Interconnect systems can include a transceiver that can include an optical engine, and a cable connected to the optical engine. The cable can include one or more fiber optic cables, copper cables, or a combination of the two. The transceiver can include a transceiver printed circuit board (PCB) and the optical engine can be mounted onto the transceiver PCB. The optical engine is configured to receive optical signals from the cable, and convert the optical signals to electrical signals. Further, the optical engine is configured to receive electrical signals, convert the electrical signals to optical signals, and transmit the optical signals along the cables. The interconnect substrate can include an IC chip that is configured to route and/or modify the electrical signals transmitted to and from the transceiver, including conditioning the electrical signals for protocol specific data transfers.
Interconnect systems can further include an electrical connector system including first and second electrical connectors that are mounted onto a host substrate. The first electrical connector can be disposed forward of the second electrical connector, and can thus be referred to as a front electrical connector. The second electrical connector can be referred to as a rear electrical connector. Further, the front electrical connector can be configured to route data signals at higher speeds than the second electrical connector. For instance, the first electrical connector can be configured to transmit electrical signals at data transfer speeds of at least 10 Gigabits per second. Electrical power can also be routed to the second electrical connector.
Each of the electrical connectors includes a respective connector housing and electrical contacts supported by the connector housing. The transceiver is configured to mate with the first and second electrical connectors. For instance, the front end of the interconnect substrate can be inserted along a forward direction into a receptacle of the first electrical connector so as to establish an electrical connection between the interconnect substrate and the electrical contacts of the first electrical connector. The electrical contacts of the second electrical connector can be configured as compression contacts, such that the interconnect PCB can be brought down onto the contacts so as to compress against them and mate the transceiver with the second electrical connector. Thus, the second electrical connector can be referred to as an electrical compression connector.
During operation, optical signals received by the interconnect module from the cable are converted to electrical signals. Ones of the electrical signals can be routed to the first electrical connector, while others of the electrical signals can be routed to the second electrical connector. For instance, high speed electrical signals can be routed to the first electrical connector, and low speed electrical signals can be routed to the second electrical connector. Conversely, electrical signals received by the interconnect module from the first and second electrical connectors are converted into optical signals and output along the optical cables. Of course, in embodiments whereby the cable includes electrically conductive cables, the interconnect module is configured to receive electrical signals from the electrically conductive cables, and transmit electrical signals to the cable. Various ones of the electrical signals can be routed to the first electrical connector, and various others of the electrical signals can be routed to the second electrical connector. Of course, if the cable includes only electrical cables, the transceiver could be provided without the optical engine.
In one aspect of the present disclosure, a latch can be configured to secure a daughter substrate to a host module having first and second electrical connectors that are mounted on a host substrate. The latch can include a latch body having a latch base and a latch finger that is supported by the latch base. The latch can be sized to fit between the daughter substrate and host substrate, such that the latch finger engages a corresponding latch engagement member of at least one of the daughter substrate and the host substrate to secure the daughter substrate to the host module after the daughter substrate has been mated to the first and second electrical connectors.
Referring to
The interconnect module 24 can be configured as any suitable module that is designed to establish an electrical connection with the first and second electrical connectors 28 and 30. As illustrated in
The interconnect substrate 32 can similarly define a first top surface and a second bottom surface that is opposite the top surface along the transverse direction. The bottom surface of the interconnect substrate 32 can face the top surface of the host substrate 26 when the interconnect substrate 32 is mated with the host module 22. The interconnect module 24 can further include an optical engine can be disposed on the top surface of the interconnect substrate 32, for instance when the interconnect substrate 32 is configured as an optical transceiver. The bottom surface of the interconnect substrate 32 can be said to be spaced from the top surface of the interconnect substrate 32 along the downward direction. Conversely, the top surface of the interconnect substrate 32 can be said to be spaced from the bottom surface of the interconnect substrate 32 along the upward direction.
In this regard, reference to mating with the first and second electrical connectors can be used interchangeably with mating with the host module 22 or host substrate 26, and vice versa. In one example, the interconnect module 24 can be configured as a transceiver. Thus, the interconnect substrate 32 can also be referred to as a transceiver substrate. In one example, the transceiver can be configured as an optical transceiver. Alternatively or additionally, the transceiver can be configured as an electrical transceiver. In one example, the interconnect module can be a FireFly™ optical transceiver manufactured by Samtec Inc. or a COBO compliant optical transceiver. Thus, the host module 22 can be configured to mate with a FireFly™ optical transceiver manufactured by Samtec Inc. or a COBO compliant optical transceiver. When the host module 22 is configured to mate with the FireFly™ optical transceiver, the first electrical connector 28 can be a UEC5 connector manufactured by Samtec Inc. having a principal place of business in New Albany, Ind., and the rear connector 30 can be a UCC8 connector manufactured by Samtec Inc.
Described herein are apparatus and methods that are configured to secure the interconnect module 24 to the host module 22 when the interconnect module 24 is mated to the host module 22. Also described herein are thermal bridges to provide a low impedance thermal path between the interconnect substrate 32 and the host substrate 26. That is, the thermal path can have a lower impedance than the impedance from the interconnect substrate to the host substrate without the thermal bridge.
As illustrated in
The interconnect system 20 can include a latch 36 that is disposed in the gap 34. The latch 36 can be configured to secure the host module 22 to the interconnect module 24. The gap 34 can define any suitable vertical distance or height from the bottom of the interconnect substrate 32 and the top of the host substrate 26 as desired. For instance, the height can range from approximately 1 mm to approximately 3 mm. The term “approximate” and “substantial” and derivatives thereof as used herein recognizes that the referenced dimensions, sizes, shapes, directions, or other parameters can include the stated dimensions, sizes, shapes, directions, or other parameters and up to ±20%, including ±10%, ±5%, and ±2% of the stated dimensions, sizes, shapes, directions, or other parameters. It should be appreciated that while vertical distances of the gap 34 have been described above, larger and smaller gaps are possible.
The latch 36 can be disposed on the top surface of the host substrate 26 between the first and second connectors 28 and 30 without securing the latch 36 to any components of the host module 22. Thus, the first and second connectors 28 and 30 can prevent the latch 36 from traveling off the host substrate 26 along the longitudinal direction. When the latch 36 is engaged with the interconnect substrate 32, interference between the interconnect module 24 and the host module 22 can prevent the latch 36 from travelling off of the host substrate 26. In one example, the latch 36 can be attached to the host substrate 26 in any manner desired. The latch 36 can have a latch body 52 that can include a latch base 55 and at least one latch arm 38 that extends out from the latch base 55. The latch base 55 can define a substantially planar top surface and a substantially planar bottom surface opposite the substantially planar top surface. The at least one latch arm 38 can be configured to be displaced with respect to the latch base 55 toward the host substrate 26 as the interconnect substrate 32 is inserted into the host module 22. In one example, the at least one latch arm 38 can be cantilevered from the latch base 55. The latch 36 can further include at least one engagement member such as a latch finger 40 that is supported by the latch base 55. For instance, as described in more detail below, the latch finger 40 can extend out from the latch base 55. In another example, the latch finger 40 can extend out from the latch arm 38 that, in turn, extends out from the latch base 55. In one example, the latch finger 40 can extend out from a distal end of the latch arm 38 that is opposite the latch base 55. In one example, the latch finger 40 can be deflectable. In particular, the latch arm 38 that can be resiliently flexible. The deflectable latch finger 40 can be said to extend out with respect to each of the latch arm 38 and the latch body 52 with respect to the transverse direction T. For instance, the deflectable latch finger 40 can be said to extend out with respect to each of the latch arm 38 and the latch body 52 with respect to the transverse direction T when the latch arm 38 is unflexed. Alternatively, as described in more detail below (see, e.g.,
During operation, as the interconnect substrate 32 is pressed forward into the first electrical connector 28, the latch finger 40 can ride along the bottom surface of the interconnect substrate 32. The latch finger 40 can be carried by the latch arm 38. The latch arm 38 can be deflected from a neutral position as the latch finger 40 rides along the bottom surface of the interconnect substrate 32. Thus, when the latch arm 38 is in the deflected position, the latch arm 38 can provide a biasing force that biases the latch finger 40 upward as it rides along the bottom surface of the interconnect substrate 32. When the interconnect substrate 32 is fully inserted into the first connector 28, the resilient flexibility of the latch arm latch arm 38 can cause the latch arm 38 to be displaced upward toward the neutral position, thereby causing the latch finger 40 to correspondingly move upward and engage a complementary latch engagement member of the interconnect substrate 32, thereby securing the interconnect substrate 32 to the latch 36. In one example, the complementary latch engagement member can be configured as a latch aperture 42 of the interconnect substrate 32 that is configured to receive the latch finger 40. The latch finger 40 can thus contact a surface of the interconnect substrate 32 that at least partially defines the latch aperture 42, thereby preventing the interconnect substrate 32 from traveling in a rearward direction, or backing out, a sufficient distance that would cause the interconnect substrate 32 unmate from the host module 22. Thus, the latch finger 40 is deflectable between a closed position and an open position. In the closed position, the latch finger 40 is positioned to be inserted in the latch aperture 42. In the open position, the latch finger 40 is positioned to be removed from the latch aperture 42. Thus, the latch 36 can be releasably secured to the interconnect substrate 32. The latch finger 40 can be naturally biased to the closed position. That is, the latch arm 38 can bias the latch finger 40 to be in the closed position absent an external force that urges the latch finger 40 to the open position. Thus, in one example, the latch arm 38 can drive the latch finger into the latch aperture 42. For instance, the latch arm 38 can be flexible and resilient, such that deflection of the latch arm 38 in the downward direction causes the latch arm 38 to apply a force that biases the latch finger 40 to move in the upward direction. The latch arm 38 can be resiliently deflected downward as the latch finger 40 rides along the bottom surface of the interconnect substrate 32.
