This invention relates to the thermal oxidation of metals such as copper and iron, and more particularly to formation of nanowires on metal particles that can form hierarchical structures.
Metal oxide nanowires are useful in a variety of applications including gas-sensors1, nanoelectronics2, energy harvesting3, and photonics4. As semiconductors, their unique one-dimensionality; strong photon, phonon, and electron confinement; and predictable electrical and optical functionalities have made them widely applicable5. Many methods are available to form the nanowires including template-directed, vapor phase, solution phase, vapor-liquid-solid (VLS), and epitaxial growth6-10. We are interested in the thermal oxidation of metals, which is one of the simpler and more scalable approaches.
Copper oxide has been studied for its electronic properties11 and has found additional applications as a photocathode, superhydrophobic surface12, 13, and oxygen carrier in chemical looping combustion14. Among various metal oxides, copper oxide has shown the best oxidation/reduction performance for solid-coal chemical looping combustion14. The good catalytic properties of copper oxide have also been demonstrated in the oxidation of methane15 and a plasma-enhanced carbon monoxide oxidation process16.
Copper oxide nanowires can be formed in a straightforward manner by thermal oxidation of copper substrates including foils, grids, and wires17-20. The formation of nanowires has been shown to occur at temperatures of 400-700° C.18, 19. Copper particles are typically sintered under an inert atmosphere for thermal management applications such as heat pipes21-24. Previous research25 demonstrated that the selection of the appropriate particle size, porosity, and thickness of the sintered metal structure could promote thin film evaporation and maximization of heat transfer. Porous layer coatings of copper26 and copper nanowire structures27 have also been shown to enhance pool boiling critical heat flux over plain surfaces.
An object of the invention is the thermal oxidation of copper and other metal particles resulting in nanowire growth, a hollow interior, and the ability to create tunable and scalable hierarchical structures. By changing the particle size, we demonstrate for the first time the ability to control the extent of nanowire growth and identify regimes where many nanowires and almost no nanowires form. Systematic thermogravimetric analysis (TGA) and in-situ x-ray diffraction (XRD) experiments of thermal oxidation were conducted on particles of various sizes to understand the size-dependent process. We propose a mechanism for the reaction and suggest applications based on this new process of tunable nanowire growth.
In a first aspect, the invention is a particle having a metal oxide outer shell with metal oxide wires extending from the outer shell. In another aspect, the invention is a multiscale structure including particles above and below a critical size wherein the particles above the critical size have wires extending from the surface. In a preferred embodiment the particles both above and below the critical size are in intimate metal-to-metal contact.
In another aspect, the invention disclosed herein is a method for making hierarchical structures including preparing a mixture of relatively smaller metal particles having a size below a threshold for nanowire formation and of relatively larger metal particles having a size above a threshold for nanowire formation. The mixture is oxidized at a selected temperature and for a selected time whereby the relatively smaller particles sinter and nanowires grow on the relatively larger particles thereby creating tunable hierarchical structures. In a preferred embodiment of this aspect of the invention the particles are copper or iron. Other metals with multiple oxidization states and a lattice mismatch with its oxide are suitable for nanowire growth under thermal oxidation conditions. In a preferred embodiment using copper, the threshold is in a range of approximately 2-4 μm with a preferred value around 3 μm. Suitable oxidation temperatures are in the range of 400-700° C. A preferred temperature is approximately 600° C. Suitable thermal oxidation times are in the range of approximately 30 minutes to 60 minutes.
In another aspect, the invention is a method for controlling the extent of nanowire growth on a metal particle including selecting a starting particle size with respect to a size threshold for nanowire growth and oxidizing the particle at a selected temperature and for a selected time whereby a desired extent of nanowire growth is achieved. In yet another aspect, the invention is a method for making a hollow structure comprising thermally oxidizing a metal particle. The hierarchical nanostructures made according the method disclosed herein will be described below.
a, b and c are SEM micrographs of copper particles in ambient air.
a, b, c and d are graphs of mass percentage versus time of in situ XRD time scans of copper samples.
a and 4b are SEM images of a focused ion beam-milled cross section of a 1 μm (a) and 10 μm (b) oxidized copper particle.
a and 5b are SEM micrographs showing tunable hierarchical structures produced using size-dependant nanowire growth.
a, b, c and d are SEM micrographs showing the thermal oxidation of iron particles having a size in the range of 1-3 μm.
a, b, c are schematic illustrations showing an oxidized network of partially sintered metal particles.
