Ultraviolet activated antimicrobial surfaces

Abstract

The invention is directed to an ion plasma deposition (IPD) method adapted to coat polymer surfaces with highly adherent antimicrobial films. A controlled ion plasma deposition (IPD) process is used to coat a metal or polymer with a selected metal/metal oxide. Exposing the coated surface to ultraviolet light significantly improves the antimicrobial properties of the deposited coatings.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a sketch of the IPD apparatus. Target material (1), substrate being coated (2), mechanism for moving the substrate closer and further away from the target (3), vacuum chamber (4), power supply for the target (5).

FIG. 2 is another embodiment of the IPD apparatus. Target material (1), substrate being coated (2), mechanism for moving the substrate closer and further away from the target (3), vacuum chamber (4), power supply for the target (5), device to control arc speed (6).

FIG. 3 is an example of the setup for a modified IPD/UV apparatus for depositing an adherent highly antimicrobial coating on a substrate. The apparatus incorporates the features of FIG. 1 and/or FIG. 2 with a source (7) to input ultraviolet light at selected wavelengths.

Claims

1. A method for producing a highly adherent, antimicrobial coating, comprising: depositing a first substantially macroparticulate-free metal coating on a selected substrate;depositing a second macroparticulate dense metal coating to form a surface layer on said first coating; andexposing the surface layer to ultraviolet light in the range of 120-400 nm;

2. The method of claim 1 wherein the coating metal is selected from the group consisting of silver, gold, platinum, copper, tantalum, titanium, zirconium, hafnium, and zinc.

3. The method of claim 1 wherein the metal deposition onto a substrate is controlled by adjusting distance of the substrate holder from a cathodic arc target.

4. The method of claim 1 wherein the metal deposition is controlled by varying speed of the arc on the target surface.

5. The method of claim 1 wherein the coating metal is silver, copper or titanium.

6. The method of claim 1 wherein ultraviolet light frequencies in the range of 200-400 nm are selected for the coating metal.

7. The method of claim 1 wherein the substrate is a polymer selected from the group consisting of polypropylene, polyurethane, PTFE, polyimide, polyester, PEEK, UHMWPE, and nylon.

8. The method of claim 1 wherein the substrate is a metal selected from the group consisting of tantalum, titanium, zirconium, hafnium, silicon, iron, cobalt, chromium, zinc, alloys, and combinations thereof.

9. The method of claim 1 wherein the substrate is glass.

8. The method of claim 1 further comprising providing ozone during the ionic plasma vapor deposition.

9. The method of claim 1 wherein coating thickness is between about 100 nm and 1 micron.

10. The method of claim 1 wherein exposing the metal coating to UV light is during deposition.

11. The method of claim 1 wherein exposing the metal coating to UV light is after deposition.

12. The method of claim 1 wherein the coating comprises Ti, TiO and TiO2

13. The method of claim 1 wherein the coating comprises Cu, CuO and Cu2O.

14. The method of claim 1 wherein the coating comprises Ag, AgO and Ag2O.

15. A medical device coated with an antimicrobially active metal/metal oxide ion plasma deposited layer, wherein said layer comprises an imbedded substantially macroparticle-free underlayer and a surface deposited ultraviolet activated macroparticle dense layer.

16. The medical device of claim 15 which is selected from the group consisting of stents, catheters, valves and implants.

17. The medical device of claim 15 which comprises a polymer material.

18. The medical device of claim 15 which comprises a metal.

19. The medical device of claim 15 wherein coating thickness is up to about 30 microns.

20. The medical device of claim 15 wherein the coating comprises a metal/metal oxide selected from the group consisting of Ag/AgO/Ag2O, Cu/CuO/Cu2O, Ti/TiO/TiO2 and combinations thereof.