880 (Patent Document 1), at the upper side, that is, the down-wind side, the fin pitch is smaller and the number is greater. However, in this configuration, the respective heat radiation fin areas at the up-wind side and down-wind side are not optimal, and therefore, there is a problem in that the temperatures of the respective semiconductor elements are not equalized, resulting in an inefficient cooling.
Further, in the cooler described in Japanese Patent No. 4948625 (Patent Document 2), for example, when the heat radiation fin groups are divided into three, a division point between the up-wind side fins and the mid-wind side fins, and a division point between the mid-wind side fins and the down-wind side fins are placed at a more up-wind side than positions at which the fins are evenly divided into three in the cooling wind flow direction, that is, a region occupied by the down-wind side fins, at which the pitch of the heat radiation fins is small and the number is great, is widened. Therefore, there is a problem in that the cooler is heavy. Moreover, in the configuration described in Japanese Patent No. 4948625 (Patent Document 2), the effect is obtained for specific fin pitches, and there is also a problem in that the temperatures cannot be equalized when the fin pitches are changed. In addition, the up-wind, mid-wind and down-wind fins do not have the same shape, and therefore, there is also a problem in that the production cost is high.
The present invention has an object to provide a traction converter that makes it possible to equalize the temperatures of the semiconductor elements by combining the configurations of the heat radiation fins appropriate for the configuration of the semiconductor elements, and to efficiently cool the semiconductor elements in a lightweight device configuration.
A traction converter according to a first aspect of the present invention that solves the above problems is a traction converter including: plural semiconductor elements included in a traction converting circuit; and a cooler to radiate heat from the plural semiconductor elements to outside air, the cooler including a heat receiving block, plural heat pipes and plural heat radiation fins, the plural semiconductor elements being arrayed on one surface of the heat receiving block, heat receiving parts of the plural heat pipes being buried in the other surface of the heat receiving block, heat radiation parts of the plural heat pipes being erectly provided so as to protrude from the heat receiving block, the plural heat radiation fins being joined to the heat radiation parts, the semiconductor elements being provided at three places in a cooling wind flow direction, in which, when regions at which the plural heat radiation fins are provided are defined at even intervals in the cooling wind flow direction as an up-wind region, a mid-wind region and a down-wind region, a heat radiation fin surface area at the up-wind region is in a range of 0.33 to 0.42 times of a heat radiation fin surface area at the down-wind region, and a heat radiation fin surface area at the mid-wind region is in a range of 0.42 to 0.63 times of the heat radiation fin surface area at the down-wind region.
A traction converter according to a second aspect of the present invention is a traction converter including: plural semiconductor elements included in a traction converting circuit; and a cooler to radiate heat from the plural semiconductor elements to outside air, the cooler including a heat receiving block, plural heat pipes and plural heat radiation fins, the plural semiconductor elements being arrayed on one surface of the heat receiving block, heat receiving parts of the plural heat pipes being buried in the other surface of the heat receiving block, heat radiation parts of the plural heat pipes being erectly provided so as to protrude from the heat receiving block, the plural heat radiation fins being joined to the heat radiation parts, the semiconductor elements being provided at two places in a cooling wind flow direction, in which, when regions at which the plural heat radiation fins are provided are defined at even intervals in the cooling wind flow direction as an up-wind region and a down-wind region, a heat radiation fin surface area at the up-wind region is in a range of 0.54 to 0.73 times of a heat radiation fin surface area at the down-wind region.
A traction converter according to a third aspect of the present invention is a traction converter comprising: plural semiconductor elements included in a traction converting circuit; and a cooler to radiate heat from the plural semiconductor elements to outside air, the cooler including a heat receiving block, plural heat pipes and plural heat radiation fins, the plural semiconductor elements being arrayed on one surface of the heat receiving block, heat receiving parts of the plural heat pipes being buried in the other surface of the heat receiving block, heat radiation parts of the plural heat pipes being erectly provided so as to protrude from the heat receiving block, the plural heat radiation fins being joined to the heat radiation parts, the semiconductor elements being provided at four places in a cooling wind flow direction, in which, when regions at which the plural heat radiation fins are provided are defined at even intervals in the cooling wind flow direction as a most up-wind region, an up-wind region, a down-wind region and a most down-wind region, a heat radiation fin surface area at the most up-wind region is in a range of 0.21 to 0.42 times of a heat radiation fin surface area at the most down-wind region, a heat radiation fin surface area at the up-wind region is in a range of 0.25 to 0.63 times of the heat radiation fin surface area at the most down-wind region, and a heat radiation fin surface area at the down-wind region is in a range of 0.42 to 0.73 times of the heat radiation fin surface area at the most down-wind region.