With reference to
The growth mechanism of nanowires by thermal oxidation is not well understood in the literature. Most literature studies have proposed a mechanism of copper oxidation and nanowire growth based on two-steps18, 19:
4Cu+O2→2Cu2O
2Cu2O+O2→4CuO
The growth of nanowires involves the formation of a major product (Cu2O) that acts as a precursor to the rate-determining second reaction. X-ray diffraction (XRD) patterns of oxidized copper samples have supported this mechanism by revealing a strong signal for Cu2O with a much smaller peak corresponding to CuO18, 19. The Cu2O layer has been proposed29 to be a seed for CuO nanowire growth. After removal of the Cu2O phase, no increase in nanowire length and diameter was observed29 with increasing duration at the same temperature. Furthermore, it has been suggested30 that the morphology of the outer nanowire “layer” is determined by the microstructure of the underlying Cu2O layer.
The most recent literature and proposed models suggests two key ideas for nanowire growth to occur: outward copper ion diffusion through a defective Cu2O layer30 and a critical compressive stress between Cu2O/CuO28. Other models19, 31 involving the evaporation and recondensation of oxide species (vapor-solid model) have not been well-supported20, 28, 30. To understand the observed size-dependent behavior and determine if it follows the proposed mechanisms, we monitored bulk oxidation rate by thermogravimetric analysis (TGA Q50, TA Instruments) at 600° C. for 1 hr in air. From TGA (
In order to further understand the size-dependent results in our SEM and TGA experiments, we examined the evolution of the copper and copper oxide phases with time by conducting a detailed in-situ XRD (PANalytical X'Pert Pro) experiment. The oxidation was conducted at 600° C. in an atmosphere consisting of 5% oxygen and 95% nitrogen in order to slow down the rate of the reaction and capture the evolution of the initial process. A Rietveld analysis was performed on the raw data to determine changes in mass percent of each compound, which are shown in
Our results support the general mechanism of nanowire formation based on the availability of copper ions and an optimal oxide shell. By examining three parameters copper availability, Cu2O relative amount, and CuO thickness, we hypothesize that oxidation of smaller particles does not result in the formation of an oxide shell that reaches a critical stress level needed for nanowire growth28. Furthermore, the faster rate of oxidation of smaller particles rapidly depletes the Cu2O shell, thereby eliminating the short-circuit32 (lower activation energy) diffusion paths needed for nanowire growth.
In-situ XRD reveals a dependence of the relative amounts of Cu, Cu2O, and CuO on initial particle size. As observed in the TGA experiment, the rate of formation of copper oxide increases with decreasing particle size. Within only the first minute, copper is completely depleted on the 1 μm size powder. Likewise, the Cu2O phase disappears after 20-30 minutes on the 1 μm powder but around 30-60% remains on the larger sizes after the same amount of time. Based on these XRD results, we explain the size-dependent nanowire growth by looking at the three essential conditions required for nanowire growth: Cu availability, Cu2O formation, and CuO thickness. A more rapidly depleted Cu2O layer on smaller sized particles combined with copper depletion in the particle core eliminates the possibility for substantial copper diffusion through a defective Cu2O layer that was proposed as essential to nanowire formation. Furthermore, we expect that a sufficiently thick CuO layer did not form on the 1 μm particles to achieve a critical level of stress that has been suggested28 for the promotion of nanowires. An approximate calculation of the initial particle size necessary to achieve a critical oxide thickness for nanowire growth is ˜2-4 μm, which is consistent with our observed results of little to no nanowire growth on 1 μm sized particles oxidized at 600° C. It is expected that the reaction rates are even faster at ambient 21% oxygen, further supporting our observed size-dependent results in
Given our hypothesis of outward copper diffusion from a spherical core and the observation33 that such a process led to inner pores and void formation in cobalt or nickel-plated beryllium powder, we checked for void formation with a dual-beam focused ion beam (FIB) and SEM (Zeiss NVision 40). After cutting open and imaging the particles, we discovered that the oxidized particles are hollow (
The structures, composed of metal particles surrounded by metal oxide nanowires, can be applied to catalysis, chemical looping combustion, and thermal management applications including heat pipes, boilers, and electronics cooling. The size-dependent oxidation could be extended to optimize oxygen carriers in chemical looping combustion. Furthermore, the high surface area of nanowire-covered particles with inner voids might be used to enhance catalytic activity. Size-dependent kinetics is also useful in sintering and the creation of wicking structures where a controllable porosity is desired.
We disclose herein multiscale or hierarchical structures and a straightforward process to synthesize these new hierarchical structures through a tunable growth process. By mixing small and large particles, wherein smaller particles readily sinter and nanowires grow only on larger particles, we created the hierarchical structures as shown in
The present invention is applicable to metals other than copper. For example, experiments were done with iron particles.
a, b, and c show an oxidized network of partially sintered metal particles. The particles are first sintered in vacuum, or in an inert atmosphere (or relatively nonreactive gas), to initiate necking, allowing for metal-to-metal contact. Then the particles are sintered in air to impart the secondary nanowire structure on the surface while mostly retaining the high thermal conductivity.