In one example, with reference now to
It should be appreciated that at least a portion of the latch 36 up to an entirety of the latch, and all latches disclosed herein, can be made of a thermally conductive material. Thus, the latch 36 can define a thermal bridge of the type described below that can provide a low impedance thermal conductive path that extends from the interconnect substrate 32 to the host substrate 26 when the interconnect module 24 is secured to the host module 22. The latch 36 can further be resiliently compressible such that the thermally conductive material is in reliable contact with both the interconnect substrate 32 and the host substrate 26 when the interconnect module 24 is mated to the host module 22 as described below. The thermally conductive material can further define a thermally conductive path from interconnect substrate 32 to the host substrate 26.
As illustrated in
Referring now to
Whether the interconnect substrate 32 is able to move in the rearward direction an amount insufficient to cause the interconnect substrate 32 to unmate from either of the first and second electrical connectors 28 and 30 when the latch 36 has engaged the interconnect substrate 32, or whether the interconnect substrate 32 is unable to move in the rearward direction, it can be said that the latch is configured to at least limit movement of the interconnect substrate 32 in the rearward direction. In some examples, the latch 36 can be further configured to prevent movement of the interconnect substrate 32 in the rearward direction.
As described above, the latch 36 may be attached to the host substrate 26. Alternatively, the latch 36 may simply be situated on the host substrate 26 between the front and rear connectors, and unattached to the host substrate 26. Alternatively yet, the latch 36 can be constrained by but unattached to the host substrate 26.
In this regard, the latch 36 can include a latch body 52, and the at least one attachment peg 48 can extend out from the latch body 52 along the transverse direction T. Thus, the attachment peg 48 can extend down into the attachment aperture 50. For instance, the attachment peg 48 can extend out from the latch base 55. The latch arm 38 can extend out from the latch base 55 in the manner described above. In particular, the latch arm 38 can extend in the rearward direction from the latch base 55. The latch 36 can be held in place on the host substrate 26 with respect to movement in a plane that is defined by the longitudinal direction L and the lateral direction A. Thus, the latch 36 is constrained with respect to movement along the top surface of the host substrate 26, which is oriented in the plane defined by the longitudinal direction L and the lateral direction A. The latch 36 is movable upward in a direction away from the top surface of the host substrate 26 so as to remove the latch 36 from the host substrate 26. Thus, in one example, the latch 36 can be releasably attached to the host substrate 26. When the latch 36 is attached to the host substrate 26 and latched to the interconnect substrate 32, the interconnect substrate 32 prevents the latch from being moved upward, effectively preventing removal of the latch 36 from the host substrate 26. In another example, the latch 36 can be permanently attached to the host substrate 26 as to prevent removal of the latch 36 from the host substrate 26 without damage to a component or compromising attachment of the latch 36 to the host substrate 26. In one example, the latch 36 can be permanently attached to the host substrate 26 by press-fitting the attachment pegs 48 into the attachment apertures 50, or soldering, epoxying or using any other attachment method to permanently attach the latch 36 to the host substrate 26. In this regard, it should be appreciated that the latch 36 and the host module 22 can include complementary attachment members that are configured to engage each other so as to attach the latch 36 to the host module 22.
The latch arms 38 may take many forms.
The latch 36 can also be configured to retain a thermal bridge as described in more detail below. In one example, the latch 36 can define a retention aperture 54 that extends therethrough and is configured to retain a thermal bridge. In one example, the retention aperture 54 can extend through the latch body 52 along the transverse direction T. As will be appreciated from the description below, the thermal bridge can provide a low impedance thermal conductive path that extends from the interconnect substrate 32 to the host substrate 26 through the thermal bridge. Alternatively, as described above, the latch 36 can define a thermal bridge.
In another example illustrated in
In one example, the first and second directions can be oriented along the transverse direction T (which can be vertical when the host substrate is horizontally oriented). For instance, the first direction can be defined by the downward direction, and the second direction can be defined by the upward direction. Thus, the at least one latch finger 40 can ride along the bottom surface of the interconnect substrate 32 as the interconnect substrate 32 is inserted into the host module 22. The latch arms 38 can then drive the latch fingers 40 to move in the upward direction into the latch aperture 42 of the interconnect substrate 32 when the latch aperture 42 is aligned with the at least one finger 40 along the transverse direction T, thereby securing the interconnect substrate 32 to the host module 22.
While various examples herein describe the latch 36 as configured to attach to the host substrate 26, and secure to the interconnect substrate 32 once the interconnect substrate 32 has been mated with the first and second electrical connectors 28 and 30, it should be appreciated that the latch 36 can be alternatively be configured to attach to the interconnect substrate 32, and secure to the host substrate 26 once the interconnect substrate 32 has been mated with the first and second electrical connectors 28 and 30. For instance, the latch 36 can be secured to the interconnect substrate 32, and positioned such that the latch arm 38 is displaced upward toward the interconnect substrate 32 as the interconnect substrate 32 is inserted into the host module 22. In particular, as the interconnect substrate 32 is pressed forward into the first electrical connector 28, the latch finger 40 can ride along the top surface of the host substrate 26. When the interconnect substrate 32 is fully mated with the host module 22, the latch arm 38 can be displaced downward, thereby inserting the latch finger 40 into a latch engagement member of the host substrate 26, thereby securing the latch member, and thus securing the interconnect substrate 32, to the host substrate 26. The latch engagement member of the host substrate 26 can be configured as a latch aperture as described above. Thus, the latch aperture of the host substrate 26 can be configured as a notch or an enclosed through-hole. Further, in this example, the first direction can be defined by the upward direction, and the second direction can be defined by the downward direction. In one example, the latch arm 38 can be flexible and resilient, such that deflection of the latch arm 38 in the upward direction causes the latch arm 38 to apply a force that biases the latch finger 40 to move in the downward direction. The latch arm 38 can be resiliently deflected upward as the latch finger 40 rides along the top surface of the host substrate 26. Thus, it can be said that the latch 36 can be configured to attach to one of the host substrate 26 and the interconnect substrate 32, and can be configured to secure to the other of the host substrate 26 and the interconnect substrate 32, thereby securing the interconnect module 24 to the host module 22.
Referring now to
The latch 36 and the securement member 35 of the electrical connector 28 can define a position and height along the transverse direction so as to be disposed in the gap between the host substrate 26 and the interconnect substrate when the interconnect substrate is mated with the host module 22. Thus, the securement member 33 can include a pair of latch fingers that are biased away from each other so as to secure in the slots of the securement member 35 of the electrical connector 28. In this regard, it should be appreciated that the latch 36 can be secured to the host module 22 either by securing to the host substrate 26 as described above, or by securing to one of the electrical connectors 28 and 30 of the host module. The latch 36 can further include at least one latch finger 40 as described above so as to secure to the interconnect substrate when the interconnect substrate is mated with the host module 22 as described above.