According to the first aspect of the present invention, the heat radiation fin areas at the up-wind region and the mid-wind region, at which the temperature of the cooling wind is low, is smaller than that at the down-wind region, at which the temperature of the cooling wind rises, that is, the numbers of the heat radiation fins are less than that at the down-wind region, and the heat radiation fin areas at the respective regions are set such that the temperatures of the respective semiconductor elements are equalized. Thereby, it is possible to efficiently cool the semiconductor elements in a lightweight device configuration. Also, in the second and third aspects of the present invention, it is possible to obtain the same effect by the same principle as the first aspect of the present invention. Thus, by optimally combining the configurations of the heat radiation fins in accordance with the configuration of the semiconductor elements, it is possible to equalize the temperatures of the semiconductor elements and to efficiently cool the semiconductor elements in a lightweight device configuration.
Hereinafter, a traction converter according to the present invention will be explained in detail with reference to the drawings.
A traction converter 1000 is configured by a side plate 1110, a top plate 1120 and a bottom plate 1130. On the top surface of the traction converter 1000, crosstie-directional beams 1161, 1162 and travel-directional beams 1163, 1164 are provided, and thereby the strength of the traction converter 1000 is kept. Between the top plate 1120 and the bottom plate 1130, a wind-passage bottom plate 1140 is provided. A space surrounded by the side plate 1110, the top plate 1120 and the wind-passage bottom plate 1140 is a wind passage 1150, and cooling wind 1210 flows in the wind passage 1150. Further, a space surrounded by the side plate 1110, the bottom plate 1130 and the wind-passage bottom plate 1140 is a circuit component mounting space 1600, and a semiconductor element group 1500 constituting a main circuit of the traction converter 1000, a filter capacitor 1610, and a gate driver 1620 for controlling the switching of the semiconductor element group 1500 are provided therein.
The semiconductor element group 1500 in the circuit component mounting space 1600 is provided on the under surface of a cooler 1700. A heat receiving block 1710 of the cooler 1700 is connected with the under surface side of the wind-passage bottom plate 1140 in an air-tight manner, such that the cooling wind 1210 does not flow into the circuit component mounting space 1600.
On the other hand, the top surface side of the cooler 1700 is provided in the wind passage 1150. The cooler 1700 does not cohere to the side plate 1110 and the top plate 1120 so that a void is present. For reducing the volume of the cooling wind 1210 to pass through this void, plural wind-leak prevention plates 1191, 1192, 1193, 1194 are provided in the flow direction of the cooling wind, in the space around the cooler 1700. The orientation in which each of the wind-leak prevention plates 1191, 1192, 1193, 1194 is provided is the direction orthogonal to the flow of the cooling wind 1210. Further, the wind-leak prevention plate 1194 is provided so as to protrude downward from the travel-directional beam 1163.
A blower 1200 is provided such that the center of the supply opening is roughly on the central line of the cooler 1700. The cooling wind 1210 is drawn in the traction converter 1000 through a filter 1300, and is supplied from the supply opening of the blower 1200 to the cooler 1700. Here, the width of the supply opening of the blower 1200 is small compared to the width of the cooler 1700, and therefore, the wind passage 1150 is expanded to a similar width to the cooler 1700, by wind-passage expansion plates 1171, 1172. The wind-passage expansion plates 1171, 1172 are connected with the wind-leak prevention plate 1191 that is provided at the most up-wind side. Further, for uniformly supplying the cooling wind 1210 to the cooler 1700, two rectification plates 1181, 1182 are provided between the supply opening of the blower 1200 and the cooler 1700. These two rectification plates 1181, 1182 are provided so as to be symmetric with respect to the center of the supply opening of the blower 1200, and are provided such that the down-wind side is wider in void than the up-wind side. The cooling wind 1210 that has passed through the rectification plates 1181, 1182 and the cooler 1700 is exhausted from a grille 1400 to the exterior.
On the other hand, between the region at which the heat pipes are provided and the cooler-fixation screw holes 1711 on the top surface of the heat receiving block 1710, a seal material 1760 is provided along the entire circumference. Thereby, the wind-passage bottom plate 1140 and the cooler 1700 are connected such that the air tightness is kept.
