Patent Grant
10286524
The present invention relates to an ultraprecise polishing implement, particularly to a biopolymer soft polishing film containing ultrafine abrasives.
In recent years, fast development of the information and photoelectric technologies leads to increasingly high requirements for the manufacture of ceramic substrate, semiconductor wafer, optical crystal, decoration or construction stone. The manufacture of semiconductor wafer, in particular, requires ultra-smooth and ultra-flat surface, and the avoidance of residual stress and damage to the surface and subsurface.
The ultraprecise polishing methods for the above-described materials mainly include loose abrasive polishing, fixed abrasive polishing and non-traditional machining methods. During the loose abrasive polishing, the abrasive particles are arranged randomly and the track is uncontrolled. The abrasive particles form a three-body movement, resulting in low manufacturing efficiency. Aggregation may easily happen when the abrasive particles are small in size, which leads to workpiece surface damage and thus influencing the manufacturing quality. Corrosive grinding fluid and loose abrasive not only are wasteful, but also pollute the environment. Since the disk used in fixed abrasive polishing is rigid, and the recondition is complex during the polishing process, the conditions during manufacturing process must be strictly controlled to avoid damage easily caused to the workpiece. In addition, above mentioned aggregation problem also exists. Better surface quality may be obtained by other novel non-traditional manufacturing methods, however, the requirement for equipment is also high, and highly efficient and fast manufacturing of large workpieces is also difficult to be implemented. Therefore, these novel non-traditional manufacturing methods can hardly be applied in industry-wide mass manufacturing.
To solve the above-described problems, semi-fixed polishing means, such as ice disk, resin polishing plate, hydrophilic polishing film, have been developed by domestic and international researchers, which solve the dispersion issue of small particle abrasive to a certain degree. However, the holding force of the bond to the abrasive is relatively low and the abrasive is mostly loose during processing. Besides, the waste is quite trouble to treat post-processing as the polymer is rather difficult to be degraded.
The object of the present invention is to overcome the problems of the existing ultraprecise polishing means and to provide an ultrafine abrasive polishing film based on degradable biopolymer material. The manufacturing method is simple, characterized by the green environmental protection and non-pollution. The shape and size of the film is unlimited, merely needs water to serve as polishing solution during ultraprecise non-damage manufacturing.
The technical proposal of the present invention is:
An ultrafine abrasive biopolymer soft polishing film having a base material, the base material comprising: 0.1-10 wt % of surface modified ultrafine abrasive, 5-15 wt % of chemical additive for controlling dryness and 1-10 wt % of biopolymer sol; the base material formed after mixing evenly and proportionally, physically or chemically crosslinking and solidifying, and drying;
the surface modification using a coupling agent to chemically coat the ultrafine abrasive to improve dispersion and holding of the ultrafine abrasive in the high polymer base material.
The coupling agent comprises at least one of silane coupling agent, titanate coupling agent and lignin coupling agent.
The ultrafine abrasive comprises at least one of diamond, carbide, boride and oxide, and the grain diameter of the ultrafine abrasive is in a range of 5 nm-40 μm.
The chemical additive for controlling dryness comprises a filler, a water carrying agent and a pore foaming agent, the filler comprises at least one of SiO2 nanoparticle, CaCO3 nanoparticle, polyimide nanoparticle and calcium magnesium nanoparticle powder; the water carrying agent comprises at least one of sucrose, lactose, fructose and glycerol; the pore foaming agent comprises at least one of NaHCO3, NaCl, lauryl sodium sulfate, sodium dodecylbenzene sulfonate; a mixture ratio of the filler and the water carrying agent is in a range of 1-3 wt %:3-10 wt %, the added concentration of the pore foaming agent is adjusted according to a porosity requirement of the tool surface.
The biopolymer is at least one of starch, modified cellulose, chitosan, agarose, glucomannan, sodium alginate, gelatin, carrageenan, xanthan gum, pectin, galactomannan gum, polylactic acid.
The drying method can be constant temperature drying or infrared drying.