As illustrated in
As described above, in some examples the latch 36 can be placed between the first and second electrical connectors 28 and 30 prior to mating of the interconnect substrate 32 with the host module 22. In other examples, the latch 36 may be placed between the interconnect substrate 32 and host substrate 26 after the interconnect substrate 32 has been mated with the first and second electrical connectors 28 and 30. Because these latches 36 are inserted between the interconnect substrate 32 and the host substrate 26 along the lateral direction A, these latches can be referred to as side insertion latches. During operation, the interconnect substrate 32 can be mated with the host module 22. Next, the latch 36 can be inserted between the host substrate 26 and the interconnect substrate 32 so as to at least limit travel of the interconnect substrate 32 in the rearward direction with respect to the host module 22, thereby securing the interconnect substrate 32 to the host module 22. For instance, as illustrated in
During operation, the interconnect substrate 32 is first mated with the first and second electrical connectors 28 and 30 in the manner described above. The latch 36 can then be positioned between the interconnect substrate 32 and the host substrate 26 at a location between the first and second electrical connectors 28 and 30. In particular, the latch 36 can be moved substantially along the lateral direction A between the host substrate 26 and the interconnect substrate 32. In one example, the latch 36 can be moved in a lateral direction A that is substantially the same direction as the latch arm 38 is cantilevered from the latch body 52 so as to position the latch finger 40 to engage the latch aperture 42 (see
In another example, the at least one fixed finger 56 can be replaced by at least one deflectable latch finger 40 that extends from a cantilevered latch arm 38 in the manner described above. Thus, each of the latch fingers 40 can deflect in the first direction. Accordingly, when the first direction is the downward direction, the latch finger 40 can ride along the bottom surface of the interconnect substrate 32. When the latch fingers 40 move to a position aligned with respective ones of the latch apertures 42 of the interconnect substrate 32, the latch fingers 40 can be driven up into the respective latch apertures 42. Alternatively, when the first direction is the upward direction, the latch fingers 40 can ride along the top surface of the host substrate 26. When the latch fingers 40 move to a position aligned with respective ones of the latch apertures of the host substrate 26, the latch fingers 40 can be driven down into the respective latch apertures of the host substrate 26. One or more of the latch arms 38 can be cantilevered along the lateral direction A. Alternatively, one or more others of the latch arms 38 can be cantilevered along the longitudinal direction L.
Thus, it can be said that the latch 36 can be driven along the lateral direction A between the host substrate 26 and the interconnect substrate 32 until a first latch finger is aligned with a respective one of a plurality of latch apertures. The first latch finger can be defined by a deflectable latch finger 40. Once the first latch finger is aligned with the respective one of the plurality of latch apertures, one or more other latch fingers can also be driven into respective ones of one or more other latch apertures. The latch apertures can be defined by one or more notches of the type described above. Alternatively, the latch apertures can be defined by enclosed through-holes. The latch apertures can be defined by one or both of the host substrate 26 and the interconnect substrate 32. Thus, one or more of the latch fingers 40 can extend up from the respective latch arm 38. Alternatively or additionally, one or more of the latch fingers 40 can extend down from the respective latch arm 38. Similarly, one or more of the fixed fingers 56, if present, can extend up from the latch body 52 so as to be driven into notches 44 of the host module in the manner described above. Alternatively or additionally, one or more of the fixed fingers 56 can extend down from the latch base 55 so as to be driven into notches of the interconnect substrate 32 as desired.
It is contemplated that the latch 36 can be constructed in accordance with numerous examples so as to operate in the manner described herein. For instance, in one example illustrated in
Referring now to
If the latch 36 includes a single deflectable finger 40 and the fixed finger 56 described above, the actuator tool 134 can depress the single deflectable latch finger 40 so as to urge the single deflectable latch finger 40 to the open position. The latch 36 may then be removed out from between the host substrate 26 and interconnect substrate 32 in a removal direction. The removal direction can be defined substantially along lateral direction A. In one example, the removal direction can be defined by a direction from side of the latch having the deflectable latch finger 40 to the side of the latch 36 having the fixed latch finger 56. In this regard, it should be appreciated that the removal direction can be angled with respect to the lateral direction A. Once the latch 36 has been removed, the interconnect substrate 32 can be moved in the rearward direction so as to unmate the interconnect substrate from at least the first electrical connector 28. Rearward movement of the interconnect substrate 32 can be achieved by pulling it out in a substantially longitudinal direction L.
Thus, it can be said that the actuator tool 134 can be configured to urge at least one deflectable latch finger 40 to the open position so as to remove the at least one latch finger 40 from the respective at least one latch aperture 42 of the interconnect substrate 32. Alternatively or additionally, the actuator tool 134 can be configured to apply a rearward force to the interconnect module 24 that urges the interconnect module 24 to move in the rearward direction, thereby unmating the interconnect substrate 32 from the electrical connectors 28 and 30. For instance, the actuator tool 134 can apply the rearward force to the interconnect substrate 32. Alternatively or additionally still, the actuator tool 134 can apply a forward force to the interconnect module 24 that urges the interconnect module 24 to move in the forward direction, thereby mating the interconnect substrate 32 to the first the electrical connector 28 alone or in combination with the second electrical connector 30. For instance, the actuator tool 134 can apply the forward force to the interconnect substrate 32.
Referring now also to
The at least one projection 138 can include at least one latch engagement projection 140 that is configured to apply the force to the deflectable latch finger 40 that urges the at least one latch finger 40 to the open position against the biasing force of the latch arm 38. In one example, the at least one latch engagement projection 140 can include a plurality of latch engagement projections 140. For instance, the actuator tool 134 can include any number of latch engagement projections 140 as desired that are configured to urge the deflectable latch fingers 40 to the open position. Thus, during operation, the at least one latch engagement projection 140 can be aligned with the respective at least one latch finger 40 along the transverse direction. Movement of the at least one latch engagement projection 140 in the downward direction provides the force that urges the at least one deflectable latch finger 40 to the open position. The at least one projection 140 can move downward by moving the actuator body 136 downward. Alternatively, the at least one projection 140 can be telescopically movable downward. In one example, the at least one latch engagement projection 140 can include first and second latch engagement projections 140 that are opposite each other along the lateral direction. For instance, the first and second latch engagement projections 140 can be aligned with each other along the lateral direction A.
The at least one projection 138 can include at least one biasing projection 142 that is configured to apply a force that urges the interconnect substrate 32 to move in at least one of the forward direction and the rearward direction. For instance, the at least one biasing projection 142 can abut a corresponding at least one engagement surface 144 of the interconnect module 24. The at least one engagement surface 144 can be defined by the interconnect substrate 32. Alternatively, the at least one engagement surface 144 can be defined by any alternative structure of the interconnect module 24. The at least one engagement surface 144 can be configured as a rearward engagement surface 146 that is adjacent the at least one biasing projection 142 in the rearward direction. The at least one rearward engagement surface 146 can face at least partially forward so as to generally face the at least one biasing projection 142. When the at least one biasing projection 142 is aligned with the rearward engagement surface 146 along the longitudinal direction L, movement of the actuator tool 134 causes the at least one biasing projection 142 to apply the force to the interconnect module 24 in the rearward direction that urges the interconnect substrate 32 to move in the rearward direction as described above. For instance, the at least one biasing projection 142 can abut the rearward engagement surface 146. The at least one biasing projection 142 can be aligned with the rearward engagement surface 146 along the longitudinal direction L by moving the actuator tool 134 downward. Alternatively, the at least one biasing projection 142 can be telescopically movable downward as described above.
The at least one biasing projection 142 can further be configured to apply a force that urges the interconnect substrate 32 to move the forward direction. For instance, the at least one engagement surface 144 of the interconnect module 24 can include a forward engagement surface 148 is adjacent the at least one biasing projection 142 in the forward direction. The at least one forward engagement surface 148 can face at least partially rearward so as to generally face the at least one biasing projection 142. When the at least one biasing projection 142 is aligned with the forward engagement surface 148 along the longitudinal direction L, movement of the actuator tool 134 causes the at least one biasing projection 142 to apply the force to the interconnect module 24 in the forward direction that urges the interconnect substrate 32 to move in the forward direction as described above. For instance, the at least one biasing projection 142 can abut the forward engagement surface 148. The at least one biasing projection 142 can be aligned with the forward engagement surface 148 along the longitudinal direction L by moving the actuator tool 134 downward. Alternatively, the at least one biasing projection 142 can be telescopically movable downward. It should be appreciated that the at least one biasing projection 142 can include a plurality of biasing projections 142. For instance, the at least one biasing projection 142 can include first and second biasing projections 142 that can be spaced from each other along the lateral direction A. For instance, the first and second biasing projections 142 that can be aligned with each other along the lateral direction A.
It should be appreciated that the at least one biasing projection 142 can include at least one single biasing projection 142 that is configured to apply the forward and rearward forces, selectively, to both the forward engagement surface 148 and the rearward engagement surface 146. In this regard, the interconnect substrate 32 can include at least one aperture 143 (see
Alternatively, the at least one biasing projection 142 can include a forward biasing projection and a separate rearward biasing projection. The forward biasing projection can be configured to apply the biasing force to the forward engagement surface 148, and the rearward biasing projection can be configured to apply the biasing force to the rearward engagement surface 146. The forward engagement surface 148 and the rearward engagement surface 146 can thus be defined by separate apertures or pockets that extends through the interconnect substrate 32 along the transverse direction T. Alternatively, the forward engagement surface 148 and the rearward engagement surface 146 can thus be defined by the same aperture or pocket that extends through the interconnect substrate 32 along the transverse direction T and is elongate so as to receive the forward and rearward biasing projection 142.