The arrangement of the heat pipes will be explained. On the B-B cross-section shown in
The configuration of the heat radiation fins will be explained. In the first embodiment of the present invention, the heat radiation fins 1750 are divided into an up-wind region 1752, a mid-wind region 1753 and a down-wind region 1754, and the number of the heat radiation fins 1750 to be provided is 16 at the up-wind region 1752, 20 at the mid-wind region 1753 and 48 at the down-wind region 1754. That is, the surface area of the heat radiation fins 1750 at the up-wind region 1752 is 0.33 times of that at the down-wind region 1754, and the surface area of the heat radiation fins 1750 at the mid-wind region 1753 is 0.42 times of that at the down-wind region 1754. On the other hand, in consideration of productivity, the fins 1750 are divided into four in the direction orthogonal to the flow of the cooling wind 1210.
The positional relation between the cooler and the wind-leak prevention plate will be explained.
A state in which the traction converter is mounted under the floor of a passenger compartment of a railway vehicle will be explained.
Next, the effect of the first embodiment of the present invention will be explained. The plural heat radiation fins 1750 are divided in the flow direction of the cooling wind 1210, and the surface area of the heat radiation fins at the up-wind region 1752 and mid-wind region 1753, at which the temperature of the cooling wind 1210 is low, is smaller than that at the down-wind region 1754, at which the temperature of the cooling wind rises, that is, the numbers of the heat radiation fins are less than that at the down-wind region, and the surface areas of the heat radiation fins at the respective regions are set such that the respective temperatures of the semiconductor element group 1500 are equalized. Thereby, it is possible to efficiently cool the semiconductor element group 1500 in the lightweight device configuration.
Further, the heat receiving part 1721 of the U-shaped heat pipe 1720 is provided in the direction along the flow of the cooling wind 1210, and thereby, the heat transfer can be promoted through the heat receiving part 1721, from the down-wind side to the up-wind side for the cooling wind 1210. Therefore, it is possible to perform the leveling of the influence of the temperature rise of the cooling wind, and to inhibit the temperature rise of the semiconductor elements at the down-wind side. Further, the heat radiation part 1722 of the U-shaped heat pipe 1720 is provided so as to be erectly provided in the vertical direction, and the plural heat radiation fins 1750 are provided in the wind passage 1150 while being joined to the heat radiation part 1722. Thereby, it is possible to promote the heat transfer from the heat receiving block 1710 to the heat radiation fin 1750, resulting in an improvement of the fin efficiency.
Further, the heat radiation parts 1722 of the U-shaped heat pipes 1720 are provided in a zigzag manner. Thereby, the joining parts of the heat radiation fins 1750 and the heat pipes are equally arranged, and the heat is equally transported to the heat radiation fins 1750, resulting in an improvement of the fin efficiency. Moreover, the cross-sectional area of the passage between the heat radiation fins and the cross-sectional area of the passage between the heat pipes are large compared to the case where the heat radiation parts of the heat pipes are arranged in a square manner. Therefore, the ventilation resistance between the heat radiation fins is reduced, and a lot of cooling wind 1210 can be supplied when the cooling is performed using the blower 1200, allowing for an efficient cooling of the semiconductor element group 1500.
Further, the L-shaped heat pipe 1730 is provided at the position of the most up-wind side, at the position of the most down-wind side, or at both of the up-wind side and down-wind side, and thereby, the heat receiving part 1731 of the L-shaped heat pipe 1730 can be provided outside the projection plane of the heat radiation fins 1750. Thereby, even if the semiconductor element group 1500 is provided outside the projection plane of the fins 1750, the heat can be efficiently transported to the heat radiation fins 1750 by the L-shaped heat pipe 1730, allowing for a downsizing and light-weighting of the heat radiation fins 1750.
Further, in the wind passage 1150, the plural rectification plates 1181, 1182 are provided at the up-wind side to the fins 1750, and thereby, the wind speed of the cooling wind 1210 to be supplied from the blower 1200 to the heat radiation fins 1750 can be equalized in the direction orthogonal to the flow of the cooling wind 1210. Therefore, even if the width of the heat radiation fins 1750 is large relative to the width of the supply opening of the blower 1200, the semiconductor element group 1500 can be efficiently cooled.
