characterised by a multi-layered structure

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CPC
B24B37/22

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B24Grinding technology B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS B24B37/00Lapping machines or devices Accessories

Current Industry

B24B37/22characterised by a multi-layered structure

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Controlling chemical mechanical polishing pad stiffness by adjustin...
- Patent number 12,257,664
- Issue date Mar 25, 2025
- Applied Materials, Inc.
- Kevin H. Song
- B24 - GRINDING POLISHING
Information Patent Grant
Polyurethane for polishing layers, polishing layer and polishing pad
- Patent number 12,252,634
- Issue date Mar 18, 2025
- Kuraray Co., Ltd.
- Mitsuru Kato
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing pad and method of fabricating semiconductor device using...
- Patent number 12,246,408
- Issue date Mar 11, 2025
- SK ENPULSE CO., LTD.
- Eun Sun Joeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical mechanical polishing pad and preparation thereof
- Patent number 12,220,784
- Issue date Feb 11, 2025
- Rohm and Haas Electronic Materials CMP Holdings, Inc.
- Bainian Qian
- B24 - GRINDING POLISHING
Information Patent Grant
Microreplicated polishing surface with enhanced co-planarity
- Patent number 12,208,483
- Issue date Jan 28, 2025
- 3M Innovative Properties Company
- Kenneth A. P. Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polishing pad sheet, polishing pad, and method for manufacturing se...
- Patent number 12,138,736
- Issue date Nov 12, 2024
- SK ENPULSE CO., LTD.
- Sung Hoon Yun
- B24 - GRINDING POLISHING
Information Patent Grant
Composition for polishing pad and polishing pad
- Patent number 12,122,013
- Issue date Oct 22, 2024
- SK ENPULSE CO., LTD.
- Jong Wook Yun
- B24 - GRINDING POLISHING
Information Patent Grant
Method of using polishing pad
- Patent number 12,070,833
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- ChunHung Chen
- B24 - GRINDING POLISHING
Information Patent Grant
Formulations for high porosity chemical mechanical polishing pads w...
- Patent number 12,064,846
- Issue date Aug 20, 2024
- Rohm and Haas Electronic Materials CMP Holdings, Inc.
- Bryan E. Barton
- B24 - GRINDING POLISHING
Information Patent Grant
Formulations for chemical mechanical polishing pads with high plana...
- Patent number 12,064,845
- Issue date Aug 20, 2024
- Rohm and Haas Electronic Materials CMP Holdings, Inc.
- Bryan E. Barton
- B24 - GRINDING POLISHING
Information Patent Grant
Rigid backsize to prevent fiber disc curling
- Patent number 12,059,773
- Issue date Aug 13, 2024
- Saint-Gobain Abrasives, Inc.
- Timothy Jerome Coogan
- B24 - GRINDING POLISHING
Information Patent Grant
Surface projection polishing pad
- Patent number 12,048,980
- Issue date Jul 30, 2024
- 3M Innovative Properties Company
- Lian S. Tan
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing articles and integrated system and methods for manufactur...
- Patent number 12,023,853
- Issue date Jul 2, 2024
- Applied Materials, Inc.
- Kasiraman Krishnan
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus and method of forming a polishing article that has a desi...
- Patent number 11,964,359
- Issue date Apr 23, 2024
- Applied Materials, Inc.
- Ashwin Chockalingham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CMP pad construction with composite material properties using addit...
- Patent number 11,958,162
- Issue date Apr 16, 2024
- Applied Materials, Inc.
- Rajeev Bajaj
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing pad, method for producing the same and method of fabricat...
- Patent number 11,951,591
- Issue date Apr 9, 2024
- SK ENPULSE CO., LTD.
- Hye Young Heo
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical mechanical planarization pads with constant groove volume
- Patent number 11,938,584
- Issue date Mar 26, 2024
- CMC MATERIALS LLC
- Paul Andre Lefevre
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing pads for high temperature processing
- Patent number 11,911,870
- Issue date Feb 27, 2024
- Applied Materials, Inc.
- Sivapackia Ganapathiappan
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing pad, polishing apparatus and method of manufacturing semi...
- Patent number 11,878,388