The samples were prepared by depositing spherical copper powder (99-99.9% metals basis, Alfa Aesar) with an average particle size of 1 μm, 10 μm, and 50 μm on a flat silicon substrate followed by heating for 30 minutes in a box furnace (Thermolyne Benchtop Muffle Furnace, Thermo Fisher Scientific) that was preset to the desired temperature and operated under ambient air in a fume hood. The 1 μm and 10 μm powder were used as received, and the 50 μm powder was sieved to a size range between 45 μm and 53 μm. The particle size distribution on the 1 μm and 10 μm powders is as follows: for the 1 μm powder, 10% of the particles are at or below 0.47 μm, 50% are at or below 0.75 μm, and 90% are at or below 1.88 μm; for the 10 μm powder, 10% of the particles are at or below 7.34 μm, 50% are at or below 10.17 μm, and 90% are at or below 14.83 μm.
Thermogravimetric analysis was performed on a TGA Q50 (TA Instruments) at 600° C. for 1 hr in air. The copper particles were heated to 600° C. in nitrogen, and the gas was switched to air to start the oxidation.
A PANalytical X'Pert Pro was used for all experiments. The copper particles were heated to 600° C. in nitrogen, and the gas was switched to an atmosphere consisting of 5% oxygen and 95% nitrogen in order to slow down the rate of the reaction and capture the evolution of the initial process. Every two minutes, the copper sample was scanned between 33-45° with each scan taking two minutes to complete. The raw data was analyzed using the High Score Plus software package.
A Zeiss NVision 40 was used to mill and image in-situ the resulting structure. An ion current of 1.5 nA at 30 kV was used for milling and a finer mill current of 40 pA at 30 kV for polishing. The SEM images were taken at 2 kV.
It is contemplated that the structures described by the invention disclosed herein will have many applications. For example, the hierarchical micro/nanostructures can be used as a thermal capacitor for thermal storage/regulation in homes or with respect to military attire. The materials of the invention can be filled with a dielectric material to create an ultra capacitor. Further, the particles of the invention can be filled with a material to create a tunable thermal battery.
The hierarchical nanostructures of the invention will also have use in electronics cooling as a new thermal interface material (TIM) especially for spray-impingement of droplets in a heat pipe or a structure filled with a high thermal conductivity material such as a liquid metal. When the application is a thermal interface material, structures of the invention are preferably fabricated in two steps to improve the overall thermal conductivity of the resulting material. First, the particles are sintered in vacuum to initiate necking (to enhance thermal conductivity and increase structural strength). Then the particles are briefly sintered in air to allow the secondary nanowire structure on the surface to form while mostly retaining the thermal conductivity of copper as the primary material comprising the thermal interface material.
The hierarchical nanostructures of the invention may provide a more efficient boiling surface by tuning the size of the surface structures to optimize for high capillarity forces, bubble nucleation, superhydrophillicity, and escape of vapor. In this case, particles are applied to the surface of boiler tubes by thermal spray, dip coating, or other scalable coating processes. If the structures of the invention are applied to zirconium, the boiling surfaces will be particularly useful in nuclear power plants.
The structures of the invention can also form a high-porosity catalyst for use in chemical looping combustion (CLC). The structures of the invention, because of their high surface area, are useful for catalysis and to prevent particle agglomeration with secondary nanowire structure.
Other applications of the invention include use in a lithium ion battery and as a gas sensor. The structures of the invention may be tailored to have desired thermoelectric properties by controlling the oxide thickness of the resulting material by controlling the duration of the oxidation process. When the material is iron, its unique magnetic properties will be useful as MRI contrast agents. The structures of the invention can also form a porous wicking structure for a geothermal heat pipe.
The superscript numbers refer to the references included herewith and the contents of all of these references are incorporated herein by reference.
Supplemental information concerning the process disclosed herein is included in the provisional applications noted earlier to which this non-provisional application claims priority. These provisional applications are incorporated herein by reference.
This application claims priority to U.S. provisional patent application Ser. No. 61/439,030 filed Feb. 3, 2011; Ser. No. 61/493,549 filed Jun. 6, 2011; and Ser. No. 61/547,852 filed Oct. 18, 2011. The contents of these three provisional applications are incorporated herein by reference.
This invention was made with government support under Grant No. N66001-10-1-4047 awarded by the Space and Naval Warfare Systems Center and under Grant No. DGE0645960 awarded by the National Science Foundation. The government has certain rights in this invention.
Number | Date | Country | |
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61439030 | Feb 2011 | US | |
61493549 | Jun 2011 | US | |
61547852 | Oct 2011 | US |