Further, in the wind passage 1150, the plural wind-leak prevention plates 1191, 1192, 1193, 1194 are provided in the direction orthogonal to the flow of the cooling wind 1210, between the heat radiation fin joined to the extreme pointed-end side of the heat radiation part 1722 of the heat pipe and the top plate 1130 configuring the wind passage 1150, and thereby, it is possible to prevent the cooling wind 1210 from leaking from between the heat radiation fins. Therefore, the semiconductor element group 1500 can be efficiently cooled. Moreover, the distance between the plural wind-leak prevention plates 1191, 1192, 1193, 1194 and the heat radiation fin 1750 joined to the pointed-end side of the heat radiation part 1722 of the heat pipe is shorter than the distance between the heat radiation fin 1750 joined to the pointed-end side and the pointed-end of the heat radiation part 1722 of the heat pipe. Thereby, it is possible to further reduce the volume of the cooling wind 1210 to leak from between the heat radiation fins.
Further, the wind-leak prevention plate 1194 serves also as the beam 1163 for keeping the strength in the wind passage 1150. Thereby, it is possible to decrease the number of components, and therefore, to achieve a cost reduction and an improvement of ease of assembly.
By the configuration, it is possible to efficiently cool the semiconductor element group 1500 by equalizing the temperature, and to mount the traction converter 1000 including the lightweight cooler, in a railway vehicle.
Next, a conventional art will be explained as a comparison to the first embodiment of the present invention.
Here, the relation between the temperature distribution of the surface of the heat radiation fin 1750 and the distance from the edge of the heat radiation fin is not linear. The closer to the up-wind side, the more drastically the temperature rises, and as going to the down-wind side, the temperature rises asymptotically to the maximum surface temperature of the heat radiation fin 1750. Therefore, the positions of the group gaps of the heat radiation fins 1750 are at a more up-wind side than positions at which the region for providing the heat radiation fins 1750 is evenly divided into three.
In the cooler described in
Next, for examining the effect of the first embodiment of the present invention, the temperatures of the respective semiconductor elements were calculated using generic thermal fluid analysis software. In the calculation, the heat radiation fin surface area at the down-wind region 1754 was set to a constant, and the heat radiation fin surface areas at the up-wind region 1752 and mid-wind region 1753 were changed for comparison. Further, the heat losses of the respective semiconductor elements of the semiconductor element group 1500 were set to a constant, and the change in pressure loss and cooling wind volume caused by the change in the number of the heat radiation fins 1750 was considered.
In the second embodiment of the present invention, since the heat radiation fin pitches at the respective regions have integral ratios, the ventilation resistances between the heat radiation fins are equal, and therefore the flow volume of the cooling wind can be equalized. In addition, the ventilation resistances can be decreased, and therefore the volume of the cooling wind from the blower is increased, allowing for an efficient cooling.
For examining the effect of the second embodiment of the present invention, the maximum temperature rise for the semiconductor element group was calculated using the generic thermal fluid analysis software.
In the configuration in which the two semiconductor element groups 1500 are provided in the cooling wind flow direction as the third embodiment of the present invention, the plural heat radiation fins 1750 are divided into two in the flow direction of the cooling wind 1210, and the heat radiation fin area at the up-wind region 1752, at which the temperature of the cooling wind 1210 is low, is smaller than that at the down-wind region 1754, at which the temperature of the cooling wind rises, that is, the number of the heat radiation fins is less than that at the down-wind region, and the heat radiation fin areas at the respective regions are set such that the temperatures of the respective semiconductor element groups 1500 are equalized. Thereby, it is possible to efficiently cool the semiconductor element groups 1500 in the lightweight device configuration.
For examining the effect of the third embodiment of the present invention, the temperatures of the respective semiconductor elements were calculated using the generic thermal fluid analysis software.
In the configuration in which the four semiconductor element groups 1500 are provided in the cooling wind flow direction as the fourth embodiment and fifth embodiment of the present invention, the plural heat radiation fins 1750 are divided into four in the flow direction of the cooling wind 1210, and the heat radiation fin surface areas at the most up-wind region 1751, up-wind region 1752, down-wind region 1754, at which the temperature of the cooling wind 1210 is low, are smaller than that at the most down-wind region 1755, at which the temperature of the cooling wind rises, that is, the numbers of the heat radiation fins are less than that at the most down-wind region, and the heat radiation fin surface areas at the respective regions are set such that the temperatures of the semiconductor element groups 1500 are equalized. Thereby, it is possible to efficiently cool the semiconductor element group 1500 in the lightweight device configuration.