With continuing reference to
In one example, the at least one stabilizing projection 150 can include a plurality of stabilizing projections 150. For instance, the at least one stabilizing projection 150 can include first and second stabilizing projections that are spaced from each other along the lateral direction A. In one example, the first and second stabilizing projections can be aligned with each other along the lateral direction A. Similarly, in one example, the at least one stabilization surface 152 can include a plurality of stabilization surfaces 152. For instance, the at least one stabilization surface 152 can include first and second stabilization surfaces 152 that are spaced from each other along the lateral direction A. In one example, the first and second stabilization surfaces 152 can be aligned with each other along the lateral direction A.
In one example, the at least one latch engagement projection 140 can be disposed between the at least one biasing projection 142 and the at least one stabilizing projection 150 along the longitudinal direction L. For instance, the at least one latch engagement projection 140 can be disposed closer to the at least one biasing projection 142 than to the at least one stabilizing projection 150 along the longitudinal direction. The at least one biasing projection 142 can be spaced from the at least one latch engagement projection 140 in the forward direction. Alternatively, the at least one biasing projection 142 can be spaced from the at least one latch engagement projection 140 in the rearward direction. In this regard, it should be appreciated that the projections 140, 142, and 150 can be arranged in any manner as desired. In this regard, the at least one projection 138 can define first and second third pairs of projections, wherein the projections of each pair of are aligned with each other along the lateral direction A. Further the pairs are spaced from each other along the longitudinal direction L. The forward pair can define the forward pair and the rearward biasing projections. The middle pair can define the latch engagement projections. The rear pair can define the forward biasing projections. It is recognized that the at least one latch engagement projection 140, the at least one biasing projection 142, and the at least one stabilizing projection can be arranged in any suitable alternative arrangement as desired.
In some examples, the latch 36 can be made from plastic or other suitable material. For instance, as described above, the latch 36 can be made from any suitable thermally conductive material as described herein. It is recognized that the latch 36 can present several advantages. For instance, the latch 36 can be sized relatively small, with little mass. Further, the latch 36 can be manufactured at low-cost, and can be formed from molded or injected plastic in some examples. As will be described in more detail below, however, the latch 36 can alternatively be metal. Further, the latch 36 can be fully captured between the interconnect substrate 32 and the host substrate 26. Thus, in some examples, the latch 36 is contained within the footprint of one or both of the host substrate 26 and the interconnect substrate 32 along a respective plane that is defined by the longitudinal direction L and the lateral direction A. The latch 36 can further be easy to prototype, or in some instances manufacture, using 3D printing technology.
While the latch 36 can be made from a thermally insulative material such as plastic, the latch 36 can alternatively, be made from metal or an alternative material having a high thermal conductivity. The latch 36 can further include one or more features or insert(s) that are configured to conduct heat from the interconnect substrate 32 to the host substrate 26. Such features are described in more detail below. Thus, in some examples, the latch 36 can allow a high thermal conductivity path between the interconnect substrate 32 and host substrate 26.
Further, the latch has been described as having at least one latch finger configured to engage one of the interconnect substrate 32 and the host substrate 26. The at least one latch finger can include at least one movable latch finger that is movable with respect to the latch base. The movable latch finger can be configured as the deflectable latch finger 40 that is supported by a corresponding at least one deflectable latch arm 38, as described above. It is recognized, however, that the movable latch finger can be alternatively constructed as desired. For instance, at least one of the movable fingers up to all of the movable latch fingers can be configured as a telescopic latch finger. The telescopic latch finger embedded in the latch body 52 in a retracted position, and can be telescopically movable along the transverse direction T to an extended position whereby the telescopic latch finger extends out from the latch body 52. Thus, the latch aperture 42 can be brought into alignment with the telescopic latch finger when the interconnect substrate 32 is mated with the host module 22 while the telescopic latch finger is in the retracted position. The telescopic latch finger can then be moved to the extended position whereby the telescopic latch finger extends into or through the latch aperture 42, thereby preventing the interconnect module from backing out as described above. The telescopic latch finger can be disposed in the latch base 55 as desired. In this regard, the latch body 52 can include the latch base and at least one latch finger supported by the latch base, and no latch arms 38 in some examples. Thus, it should be appreciated that one or more up to all of the deflectable latch fingers 40 described herein can alternatively be configured as respective telescopic latch fingers. Alternatively or additionally, the fixed latch fingers 56 described herein can alternatively be configured as telescopic latch fingers. The attachment peg 48 described above can similarly be configured as a telescopic latch peg that is movable from a retracted position to an extended position.
It should be appreciated that the interconnect substrate 32 may be used in an optical transceiver, optical receiver or optical transmitter, each having at least one optical engine that is mounted onto the interconnect substrate 32. Alternatively, the interconnect substrate may be used in an electrical transceiver, electrical receiver, electrical transmitter, optical or electrical cables, or a cable connector. More generally the interconnect substrate 32 may be referred to as a daughter substrate. Thus, the latch 36 can be used to secure the daughter substrate to first and second electrical connectors mounted on a host substrate, where the first and second electrical connectors are separated in a longitudinal direction L and the daughter substrate is inserted into the first electrical connector in the longitudinal direction. Advantageously the footprint of the latch does not extend past that of the daughter substrate in certain examples. This allows components to be placed on the host substrate 26 adjacent the first and second electrical connectors without interfering with the latch 36. Also, in some examples, the latch 36 does not extend above the daughter substrate along the transverse direction T, thereby allowing placement of other elements, such as an adjacent PCB, in this region. In other words, the latch 36 does not extend above the transceiver, receiver, or transmitter, in some examples.
As disclosed above, the latch 36 may contain features that facilitate heat transfer between the interconnect substrate 32 and host substrate 26. Generally, the latch 36 alone or in combination with or other thermally conductive elements can define a thermal bridge between the interconnect substrate 32 and host substrate 26. The thermal bridge can be operable to transfer or dissipate heat from the interconnect module 24, such as an optical transceiver, to the host substrate 26 that supports the first and second electrical connectors 28 and 30. It will be appreciated that the thermal bridge of the type described herein can create a thermally conductive path from and to any two surfaces. The two surfaces can be oriented parallel to each other. Such surfaces can be, but not limited to, a surface of a printed circuit board, a housing, a cold plate, a heatsink, a chip package having an integrated circuit, or the like.
The thermal bridge can be resiliently compressible so as to be in contact with both the interconnect substrate 32 and the host substrate 26 when the interconnect module 24 is mated to the host module 22 as described below. In particular, it is recognized that the second electrical connector 30 can be configured as a compression connector whose electrical contacts can compress along the transverse direction as the interconnect substrate 32 is brought down on to the second electrical connector 30. In this regard, the rear end of the interconnect substrate 32 can be brought down against the electrical contacts of the second electrical connector 30 along the transverse direction T as the front end of the interconnect substrate 32 is received in the receptacle of the first electrical connector 28 along the longitudinal direction L so as to mate the interconnect substrate 32 with the first electrical connector 28. As the rear end of the interconnect substrate is brought down against the electrical contacts of the second electrical connector 30, the electrical contacts compress, thereby applying an upward force to the rear end of the interconnect substrate 32. Once the interconnect substrate 32 is fully mated with the first electrical connector 28, the electrical contacts of the second electrical connector 30 can urge the rear end of the interconnect substrate 32 upward away from the host substrate 26. Thus, the thermal bridge can desirably be configured to contact both the host substrate 26 and the interconnect substrate 32 when the interconnect substrate 32 is fully mated with the first electrical connector 28. However, it should be appreciated that the thermal bridge can be resiliently compressible. Thus, the thermal bridge can resiliently compress along the transverse direction when the rear end of the interconnect substrate 32 is brought down against the electrical contacts of the second electrical connector 30 as the interconnect substrate 32 is being mated with the first electrical connector 28. When the rear end of the interconnect substrate 32 is subsequently urged upward away from the host substrate 26 when the interconnect substrate 32 is fully mated with the first electrical connector 28, the thermal bridge can remain in contact with the interconnect substrate 32 and maintain a contact force against the interconnect substrate 32. Similarly, when the front end of the interconnect substrate 32 is urged upward away from the host substrate by the electrical contacts of the front electrical connector as until reaches an equilibrium position in the receptacle of the front electrical connector 28, the thermal bridge can remain in contact with the interconnect substrate 32 and maintain a contact force against the interconnect substrate 32.
Referring to
The thermal bridge may be combined with or integrated with any of the latches described herein. Thus, it can be said that the interconnect system 20 can include the thermal bridge 60. In some examples, it can be said that the latch 36 can include the thermal bridge 60. The thermal bridge 60 may be installed prior to the installation of the latch 36 or may be installed as part of the installation of the latch 36. The host substrate 26 may have thru hole conductive vias or thermal dissipation layers in the region of the host substrate 26 adjacent the thermal bridge to facilitate transfer of heat from the thermal bridge 60 away from the interconnect module 24.