- Issue date Jan 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Cheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Temperature-based in-situ edge assymetry correction during CMP
- Patent number 11,865,671
- Issue date Jan 9, 2024
- Applied Materials, Inc.
- Haosheng Wu
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing layer and polishing method
- Patent number 11,858,089
- Issue date Jan 2, 2024
- IV Technologies Co., Ltd.
- Yu-Hao Pan
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing pad, manufacturing method of polishing pad and polishing...
- Patent number 11,850,701
- Issue date Dec 26, 2023
- IV Technologies Co., Ltd.
- Liang-Chi Tu
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical mechanical planarization pads via vat-based production
- Patent number 11,845,157
- Issue date Dec 19, 2023
- CMC Materials, Inc.
- Eric S. Moyer
- B24 - GRINDING POLISHING
Information Patent Grant
CMP polishing pad with polishing elements on supports
- Patent number 11,833,638
- Issue date Dec 5, 2023
- Rohm and Haas Electronic Materials Holding, Inc.
- John R. McCormick
- B24 - GRINDING POLISHING
Information Patent Grant
Window in thin polishing pad
- Patent number 11,826,875
- Issue date Nov 28, 2023
- Applied Materials, Inc.
- Yongqi Hu
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical mechanical polishing pad and polishing method
- Patent number 11,813,713
- Issue date Nov 14, 2023
- Rohm and Haas Electronic Materials CMP Holdings, Inc.
- Bryan E. Barton
- B24 - GRINDING POLISHING
Information Patent Grant
Advanced polishing pads and related polishing pad manufacturing met...
- Patent number 11,806,829
- Issue date Nov 7, 2023
- Applied Materials, Inc.
- Puneet Narendra Jawali
- B24 - GRINDING POLISHING
Information Patent Grant
Formulations for chemical mechanical polishing pads and CMP pads ma...
- Patent number 11,806,830
- Issue date Nov 7, 2023
- Rohm and Haas Electronic Materials CMP Holdings, Inc.
- Bryan E. Barton
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing pad and method for producing same
- Patent number 11,780,057
- Issue date Oct 10, 2023
- SK ENPULSE CO., LTD.
- Joonsung Ryou
- B24 - GRINDING POLISHING
Information Patent Grant
Porous polishing pad and process for producing the same all fees
- Patent number 11,772,236
- Issue date Oct 3, 2023
- SK ENPULSE CO., LTD.
- Hye Young Heo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MULTILAYER CMP PADS
- Publication number 20250073842
- Publication date Mar 6, 2025
- Rajeev BAJAJ
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING PAD AND POLISHING APPARATUS
- Publication number 20250065468
- Publication date Feb 27, 2025
- Canon Kabushiki Kaisha
- YOSHIKI KONUMA
- B24 - GRINDING POLISHING
Information Patent Application
UV CURABLE PRINTABLE FORMULATIONS FOR POROSITY CONTROL IN HIGH PERF...
- Publication number 20250034296
- Publication date Jan 30, 2025
- Applied Materials, Inc.
- Xinyi LU
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
POLISHING PAD FORMED FROM DUAL CURATIVE
- Publication number 20250033161
- Publication date Jan 30, 2025
- DuPont Electronic Materials Holding, Inc.
- Fengji Yeh
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING PAD WITH REDUCED DEFECT AND METHOD OF PREPARING A SEMICON...
- Publication number 20250033160
- Publication date Jan 30, 2025
- SK enpulse Co., Ltd.
- Yujin SHIN
- B24 - GRINDING POLISHING
Information Patent Application
CMP POLISHING PAD
- Publication number 20250025983
- Publication date Jan 23, 2025
- DuPont Electronic Materials Holding, Inc.
- Bainian Qian
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING PAD AND MANUFACTURING METHOD OF POLISHING PAD AND POLISHI...
- Publication number 20240383094
- Publication date Nov 21, 2024
- IV Technologies CO., Ltd.
- Ko-Wen Chen
- B24 - GRINDING POLISHING
Information Patent Application
METHOD OF USING POLISHING PAD
- Publication number 20240359288
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- ChunHung CHEN
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING PAD WITH ADJUSTED CONTENT OF CHLORINE AND PROCESS FOR PRE...
- Publication number 20240342857
- Publication date Oct 17, 2024
- SK enpulse Co., Ltd.
- Jong Wook YUN
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING PAD AND PREPARATION METHOD THEREOF
- Publication number 20240308022
- Publication date Sep 19, 2024
- SK enpulse Co., Ltd.
- Min Gyeong JI
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING PAD AND PREPARING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20240300066