Next, a conventional art will be explained as a comparison to the fourth embodiment and fifth embodiment of the present invention.
For examining the effect of the fourth embodiment and fifth embodiment of the present invention, the temperatures of the respective semiconductor elements were calculated using the generic thermal fluid analysis software.
In contrast, as for the fourth embodiment of the present invention, the temperature rise ratio for the semiconductor element 1510 at the most up-wind region is 0.69, the temperature rise ratio for the semiconductor element 1520 at the up-wind region is 0.73, the temperature rise ratio for the semiconductor element 1540 at the down-wind region is 0.83 and the temperature rise ratio for the semiconductor element 1550 at the most down-wind region is 0.91. Although there is a temperature dispersion of 22%, the temperature rise ratio for the semiconductor element 1550 at the most up-wind region decreases by 9% compared to the case where all the fin area ratios for the respective regions are 1.00. This is because the number of the heat radiation fins 1750 at the most up-wind region 1751, up-wind region 1752 and down-wind region 1754 is reduced, and thereby, the pressure loss decreases and the volume of the cooling wind to be supplied from the blower increases so that the temperature decreases as a whole.
Further, as for the fifth embodiment of the present invention, the temperature rise ratio for the semiconductor element 1510 at the most up-wind region is 0.95, and the temperature rise ratios for the semiconductor element 1520 at the up-wind region, the semiconductor element 1540 at the down-wind region and the semiconductor element 1550 at the most down-wind region are 0.97. Thus, the temperatures of the respective semiconductor elements are equalized.
Here, the cooler according to the fifth embodiment of the present invention is larger in temperature rise ratio by 6% but is smaller in cooler weight ratio by 15% than the cooler according to the fourth embodiment. Therefore, it is allowable to adopt the form shown in the fourth embodiment in the case of reducing the temperature rise preferentially, and adopt the form shown in the fifth embodiment in the case of reducing the cooler weight preferentially, and it is desirable to perform an appropriate selection depending on the required performance.
By such a configuration, some of the cooling wind 1210 is supplied to the down-wind region 1754 without receiving the heat at the up-wind region 1752 and mid-wind region 1753, and thereby, it is possible to inhibit the temperature rise of the semiconductor element 1540 at the down-wind region and to cool it efficiently.
The heat radiation part 1782 of the short-length heat pipe, in which the number of the heat radiation fins 1750 to be joined is less than the U-shaped heat pipe 1720 with the long heat radiation part, has a great heat resistance to the cooling wind 1210 and a great temperature difference from the cooling wind 1210. Therefore, by such a configuration, even if the temperature of the cooling wind 1210 is equal to or less than the solidifying point of the coolant within the heat pipe, the coolant does not freeze, and the semiconductor element group 1500 can be efficiently cooled.
In the case where the cooler is configured by only the short-length heat pipe 1780, the number of the heat radiation fins 1750 to be joined is less than the U-shaped heat pipe, and therefore, there is a fear that the cooling performance decreases when the temperature of the cooling wind 1210 is equal to or greater than the solidifying point of the coolant. However, by mixing the short-length heat pipe 1780, the U-shaped heat pipe 1720 and the L-shaped heat pipe 1730, it is possible to have both the cooling performance when the temperature of the cooling wind 1210 is equal to or less than the solidifying point and the cooling performance when it is equal to or greater than the solidifying point.
Further, in occurrence of a dryout in which the liquid or gas coolant in the heat pipe decreases by coolant freezing, the temperature of the base of the heat radiation part of the heat pipe rises with the temperature rise of the semiconductor element group 1500. The short-length heat pipe 1780, which has a shorter heat radiation part than the U-shaped heat pipe 1720 and the L-shaped heat pipe 1730, makes it possible to reduce the temperature difference between the base and pointed-end of the heat radiation part 1782, that is, to increase the temperature of the pointed-end. Therefore, even if a dryout occurs, the frozen coolant melts and thereby starts to move, allowing for an efficient cooling of the semiconductor element group 1500.
Here, in the first to eighth embodiments of the present invention, it has been described that the number of the heat radiation fins at the most down-wind region is 48, but the present invention is not limited to this, and an alteration may be appropriately performed. Further, the configuration in which the four semiconductor element groups 1500 are provided in the direction orthogonal to the cooling wind has been described, but the present invention is not limited to this, and an alteration can be appropriately performed depending on the circuit configuration.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2013-144102 | Jul 2013 | JP | national |