A manufacturing method of the ultrafine abrasive biopolymer soft polishing film comprising the steps:
(1) modification processing: modifying the ultrafine abrasive in an aqueous solution of the coupling agent;
(2) mixing the base material: mixing the modified ultrafine abrasive, the drying control chemical additive and the biopolymer sol evenly in a ratio of 0.1%˜2%:4%˜14%:1.5%˜5%;
(3) molding and drying: spraying or spreading the mixed sol and solidifying after physically or chemically crosslinking, and then drying to form a polishing film.
In step (1), a weight ratio of the ultrafine abrasive and the coupling agent is in a range of 100:0.1-10.
The present invention has following advantages:
The ultrafine abrasive biopolymer soft polishing film of the present invention can be widely used in the manufacture of ceramic substrate, semiconductor wafer, optical crystal, decoration and construction stone, particularly in the processing of large size surfaces. The polishing film of the present invention has an ultrafine abrasive surface modified by a coupling agent, for efficiently solving the aggregation problem of the abrasive, and improving the holding force of the biopolymer base material to the inorganic abrasive. As the polishing film has improved softness, it can provide yielding effect to the abrasive, for avoiding the damage to the workpiece by the large hard particles when the fixed abrasive is used during the high efficiency manufacturing. Moreover, the polishing film of the present invention comprise chemical additive for controlling dryness, resulting in the polishing film having improved mechanical performance and lengthened storage life. The biopolymer material can be degraded by microbes, providing an environmental friendly polishing implement.
The base material of the ultrafine abrasive biopolymer soft polishing film of the present invention may select:
Ultrafine abrasive: diamond;
Chemical additives for controlling dryness: including SiO2 nanoparticles as a filler, sucrose as a water carrying agent, and sodium dodecyl sulfate (SDS) as a pore foaming agent;
Biopolymer base material: combination of starch and carrageenans;
Coupling agent: aqueous solution of KH-550 silane as a coupling agent.
The method for preparing the ultrafine abrasive biopolymer soft polishing film according to the present invention comprises the steps of:
(1) modification processing: diamond with particle size of 500 nm is added into aqueous solution of KH-550 silane coupling agent (the concentration of the coupling agent is 0.005%, the added amount of the diamond is 1%) and treated with ultrasound for 30 minutes;
(2) mixing the base material: the modified diamond powder (after the surface modification, the hydrolyzed functional group of the coupling agent is absorbed on the diamond, and diamond powder is obtained after filtration), SiO2 with particle size of 30 nm, SDS, sucrose, carrageenan and starch are mechanically and thoroughly mixed in deionized water, the concentrations in weight percentage of them are 1%, 3%, 0.1%, 3%, 6%, 4%, respectively;
(3) molding and drying: the mixed sol is evenly distributed on a non-woven fabric surface by a coating machine, and an atomized sodium ion solution is sprayed on the mixed sol layer to form a gel; the gel is dried at a constant temperature and attached to a back glue layer to form a polishing film of the present invention.
The polishing film is placed on the polishing disk of an AUTOPOL-1000S automatic polishing machine. The rotational speed of the polishing disc was set at 120 rpm, the rotational speed of the sample carrying disk was set at 60 rpm, and the polishing pressure was set at 3 kg. A SiC wafer with an original roughness of 10 nm was polished for 2 h, the surface roughness reached 0.3 nm, and the wafer surface did not show any scratch or pit.
The base material of the ultrafine abrasive biopolymer soft polishing film of the present invention may select:
Ultrafine abrasive: aluminum oxide;
Chemical additives for controlling dryness: including CaCO3 with grain diameter of 20 nm as a filler, glycerol as a water carrying agent, and NaCl grains as a pore foaming agent;
Biopolymer base material: combination of chitosan and sodium alginate;
Coupling agent: TTS titanate as a coupling agent;
The method for preparing the ultrafine abrasive biopolymer soft polishing film according to the present invention comprises the steps:
(1) modification processing: aluminum oxide with grain diameter of 10 μm is added to aqueous solution of TTS titanate coupling agent (the concentration of aluminum oxide and the TTS are 2%, 0.02%, respectively) at room temperature, and treated with ultrasound for 10 mins;
(2) mixing the base material: the modified aluminum oxide, CaCO3 with grain diameter of 20 nm, NaCl, glycerol, chitosan and sodium alginate are mechanically and thoroughly mixed in deionized water, the concentrations in weight percentage of them are 2%, 1%, 0.2%, 3%, 3.5%, 5%, respectively;
(3) molding and drying: the mixed sol is coated to a circular spray-tin universal plate, and soaked in calcium ion solution to form a gel film. The gel film is infrared dried and is gently peeled off the universal plate, the smooth surface of the film is attached to a circular back adhesive to form polishing film of the present invention.