- Publication date Sep 12, 2024
- SK enpulse Co., Ltd.
- Chang Gyu IM
- B24 - GRINDING POLISHING
Information Patent Application
CHEMICAL MECHANICAL PLANARIZATION PADS WITH CONSTANT GROOVE VOLUME
- Publication number 20240238937
- Publication date Jul 18, 2024
- CMC Materials LLC
- Paul Andre LEFEVRE
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING PAD AND METHOD FOR MANUFACTURING POLISHING PAD
- Publication number 20240227118
- Publication date Jul 11, 2024
- FUJIBO HOLDINGS, INC.
- Teppei TATENO
- B24 - GRINDING POLISHING
Information Patent Application
UV CURABLE PRINTABLE FORMULATIONS FOR HIGH PERFORMANCE 3D PRINTED C...
- Publication number 20240227120
- Publication date Jul 11, 2024
- Applied Materials, Inc.
- Sudhakar MADHUSOODHANAN
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING PAD AND POLISHING METHOD
- Publication number 20240227119
- Publication date Jul 11, 2024
- FUJIMI INCORPORATED
- Kyosuke Tenko
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING PAD AND METHOD OF MONITORING A POLISHING PROCESS USING TH...
- Publication number 20240227113
- Publication date Jul 11, 2024
- SK enpulse Co., Ltd.
- Joonho AN
- B24 - GRINDING POLISHING
Information Patent Application
Chemical Mechanical Polishing Process Method and Device
- Publication number 20240217055
- Publication date Jul 4, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Yu Bao
- B24 - GRINDING POLISHING
Information Patent Application
COMPOSITE POLISHING PAD INCLUDING HIGHLY ABRASION-RESISTANT THIN FI...
- Publication number 20240217056
- Publication date Jul 4, 2024
- KPX CHEMICAL CO., LTD.
- Byung Ju MIN
- B24 - GRINDING POLISHING
Information Patent Application
CHEMICAL MECHANICAL POLISHING PAD WITH FLUORINATED POLYMER AND MULT...
- Publication number 20240207998
- Publication date Jun 27, 2024
- Rohm and Haas Electronic Materials CMP Holdings, INC.
- Matthew R. Gadinski
- B24 - GRINDING POLISHING
Information Patent Application
MEMBRANE COATING COMPOUND FOR CHEMICAL MECHANICAL POLISHING PROCESS...
- Publication number 20240189960
- Publication date Jun 13, 2024
- Samsung Electronics Co., Ltd.
- Yearin BYUN
- B24 - GRINDING POLISHING
Information Patent Application
MICRO-LAYER CMP POLISHING SUBPAD
- Publication number 20240181596
- Publication date Jun 6, 2024
- Rohm and Haas Electronic Materials CMP Holdings, INC.
- Guanhua Hou
- B24 - GRINDING POLISHING
Information Patent Application
DUAL-LAYER CMP POLISHING SUBPAD
- Publication number 20240181597
- Publication date Jun 6, 2024
- Rohm and Haas Electronic Materials CMP Holdings, INC.
- Guanhua Hou
- B24 - GRINDING POLISHING
Information Patent Application
CORRECTION OF FABRICATED SHAPES IN ADDITIVE MANUFACTURING
- Publication number 20240149400
- Publication date May 9, 2024
- Applied Materials, Inc.
- Jason Garcheung Fung
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING PAD AND METHOD FOR MANUFACTURING POLISHING PAD
- Publication number 20240149390
- Publication date May 9, 2024
- FUJIBO HOLDINGS, INC.
- Yoshihide KAWAMURA
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING PAD AND POLISHING METHOD
- Publication number 20240131654
- Publication date Apr 25, 2024
- FUJIMI INCORPORATED
- Kyosuke Tenko
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING PAD AND METHOD FOR MANUFACTURING POLISHING PAD
- Publication number 20240131653
- Publication date Apr 25, 2024
- FUJIBO HOLDINGS, INC.
- Teppei TATENO
- B24 - GRINDING POLISHING
Information Patent Application
METHODS AND PRECURSOR FORMULATIONS FOR FORMING ADVANCED POLISHING P...
- Publication number 20240123568
- Publication date Apr 18, 2024
- Applied Materials, Inc.
- Sivapackia GANAPATHIAPPAN
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CMP POLISHING PAD
- Publication number 20240091901
- Publication date Mar 21, 2024
- Rohm and Haas Electronic Materials CMP Holdings, INC.
- Bainian Qian
- B24 - GRINDING POLISHING
Information Patent Application
ADVANCED POLISHING PADS AND RELATED POLISHING PAD MANUFACTURING MET...
- Publication number 20240025010
- Publication date Jan 25, 2024
- Applied Materials, Inc.
- Puneet Narendra JAWALI
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING PAD, DOUBLE-SIDE POLISHING DEVICE, AND DOUBLE-SIDE POLISH...
- Publication number 20240009799
- Publication date Jan 11, 2024
- Shin-Etsu Handotai Co., Ltd.
- Junichi UENO
- B24 - GRINDING POLISHING