It is therefore desirable to provide robust mechanical contact between the thermal bridge 60 and the bottom surface of the interconnect substrate 32 to provide a reliable conductive heat transfer path. Similarly, it is desirable to provide robust mechanical contact between the thermal bridge 60 and the top surface of the host substrate 26 to provide a reliable conductive heat transfer path. As will be appreciated from the description below, the thermal bridge 60 can be slidable relative to at least one of the bottom surface of the interconnect substrate 32 and the top surface of the host substrate 26 during installation of the thermal bridge 60. The thermal bridge 60 described herein can be both slidable relative to at least one of the bottom surface of the interconnect substrate 32 and the top surface of the host substrate 26, while also providing for robust thermal contact with each of the host substrate 26 and the interconnect substrate 32. In one example, the thermal bridge 60 can be compliant along the transverse direction T. Various systems and methods for achieving thermal bridge compliance are described below. Further, it is appreciated that the compression force that the thermal bridge 60 applies against the host substrate 26 and the interconnect substrate 32 can be controlled. For instance, the force can be sufficiently high to provide reliable thermal contact between the thermal bridge 60 and each of the interconnect substrate 32 and the host substrate 26. On the other hand, the force can be sufficiently low so as to not mechanically strain the structural integrity of the electrical connectors 28 and 30, the connector solder joints to the host substrate 26 or the electrical contacts with the interconnect substrate 32. Further, the thermal bridge 60 can conform to small misalignments in the parallelism or flatness of the top surface of the host substrate 26 and the bottom surface of the interconnect substrate 32.
Referring now to
While the thermal bridge 60 can be mounted to the host substrate 26 in one example, the thermal bridge 60 can alternatively be mounted to the interconnect substrate 32 if desired. Thus, while the mounting apertures 68 extend into or through the host substrate 26 in one example, the mounting apertures 68 can alternatively extend into or through the interconnect substrate 32. Alternatively still, the mounting apertures 68 can extend into or through both the host substrate 26 and the interconnect substrate 32. First ones of the projections 66 can thus extend upward, while second ones of the projections 66 extend down. Thus, the latch engagement projections 66 can extend into the mounting apertures of the interconnect substrate 32, and the biasing projections 66 can extend into the mounting apertures of the host substrate 26. Thus, it can be said that the thermal bridge 60 can be mounted to at least one substrate that can be defined by one or both of the host substrate 26 and the interconnect substrate 32. For instance, the cup 64 can include projections 66 that extend into mounting apertures of at least one of the host substrate 26 and the interconnect substrate 32, so as to position the thermal bridge 60 between the interconnect substrate 32 and the host substrate 26.
As described above, the thermal pad 62 can be compressible along the transverse direction T. Thus, when the thermal bridge 60 is positioned between the interconnect substrate 32 and host substrate 26, the thermal pad 62 can compress along the transverse direction T. In particular, the cup body 65 can apply a compressive force F against the thermal pad 62 when the cup body 65 is mounted to the at least one of the interconnect substrate 32 and the host substrate 26. The top surface of the cup 64 can be in robust mechanical contact with the bottom surface of the interconnect substrate 32. Simultaneously, the bottom surface of the thermal pad can be in robust mechanical contact with the top surface of the host substrate 26. Further, the top surface of the thermal pad can be in robust mechanical contact with the cup body 65. Alternatively, the cup 64 can be configured such that a bottom surface of the cup 64 is in robust mechanical contact with the top surface of the host substrate 26, and the top surface of the thermal pad can be in robust mechanical contact with the bottom surface of the interconnect substrate 32.
The cup 64 can have a height that is selected such that the cup 64 does not bottom out against the substrate to which the cup 64 is mounted over the full range of expected mechanical tolerance in the height of the gap 58. Further, the elastic thermal pad 62 can have a volume that is selected to define a horizontal gap between the thermal pad 62 and the cup body 65. Thus, the thermal pad 62 can be expandable along the horizontal direction as the pad 62 is compressed along the transverse direction T due to Poisson's effect. Poisson's effect is depicted in the figure by the horizontally extending arrows from the elastic thermal pad 62. An advantage of enclosing the thermal pad in the cup 64 is to avoid subjecting the thermal pad 62 to shear forces that might otherwise damage the pad 62 if the thermal bridge 60 slides against the substrate to which the thermal bridge 60 is mounted during installation of the thermal bridge 60. Metal may be selected as the material of the cup 64, since it is easily formed and has high thermal conductivity. It should be appreciated, however, that any suitable thermally conductive material can be used.
Referring now to
The substantial planarity of the upper and bottom surfaces of the spring clip 70 may allow for reliable mechanical contact between the spring clip 70 and both the interconnect substrate 32 and host substrate 26, thereby facilitating heat transfer from the interconnect substrate 32 to the host substrate 26. In particular, a direct heat conduction path exists in the spring clip 70 from the interconnect substrate 32 to the host substrate 26. The spring clip 70 can be fabricated from any suitable thermally conductive material as desired. For instance, the spring clip 70 can be fabricated from any suitable metal. In one example, the spring clip 70 is formed from a high thermal conductivity metal, such as aluminum, copper, beryllium copper, or an engineered material like, graphite-copper or graphite aluminum.
The spring clip 70 may take the form of any suitable shape as desired. The spring clip 70 can define an outer perimeter in a plane that is defined by the transverse direction T and the lateral direction A. In one example, the outer perimeter can be racetrack shaped, as illustrated in
In one example, as illustrated in
As illustrated in
Referring now to
Referring now to
The at least one wire 84 can have any suitable cross-sectional dimension as desired. For instance, the at least one wire 84 can have a square shape or a rectangular or otherwise elongate cross-section having a cross-sectional dimensions in the range of approximately 0.25 mm by approximately 1 mm, as one example. In another examples, the dimension of elongation can be greater than the stated approximately 1 mm, . . . . When the wire 84 has a circular cross-section, the cross-sectional dimension can define a diameter. In one example, the cross-sectional dimension can range from approximately 2 mils to approximately 10 mils. For instance, the cross-sectional dimension of the at least one wire 84 can range from approximately 0.05 mm and approximately 0.25 mm.
The at least one wire 84 can be made from any suitable thermally conductive material as desired. For instance, the at least one wire 84 can be made from gold-plated copper to provide a conductive thermal path from the interconnect substrate 32 to the host substrate 26. It has been found that gold-plated copper has high thermal conductivity and resists surface oxidation that impeded heat transfer. The forming element 82 can have any suitable height along the transverse direction T. For instance, in one example, the height can range from approximately 1.5 mm to approximately 2 mm. It should be appreciated that the heat transfer capability of the thermal bridge 60 can be increased when the length of the wire or outer sheath is reduced.
The forming element 82 can have a width along the lateral direction A that is less than the width of the interconnect substrate 32 along the lateral direction A. For example, the forming element 82 can have a width along the lateral direction A of approximately 7 mm or less. The forming element 82 can have a height along the transverse direction T that is greater than the gap 58 from the bottom of the interconnect substrate 32 and top of the host substrate 26 (see
Thus, the at least one wire 84 can conduct heat along the successive lengths of wire coil 92 that span the gap 58 between the bottom surface of the interconnect substrate 32 and the top surface of the host substrate 26. The wire coil 92 can further be compliant along the transverse direction T in the manner described above. In one example, the deformation of the wire coil 92 in the transverse direction T can be purely elastic, which can ensure that the contact forces are maintained within an acceptable range while the distance between the host substrate 26 and the interconnect substrate 32 varies. In other examples, the deformation of the wire coil 92 can be a combination of plastic deformation and elastic deformation, with the elastic deformation ensuring the contact forces are maintained within an acceptable range and the plastic deformation limiting the maximum contact force being applied to the host substrate 26 and interconnect substrate 32. The maximum force (as well as the minimum force) can be adjusted by varying the cross section, the moment of inertia, the length, spacing and material of the wire(s) and/or the configuration of the forming element 82. These same force considerations may be used in the other examples of the thermal bridge 60 described herein. That is, it can be desirable for all thermal bridges disclosed herein to be elastically compressible along the transverse direction T so as to maintain the contact force against both the host substrate and the interconnect substrate as the interconnect substrate moves vertically away from the host substrate during and after mating with the host module as described herein. When the forming element 82 is not removed after the at least one wire 84 has been wound about the forming element 82, at least a portion of the conductive thermal path can extend through the forming element 82.