The polishing film is placed on the polishing disk of an AUTOPOL-1000S automatic polishing machine. The rotational speed of the polishing disk was set at 90 rpm, the rotation speed of the sample carrying disk was set at 80 rpm, the polishing pressure was 2 kg, a silicon wafer with an original roughness 500 nm was polished for 30 mins, the surface roughness reached 0.6 nm, and the wafer surface did not show any scratch or pit.
It should be noted that, the two above mentioned embodiments are merely used to describe the present invention in a non-limiting fashion, which may further include, but not limited to, following alternatives:
Crosslinking physically or chemically includes: molecular entanglement (gelatin, agarose) caused by temperature change; ion-crosslinking (sodium alginate, carrageenan, combination of sodium alginate and galactomannan gum, combination of carrageenan and xanthan gum); hydrogen bond or dewatering reaction (starch, modified cellulose, chitosan, glucomannan, and pectin); and crystallization (polylactic acid).
The coupling agent includes one or a combination of silane coupling agent (such as KH540, KH550, KH580), titanate coupling agent (such as KR-TTS, KP-TTS, KR-41B) and lignin coupling agent (such as high boiling alcohol solvent HBS).
The ultrafine abrasive comprises one or a combination of diamond, carbide (such as silicon carbide), boride (such as boron nitride) and oxide (such as aluminum oxide, silicon oxide, cerium oxide).
The grain diameter of the ultrafine abrasive may be in the range of 50 nm to 40 μm, and may also be 50 nm, 100 nm, 250 nm, 500 nm, 1 μm, 5 μm, 10 μm, etc.
The drying control chemical additive comprises filler, water carrying agent and pore foaming agent, the mixture ratio of the filler and the water carrying agent is in the range of 1-3 wt %:3-10 wt %. The concentration of the added pore foaming agent is regulated according to the requirement of the porosity of the tool surface, usually 0.1-2%, preferably 0.5-1.5%.
The filler includes one or a combination of SiO2 nanoparticles, CaCO3 nanoparticles, polyimide nanoparticles and calcium magnesium powder nanoparticles. The water carrying agent includes one or a combination of sucrose, lactose, fructose and glycerol. The pore foaming agent includes one or a combination of NaHCO3, NaCl, lauryl sodium sulfate, sodium dodecylbenzene sulfonate.
The biopolymer base material includes one or a combination of starch, modified cellulose, chitosan, agarose, glucomannan, sodium alginate, gelatin, carrageenan, xanthan gum, pectin, galactomannan gum, and polylactic acid.
The ultrafine abrasive biopolymer soft polishing film has the ultrafine abrasive surface modified by a coupling agent, which can efficiently solve the aggregation problem of the abrasive and improve the holding force of the biopolymer base material to the inorganic abrasive. As the polishing film has improved softness, it can provide yielding effect to the abrasive, for avoiding the damage to the workpiece by the bigger hard particles when the fixed abrasive is used during the high efficiency manufacturing. The ultrafine abrasive biopolymer soft polishing film of the present invention can be widely used in ceramic substrate, semiconductor wafer, optical crystal, decoration and construction stone, particularly in ultraprecise manufacturing of large size surface.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2014 1 0215615 | May 2014 | CN | national |
| Filing Document | Filing Date | Country | Kind |
|---|---|---|---|
| PCT/CN2015/079259 | 5/19/2015 | WO | 00 |
| Publishing Document | Publishing Date | Country | Kind |
|---|---|---|---|
| WO2015/176639 | 11/26/2015 | WO | A |
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| Number | Date | Country | |
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| 20170136604 A1 | May 2017 | US |