characterised by a multi-layered structure

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Controlling chemical mechanical polishing pad stiffness by adjustin...

Polyurethane for polishing layers, polishing layer and polishing pad

Polishing pad and method of fabricating semiconductor device using...

Chemical mechanical polishing pad and preparation thereof

Microreplicated polishing surface with enhanced co-planarity

Polishing pad sheet, polishing pad, and method for manufacturing se...

Composition for polishing pad and polishing pad

Method of using polishing pad

Formulations for high porosity chemical mechanical polishing pads w...

Formulations for chemical mechanical polishing pads with high plana...

Rigid backsize to prevent fiber disc curling

Surface projection polishing pad

Polishing articles and integrated system and methods for manufactur...

Apparatus and method of forming a polishing article that has a desi...

CMP pad construction with composite material properties using addit...

Polishing pad, method for producing the same and method of fabricat...

Chemical mechanical planarization pads with constant groove volume

Polishing pads for high temperature processing

Polishing pad, polishing apparatus and method of manufacturing semi...

Temperature-based in-situ edge assymetry correction during CMP

Polishing layer and polishing method

Polishing pad, manufacturing method of polishing pad and polishing...

Chemical mechanical planarization pads via vat-based production

CMP polishing pad with polishing elements on supports

Window in thin polishing pad

Chemical mechanical polishing pad and polishing method

Advanced polishing pads and related polishing pad manufacturing met...

Formulations for chemical mechanical polishing pads and CMP pads ma...

Polishing pad and method for producing same

Porous polishing pad and process for producing the same all fees

Patents Applicationslast 30 patents

MULTILAYER CMP PADS

POLISHING PAD AND POLISHING APPARATUS

UV CURABLE PRINTABLE FORMULATIONS FOR POROSITY CONTROL IN HIGH PERF...

POLISHING PAD FORMED FROM DUAL CURATIVE

POLISHING PAD WITH REDUCED DEFECT AND METHOD OF PREPARING A SEMICON...

CMP POLISHING PAD

POLISHING PAD AND MANUFACTURING METHOD OF POLISHING PAD AND POLISHI...

METHOD OF USING POLISHING PAD

POLISHING PAD WITH ADJUSTED CONTENT OF CHLORINE AND PROCESS FOR PRE...

POLISHING PAD AND PREPARATION METHOD THEREOF

POLISHING PAD AND PREPARING METHOD OF SEMICONDUCTOR DEVICE

CHEMICAL MECHANICAL PLANARIZATION PADS WITH CONSTANT GROOVE VOLUME

POLISHING PAD AND METHOD FOR MANUFACTURING POLISHING PAD

UV CURABLE PRINTABLE FORMULATIONS FOR HIGH PERFORMANCE 3D PRINTED C...

POLISHING PAD AND POLISHING METHOD

POLISHING PAD AND METHOD OF MONITORING A POLISHING PROCESS USING TH...

Chemical Mechanical Polishing Process Method and Device

COMPOSITE POLISHING PAD INCLUDING HIGHLY ABRASION-RESISTANT THIN FI...

CHEMICAL MECHANICAL POLISHING PAD WITH FLUORINATED POLYMER AND MULT...

MEMBRANE COATING COMPOUND FOR CHEMICAL MECHANICAL POLISHING PROCESS...

MICRO-LAYER CMP POLISHING SUBPAD

DUAL-LAYER CMP POLISHING SUBPAD

CORRECTION OF FABRICATED SHAPES IN ADDITIVE MANUFACTURING

POLISHING PAD AND METHOD FOR MANUFACTURING POLISHING PAD

POLISHING PAD AND POLISHING METHOD

POLISHING PAD AND METHOD FOR MANUFACTURING POLISHING PAD

METHODS AND PRECURSOR FORMULATIONS FOR FORMING ADVANCED POLISHING P...

CMP POLISHING PAD

ADVANCED POLISHING PADS AND RELATED POLISHING PAD MANUFACTURING MET...

POLISHING PAD, DOUBLE-SIDE POLISHING DEVICE, AND DOUBLE-SIDE POLISH...