Referring now to
In operation, the top surface of the upper plate 96 can make mechanical contact with the bottom surface of the interconnect substrate 32. The bottom surface of the lower plate 98 can make mechanical contact with the top surface of the host substrate 26. A low impedance thermally conductive path across the thermal bridge 60 can be defined by the coils of the canted coil spring 100 and the upper and lower plates 96 and 98. That is, the thermal path from the interconnect substrate 32 to the host substrate 26 can have a lower impedance than the impedance from the interconnect substrate 32 to the host substrate 26 without the coil spring 100. One or more up to all of the upper plate 96, the lower plate 98, and the canted coil spring 100 can be fabricated from any suitable material, such as a metal, having a high thermal conductivity. In some examples, one or both of the upper plate 96 and the lower plate 98 may be eliminated. Thus, the windings of the canted coil 100 can make direct mechanical contact with one or both of the bottom surface of the interconnect substrate 32 and the top surface of the host substrate 26.
Referring now to
The canted coil spring assembly 94 can include a substantially linearly oriented canted coil spring 100 that is disposed about each of the arms 104. That is, the windings of the canted coil spring 100 can be spaced from each other along a substantially linear path. The thermal support housing 102 can further include at least one attachment member that is configured to attach to one or both of the host substrate 26 and the interconnect substrate 32. For instance, the thermal support housing 102 can include at least one attachment peg 48 such as a plurality of attachment pegs 48 that extend out from one or both of the top surface and the bottom surface of the thermal support housing 102 along the transverse direction T. The attachment pegs 48 can be configured to be inserted in a corresponding at least one aperture of one or both of the host substrate 26 and the interconnect substrate 32 so as to register the thermal support housing 102 with respect to the one or both of the host substrate 26 and the interconnect substrate 32 along one or both of the longitudinal direction L and the lateral direction A. Thus, the canted coil assembly 94 can be configured to attach to the host substrate 26 prior to mating the interconnect substrate 32 with the host module 22. Alternatively or additionally, the canted coil spring assembly 95 can include one or more deflectable fingers, one or more fixed fingers, or a combination of at least one deflectable finger and at least one fixed finger as described above. Thus, the canted coil assembly 94 can include the latch 36 as described herein.
The arms 104, and their supported canted coil springs 100, may be oriented in a direction that is angularly offset with respect to the insertion direction along which the interconnect substrate 32 is mated with the first and second electrical connectors 28 and 38. For instance, the at least one arm 104 can be elongate along a direction that is substantially perpendicular to the insertion direction. Otherwise stated, the at least one arm 104 can be elongate along the lateral direction A. Thus, the canted coil springs 100 can define a plurality of contact regions with the upper and lower plates 96 and 98 or the host and interconnect substrates 26 and 32, respectively, at the adjacent windings of the canted coil spring 100. The contact regions can be spaced from each other along a direction that is substantially perpendicular to the mating direction of the interconnect substrate 32. That is, the contact regions can be spaced from each other substantially along the lateral direction A. This reduces the chance of the canted coil springs 100 hanging up or wedging as the interconnect substrate 32 is mated with or unmated from the host module 22.
Referring now to
Referring now to
For instance, the latch 36 can include the deflectable latch finger 40 and the fixed latch finger 56 in one example. Thus, the deflectable latch finger 40 can be opposite the fixed latch finger 56 along the lateral direction A. It should be appreciated, of course, that the latch 36 of the thermal support housing 102 can include any one or more up to all of at least one latch arm 38, at least one deflectable latch finger 40, alone or in combination with at least one fixed latch finger 56 as desired. Thus, the latch 36 illustrated in
The canted coil assembly 94 can further include at least one thermal support arm 104, and a canted coil spring 100 supported by the at least one thermal support arm 104 described above. The at least one thermal support arm can be elongate along the longitudinal direction L. Thus, adjacent windings of the canted coil spring 100 can be spaced from each other along the longitudinal direction L. When the latch 36 has secured the interconnect substrate 32 to the host substrate 26, the at least one canted coil spring 100 can bear against each of the top surface of the host substrate 26 and the bottom surface of the interconnect substrate 32. In one example, the windings of the canted coil spring 100 can be inclined in the mating direction as they extend up in the direction from the host substrate 26 toward the interconnect substrate 32. Accordingly, the contact of the canted coil spring 100 with the interconnect substrate 32 and the host substrate 26 can resist movement of the interconnect substrate 32 with respect to the host substrate 26 in the direction opposite the mating direction.
The coil spring assembly 94 can be removed from its position between the interconnect substrate 32 and the host substrate 26 prior to unmating the interconnect substrate from the host module 22. In particular, the deflectable latch finger 40 can be depressed so as to disengage the deflectable latch finger 40 from the latch aperture 42, and the coil spring assembly 94 can be moved in a direction substantially opposite the direction that the latch arm 38 is cantilevered. Next, the interconnect substrate 32 can be unmated from the host module 22. Alternatively, as described above, the canted coil assembly can include the upper and lower plates 96 and 98, respectively, that are configured to bear against the interconnect substrate 32 and the host substrate 26, respectively. Thus, the interconnect substrate 32 can be unmated from the host module 22 without first removing the coil spring assembly 94 from its position between the interconnect substrate 32 and the host substrate 26. Alternatively, the canted coil assembly can include one or more attachment pegs 48, whereby the canted coil assembly is configured to be attached to the host substrate 26 prior to mating the interconnect substrate 32 to the host assembly 22, and further is configured to be removed from the host substrate 26 after the interconnect substrate 32 has been removed from the host module 22.
As described above, the latch 36 of any example described above can include a thermal bridge 60, and vice versa. For instance, the latch 36 of any example described above can include the canted coil spring 100. Referring to
In another example shown in
In other embodiments, the canted coil spring 100 may be bent in the horizontal plane so that it is no longer linear, but is circular, elliptical, or some other shape. For instance, as illustrated in
One or more of these bent canted coil springs 100 may be incorporated into a thermal bridge 60 in any suitable manner as desired. For example, several nominally circular canted coil springs may be arranged in a concentric pattern. Further, the thermal support housing 102 can register the bent canted coil spring on the host substrate 26, so it is disposed between the host substrate 26 and the interconnect substrate 32. As illustrated in
Alternatively, referring to
Referring now to
In one example, the sides 39 can extend from the latch body 52 to the end wall 43 along a path that is nonlinear. The sides 39 can be referred to as bridge between the latch body 52 and the end wall 43. Rather, the sides 39 can be curved as it extends along a direction that is perpendicular to the transverse direction T. Thus, the sides 39 can help to maximize the space available for the canted coil 100 that is disposed in the retention aperture 54. The latch arm 38, including the sides 39, can be flexible in the manner described above. Thus, when a sufficient force is applied to the arm 38 along the transverse direction, the arm 38 can flex in response to applied force. Thus, as the interconnect substrate 32 is mated to the host module 22, the fingers 40 can ride along the bottom surface of the interconnect substrate 32. When the interconnect substrate 32 has been mated to the host module 22, the fingers 40 can be received in respective latch apertures of the interconnect substrate as described above.
An inner surface of the latch 36 that defines a portion of the outer perimeter of the retention aperture 54 can be undercut so that the curved surface of the canted coil can nest within the latch 36. The retention aperture can be sized slightly smaller than the relaxed state of the canted coil 100 in a direction between the latch body 52 and the end wall 43. The canted coil 100 can thus be captured so that it stays in place while handling the latch 36. The retention aperture 54 may be slightly larger than the canted coil 100 in the direction between the sides 39, so there is clearance for the canted coil to expand as it is compressed when situated between the interconnect substrate 32 and host substrate 26. The sides 39 can be spaced from each other along the lateral direction A in one example. Thus, the latch body 52 and the end wall 43 can be spaced from each other along the longitudinal direction L. Alternatively, the sides 39 can be spaced from each other along the longitudinal direction L, and the latch body 52 and the end wall 43 can be spaced from each other along the lateral direction A.
The latch body 52 may also include at least one securement member such as a latch hook 61 that extends out from the leg 53. The leg 53 can be elastic and configured to deform as the latch 36 is inserted between the front and rear connectors 28 and 30. The latch body 52 can include first and second hooks 61 that extend out from opposite sides of the leg 53 with respect to the lateral direction A. The hooks 61 may engage complementary features on one of the first and second electrical connectors 28 and 30, such that the latch 36 is secured between the connectors 28 and 30 even when the interconnect substrate 32 has not been mated with the host module 22. This may help facilitate assembly of the interconnect system 20.
