Claims
- 1. A process of using a thermoplastic molding composition that contains a copolycarbonate comprising 34 to 26 mole % of residues of compounds corresponding to formula (I), wherein R1 to R4 independently of one another, represent H, C1-C4-alkyl, phenyl, substituted phenyl or halogen, and 56 to 74 mole % of residues of compounds corresponding to formula (II) wherein R5to R8 independently of one another, are H, CH3, Cl or Br, and X is C1-C5-alkylene, C2-C5-alkylidene, C5-C6-cycloalkylene, C5-C10-cycloalkylidene, as monomers, wherein the total of said mole % of residues of monomers corresponding to formula (I) and formula (II) is equal to 100 mole % the process comprising molding an article and subjecting the article to temperature lower than 0° C..
- 2. The process of claim 1 wherein the article is a film.
- 3. The process of claim 1 wherein the copolycarbonate comprise 30 mole % of residues of compounds corresponding to formula (I).
- 4. The process of claim 1 wherein the compound of formula (I) is 4,4′-dihydroxydiphenyl.
- 5. The process of claim 1 wherein said copolycarbonates comprise 30 mole % of residues of 4,4′-dihydroxydiphenyl.
Priority Claims (1)
Number |
Date |
Country |
Kind |
100 47 483 |
Sep 2000 |
DE |
|
Parent Case Info
This application is a divisional of U.S. Ser. No. 09/962,168, filed Sep. 24, 2001.
US Referenced Citations (3)
Number |
Name |
Date |
Kind |
5401826 |
Sakashita et al. |
Mar 1995 |
A |
5470938 |
Sakashita et al. |
Nov 1995 |
A |
5532324 |
Sakashita et al. |
Jul 1996 |
A |
Foreign Referenced Citations (1)
Number |
Date |
Country |
0 544 407 |
Jun 1993 |
EP |