IBM Technical Disclosure Bulletin, vol. 20, No. 1, Jun. 1977, pp. 144-145, "Recessed Oxide Isolation Process" by S. A. Abbas. |
IBM Technical Disclosure Bulletin, vol. 21, No. 4, Sep. 1978, pp. 1466-1467, "Method of Etching/Filling Deep Isolation for Large-Scale Integrated Devices", by J. S. Logan et al. |
IBM Technical Disclosure Bulletin, vol. 25, No. 2, Jul. 1982, pp. 588-589, "Post Emitter Polysilicon Trench Isolation", by I. Antipov. |
IBM Technical Disclosure Bulletin, vol. 25, No. 5, Oct. 1982, pp. 2288-2291, "Method of Forming Polysilicon-Filled Isolation Regions in an Integrated Circuit Device" by N. G. Anantha et al. |