As illustrated at
Referring now to
Referring to
The fuzz ball retainer 114 can include at least one retention tab 121 that extends out from the band 120. In particular, the fuzz ball retainer 114 can include first and second retention tabs 121 that assist in securing the fuzz ball 112 in the fuzz ball retainer 114. The retention tabs 121 can be oriented in a plane that includes the longitudinal direction L and the lateral direction A. The retention tabs 121 can be disposed at the same height or at different heights with respect to the transverse direction T. The retention tabs 121 can support the fuzz ball 112 such that the fuzz ball 112 rests on the retention tabs 121. Alternatively, the retention tabs 121 can pierce the fuzz ball 112. The fuzz ball retainer 114 can further include at least one attachment tab 122 that is configured to engage a corresponding attachment member of the host substrate 26, so as to attach the fuzz ball retainer to one or both of the host substrate 26 and the interconnect substrate 32, or limit movement of the fuzz ball retainer with respect to one or both of the host substrate 26 and the interconnect substrate 32. For instance, the fuzz ball retainer 114 can include first and second attachment tabs 122. The corresponding attachment member can be configured as an aperture along the transverse direction T in one or both of the host substrate 26 and the interconnect substrate 32 that is configured to receive a respective one of the attachment tabs 122. Engagement of the attachment tabs 122 with the corresponding attachment member of the host substrate 26 can cause the retainer 114 to be located on the host substrate 26 with respect to one or both of the longitudinal direction L and the lateral direction A.
When the fuzz ball assembly 115 is installed in the gap 58 between the host substrate 26 and interconnect substrate 32, the fuzz ball 112 is compressed in the transverse direction T. Thus, the top surface of the fuzz ball 112 makes mechanical contact with the bottom surface of the interconnect substrate 32, and the bottom surface of the fuzz ball 112 makes mechanical contact with the top surface of the host substrate 26. Heat is conducted from the interconnect substrate 32 to the host substrate 26 along the conductive thermal path that is defined by the at least one wire 110 alone or in combination with the retainer 114. Thus, the fuzz ball retainer can be thermally conductive as desired.
In the embodiments shown above in
Further, as illustrated in
Thus, the cup 116 can include a cup body 119 that defines the base 118, and at least one projection 123, such as a plurality of projections 123, that extends from the cup body 119. The projections 123 can extend from the cup body 119 along the transverse direction T. The projections 123 can be configured to be inserted into respective mounting apertures 68 in the host substrate 26. In one example, the mounting apertures 68 can be configured as slots, and the thermal bridge can be slid into position after the interconnect substrate 32 has been mated with the first and second electrical connectors 28 and 30. In particular, the projections 123 can slide along the slot as the thermal bridge 60 is installed. Alternatively, the apertures 68 can be configured as through-holes, and the thermal bridge 60 may be positioned on the host substrate 26, such that the projections 123 extend through the through-holes, prior to mating the interconnect substrate 32 with the first and second electrical connectors 28 and 30.
While the thermal bridge 60 can be mounted to the host substrate 26 in one example, the thermal bridge 60 can alternatively be mounted to the interconnect substrate 32 if desired. Thus, while the mounting apertures 68 extend into or through the host substrate 26 in one example, the mounting apertures 68 can alternatively extend into or through the interconnect substrate 32. For instance, the cup 116 can include projections 123 that extend into mounting apertures of at least one of the host substrate 26 and the interconnect substrate 32, so as to position the thermal bridge 60 between the interconnect substrate 32 and the host substrate 26.
As described above, the at least one fuzz ball 112 can be compressible along the transverse direction T. Thus, when the thermal bridge 60 is positioned between the interconnect substrate 32 and host substrate 26, the fuzz ball 112 can compress along the transverse direction T. In particular, the base 118 of the cup body 119 can apply a compressive force F against the fuzz ball 112 when the cup 116 is mounted to the at least one of the interconnect substrate 32 and the host substrate 26. The top surface of the cup 116, which can be defined by the base 118, can be in robust mechanical contact with the bottom surface of the interconnect substrate 32. Simultaneously, the bottom surface of the fuzz ball 112 can be in robust mechanical contact with the top surface of the host substrate 26. Thus, the fuzz ball 112 can be compressed between the base 118 of the cup 116 and the host substrate 26 along the transverse direction T. Further, the top surface of the fuzz ball 112 can be in robust mechanical contact with the cup body 119. Alternatively, the cup 116 can be configured such that a bottom surface of the cup 116, which can be defined by the base 118, is in robust mechanical contact with the top surface of the host substrate 26, and the top surface of the fuzz ball 112 can be in robust mechanical contact with the bottom surface of the interconnect substrate 32. Thus, the fuzz ball 112 can be compressed along the transverse direction T by base 118 of the cup 116 and the interconnect substrate 32.
The bottom surface of the fuzz ball may make contact with the top surface of the host substrate 26. The surface of the cup 116 that makes contact with the bottom surface of the interconnect substrate 32 can be substantially flat. When the at least one fuzz ball 112 is in the compressed state, the wires 110 that form the fuzz ball 112 are more closely packed than when the fuzz ball 112 is in the uncompressed state. The fuzz ball wires 110 can be elastically deformed during compression, so that the compressed wires 110 provide a force along the transverse direction T that urges the cup 116 against the one of the interconnect substrate 32 and the host substrate 26 when the fuzz ball 112 is in its compressed state. Furthermore, it is recognized that the projections 123 can be configured to ride in the mounting apertures 68 along the vertical direction. The projections 123 can also be sized smaller than the mounting apertures 68 along the horizontal direction. Accordingly, the cup 116 can be movable along the transverse direction, and can also tilt so as to conform to minor deviations in parallelism between the host substrate 26 and the interconnect substrate 32 while maintaining the base 118 of the cup in surface contact with the interconnect substrate 32.
Referring now to
The fuzz ball retainer 114 can further include at least one attachment member that is configured to attach to one of the host substrate 26 and the interconnect substrate 32. For instance, the fuzz ball retainer 114 can include at least one attachment peg 130 configured to engage complementary attachment structure of one of the host substrate 26 and the interconnect substrate 32. The complementary attachment structure can be configured as attachment apertures that are configured to receive the attachment pegs 130. The attachment pegs 130 can be received by attachment apertures of the host substrate 26 in one example. Thus, the fuzz ball retainer 114 can compress the fuzz balls 112 against the host substrate 26. The bottom surfaces of the fuzz balls 112 therefore make mechanical contact with the top surface of the host substrate 26. The top surface of the fuzz ball retainer 114 can make mechanical contact with the bottom surface of the interconnect substrate 32. Thus, the conductive thermal path can be defined from the interconnect substrate 32 through the fuzz ball retainer 114 and the fuzz balls 112 to the host substrate 32.
In another example, the attachment pegs 130 can be received by attachment pegs 130 apertures of the interconnect substrate 32. Thus, the fuzz ball retainer 114 can compress the fuzz balls 112 against the interconnect substrate 32. The top surfaces of the fuzz balls 112 therefore make mechanical contact with the bottom surface of the interconnect substrate 32. The bottom surface of the fuzz ball retainer 114 can make mechanical contact with the top surface of the host substrate 26. Thus, the conductive thermal path can be defined from the interconnect substrate 32 through the fuzz balls 112 and the fuzz ball retainer 114 to the host substrate 26.
It is recognized that the fuzz balls 112 can be elastically compressible along the transverse direction so as to maintain reliable contact with the host substrate and the interconnect substrate, even when the fuzzballs 112 do not make contact to both the host substrate and the interconnect substrate simultaneously, such as when the cup does not define a through hole, and thus defines a base 118 or other support structure for the fuzzballs 112.
The fuzz ball retainer 114 can define any suitable thickness along the transverse direction T as desired. In one example, the thickness can range from approximately 1.0 mm to approximately 2.5 mm. For instance, the thickness can be approximately 1.27 mm. The grid 124 can define any suitable first center-to-center distance of adjacent pockets 129 along the lateral direction A. The first center-to-center distance can be constant along the grid 124. Alternatively, the first center-to-center distance can vary along the grid 124. The grid 124 can define a second center-to-center distance of adjacent pockets 129 along the longitudinal direction L. The second center-to-center distance can be constant along the grid 124. Alternatively, the second center-to-center distance can vary along the grid 124. The first and second center-to-center distances can be equal to each other. Alternatively, the first and second center-to-center distances can be different than each other. In one example, the first and second center-to-center distances can range from approximately 0.75 mm to approximately 3 mm. For instance, the first and second center-to-center distances can be approximately 1.27 mm. The grid 124 can define any suitable dimension along each of the lateral direction A and the longitudinal direction L. The dimension can range from approximately 4 mm to approximately 12 mm. In one example, the dimension can be approximately 8 mm. The fuzz ball retainer 114 may be sized so that it does not extend beyond the footprint of the interconnect substrate 32 or host substrate 26. As illustrated in
The fuzz balls 112 can be constructed as desired. In one example, the fuzz balls 112 can be constructed as a Fuzz Button® interposers commercially available from Custom Interconnects, LLC having a place of business in Centennial, Colo. Alternatively, the thermal bridge as described herein can include a CIN::APSE® thermal device commercially available from Bel Fuse Inc., having a place of business in Jersey City, N.J.
Referring now to
In some embodiments, the cups in the fuzz ball retainer 114 can define one or more through holes. In this embodiment, at least one fuzz ball 112 retained in the fuzz ball retainer 114 may extend through the at least one through hole both below the bottom of the fuzz ball retainer 114 and above the top of the fuzzball retainer 114. In one example, a fuzz ball 112 can extend through the fuzz ball retainer 114. When the fuzz ball retainer 114 is positioned between the interconnect substrate 32 and host substrate 26 the same fuzzball may contact both the interconnect substrate 32 and host substrate 26. Alternatively, an upper fuzz ball 112 can extend into the upper through hole and contact the interconnect substrate 32, and a lower fuzz ball 112 can extend into the lower through hole and contact the host substrate 26. The upper and lower fuzz balls 112 can be in thermal communication with each other through the fuzz ball retainer 114.
Referring now to
Alternatively or additionally, one or more up to all of the cups 116 can be configured as a second cup 116b constructed as described above with the first cup 116a, however with an inwardly tapered opening 160 to the internal void. The opening can taper inwardly as it extends to an outer surface of the retainer 114. The outer surface of the retainer 114 can be defined by the top surface 131a or the bottom surface 131b. In this regard, the tapered opening can provide retention for the fuzz ball 112 in the internal void. A portion of the fuzz ball 121 can extend out from the cup 125 so as to contact one of the host substrate and the interconnect substrate. The beveled opening can be defined by cut outs 165 from the material of the retainer 114 that are folded over upon themselves such that they extend into the internal void and define the tapered opening.
Alternatively or additionally, one or more up to all of the cups 116 can be configured as a third cup 116c that can define a through hole from the top surface 131a to the bottom surface 131b. The third cup 116c can define an hourglass shape that provides a retention force against the fuzz ball 112 disposed therein. The fuzz ball 112 can extend out with respect to each of the top surface 131a and the bottom surface 131b of the retainer 114. The hourglass shape can be smooth as illustrated with respect to the third cup 116c, or can include adjacent adjoining angled surfaces 162 as illustrated with respect to a fourth cup 116d. One or more up to all of the cups 116 can be configured as a third cup 116d.
Alternatively or additionally, one or more up to all of the cups 116 can be configured as a fifth cup 116e that can be configured as described above with respect to the first cup 116a, but with a flat base 118. In this regard, any of the cups 116 that terminate in the retainer can have any suitable base 118 as desired.
Alternatively or additionally, one or more up to all of the cups 116 can be configured as a six cup 116f that can have a tapered opening as described above with respect to the second cup 116b. However, the tapered opening can be defined by a stamping operation in which a stamp tool 170 is brought against the top or bottom surface 131a or 131b, respectively, of the fuzz ball retainer 114 so as to deform the material of the retainer 114, thereby creating the tapered opening. In one example, the stamp tool 10 can include at least one stamp arm 172 that is brought against the retainer 114 so as to create an indentation 174 that moves material of the retainer 114 into the internal void, thereby creating the tapered opening.
In all the previously described examples, the forces exerted by the thermal bridge 60 can be distributed along the host substrate 26 and interconnect substrate 32. The force distribution can be equal in some examples. In one aspect, it can be desirable for the thermal bridge 60 to exert a large force against the host substrate 26 and interconnect substrate 32. This force can be provided by the elastic compression of the thermal bridge. A large elastic force will improve the thermal contact between the thermal bridge 60 and the substrates 26 and 32. In another aspect, it can be desirable to prevent the elastic force from being excessive. For instance, if the elastic force is too large, it will be difficult to slide the interconnect substrate 32 over the thermal bridge 60 when mating the interconnect substrate 32 to the host module 22. Alternatively, if the interconnect substrate 32 is mated to the host module 22 prior to installing the thermal bridge 60, then it can be difficult to slide the thermal bridge 60 between the interconnect substrate 32 and the host substrate 26. Also, excessive force will tend to lift contacts pads on the interconnect substrate 32 off their mating electrical contacts on the second electrical connector 30 and/or put undue stresses on the front electrical connector 28. It is recognized, of course, that the excessive force can be offset by an external member that applies a counterforce downward toward the host board, such as from a cold plate that contacts the top of the transceiver.
It is believed that that a total elastic force of the thermal bridge 60 in its compressed state in the range of approximately 3 Newtons (N) to approximately 6 N can provide adequate force for reliable thermal contact with the host substrate 26 and the interconnect substrate 32, without being too large. It should be appreciated that the outward force exerted by the thermal bridge 60 to the substrates 26 and 32 may be more than approximately 6 N or less than approximately 3 N depending on several factors, such as the size of the contact region between the thermal bridge 60 and the substrates 26 and 32.
In any of the examples described above, the thermal bridge 60 can undergo both plastic (i.e., inelastic) deformation and elastic deformation. For example, the thermal bridge 60 can undergo one or both of elastic deformation and plastic deformation when it is inserted in the gap between the interconnect substrate 32 and host substrate 26. The elastic properties of the thermal bridge may be chosen so as to maintain a relatively constant contact force between the thermal bridge 60 and the substrates 26 and 32 as the gap 58 between the substrates 26 and 32 varies.
Initial testing has indicated that a factor of two reduction in a temperature difference between a VCSEL (Vertical Cavity Surface Emitting Laser) mounted on the interconnection substrate 36 and the host substrate 26 is achievable using some of the thermal bridges 60 described herein.
While the present disclosure has generally been described in the context of an interconnect substrate 32, it should be appreciated that the latch and thermal bridge system and method described herein is not so limited. The interconnect substrate 32 may be used in an optical transceiver, optical receiver, or optical transmitter. More generally, the latch and/or thermal bridge can be used to secure and/or provide a low impedance thermal path between any suitable daughter substrate, respectively, such as a PCB, and a host substrate 26, where the host substrate has a front and rear electrical connector mounted on it and the two connectors are separated in a longitudinal direction, which is the daughter substrate insertion direction into the first electrical connector 28. As described above, the daughter substrate can be configured as an interconnect substrate in one example. More generally still, the latch and/or thermal bridge can be used to secure and/or provide a low impedance thermal path, respectively, between any two roughly planar and parallel surfaces facing each other and where the gap between the two surfaces can vary over time.
Further while the present disclosure has been generally described in the context of the host module 22 including the first and second electrical connectors 28 and 30, it should be appreciated that the latch 36 and thermal bridge 60 may be used in situations where two substantially planar substrates are to be secured to each other, and one of the substrates has two longitudinally separated mating regions. The planar substrates can be oriented parallel to each other. The mating regions limit motion in the transverse direction T, which is normal to the planar surfaces of the first and second substrate. The latch, 36 and thermal bridge 60 can fit between the two substrates and limit motion in the longitudinal direction L so that the two substrates are secured together. The latch 36 may fit between the first and second connectors 28 and 30 so that it does not extend beyond the footprint of either of the first and second substrates. The latch 36 and thermal bridge 60 can be elastically deformed when the latch 36 is disposed between the two substrates. An attachment member of the latch 36 can engage with a complementary attachment feature of the second substrate to limit relative motion of the substrates in the longitudinal direction L, thereby securing the two substrates together.
It should be appreciated that the illustrations and discussions of the embodiments shown in the figures are for exemplary purposes only, and should not be construed limiting the disclosure. One skilled in the art will appreciate that the present disclosure contemplates various embodiments. For instance, while the present disclosure has been generally described in the context of using two separate first and second connectors 28 and 30 that define front and rear connectors, respectively, it should be appreciated that these connectors may form a unitary structure which is mounted to the host substrate 26. As such rather than there being two connectors, there is a single connector that has two longitudinally separated mating or connection regions. Alternatively, the first and second connectors 28 and 30 can be spaced from each other along the lateral direction A. Further, it should be appreciated that the host assembly 22 can include more than the first and second electrical connectors 28 and 30, and can have additional contact regions configured to establish an electrical connection with the interconnect module for the purpose of data transmission or some other purpose. Additionally, it should be understood that the concepts described above with the above-described embodiments may be employed alone or in combination with any of the other embodiments described above. It should be further appreciated that the various alternative embodiments described above with respect to one illustrated embodiment can apply to all embodiments as described herein, unless otherwise indicated.
This claims priority to U.S. Patent Application Ser. No. 62/713,608 filed Aug. 2, 2018, the disclosure of which is hereby incorporated by reference as if set forth in its entirety herein.
Filing Document | Filing Date | Country | Kind |
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PCT/US2019/044773 | 8/2/2019 | WO | 00 |
Number | Date | Country | |
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62713608 | Aug 2018 | US |