User interfaces including electronic sensors, for example, field effect sensors or capacitive sensors, are known in the art. Such user interfaces commonly include a touch panel having an outer surface that is decorated to identify the sensor locations and/or the functions they control. The sensors themselves typically are embodied as one or more discrete sensing electrodes and an associated control circuit located on a separate circuit carrier, for example, a printed wiring board, that is attached to the opposite surface of the touch panel. The sensing electrodes are disposed on the circuit carrier in an arrangement that corresponds to the arrangement of the foregoing decorations on the touch panel. The sensors respond to stimuli, for example, a user's fingertip or other object, touching or coming into proximity with the corresponding portions of the panel.
The sensing electrodes typically are formed by printing conductive ink onto the circuit carrier or by patterning and etching a conductive layer disposed on the circuit carrier, as would be understood by one skilled in the art. Once the sensing electrodes are formed, their locations on the carrier are fixed. Subsequent changes to the sensing electrode arrangement would be difficult, if not impossible.
Conductors 16 could be disposed between substrates 12 and 18 in any suitable manner, as would be recognized by one skilled in the art. For example, conductors 16 could be formed by plating, patterning and etching copper or another suitable conductive material on substrate 12 as one might fabricate a printed wiring board. Alternatively, conductors 16 could be made of conductive ink printed onto substrate 12 using a screen printing process or any other suitable process, as would be recognized by one skilled in the art. As a further alternative, conductors 16 could be preformed and placed onto substrate 12. For example, conductors 16 could be stampings made of copper or another conductive material placed onto or otherwise disposed upon substrate 12. An adhesive could be disposed between substrate 12 and such preformed conductors 16 to preclude inadvertent movement of the preformed conductors with respect to substrate 12 once placed onto substrate 12.
Substrate 18 could be disposed on conductors 16 and exposed portions of substrate 12. Substrate 18 could be joined to substrate 12 using any suitable means. In the illustrated embodiments, substrate 18 is joined to substrate 12 by means of ultrasonically-formed welds 20. Alternatively, an adhesive could be used to join substrate 18 to substrate 12 (and, optionally, to conductors 16). A combination of these techniques could be used, as well. One skilled in the art would recognize that substrate 18 could be joined to substrate 12 in other ways, as well.
Conductor assembly 10 also could be produced in bulk and/or on a substantially continuous basis. For example, substrates 12 and 18 could be provided in bulk as sheets of flexible polyester material suitable for use as a circuit carrier rolled onto spools. Preformed conductors 16 could provided in bulk as continuous strips, ribbons, wires or other forms of copper or another conductive material rolled onto spools. Substrates 12 and 18 and conductors 16 could be unrolled from the respective spools, joined together as set forth above, and rolled onto a take-up spool to form a roll of conductor assembly 10 or cut into sections to form conductors assemblies 10 of any desired shape and size. Alternatively, substrates 12 and 18 could be unrolled from the respective spools, conductors 16 could be printed or otherwise deposited onto one or both of substrates 12 and 18, substrates 12 and 18 could be joined together as set forth above, and the assembly could be rolled onto a take-up spool as a roll of conductor assembly 10 or cut into sections to form conductors assemblies 10 of any desired shape and size.
In
Conductors 16 could have any suitable width or widths. In an illustrative embodiment wherein conductors 16 are embodied as interconnected diamond-shaped portions, such as that illustrated in
The spacing between adjacent pairs of conductors 16 in a particular array 14 could be set as desired. For example, the spacing between conductors 16 could range from 0.2-2.0 mm or, more preferably, from 0.5-1.0 mm. In other embodiments, the spacing between conductors could be less than 0.2 mm or greater than 2.0 mm, as desired. One skilled in the art would recognize that the overall conductor pitch could be limited by the width of the individual conductors 16.
In any event, the spacing between conductors 16 in a particular array typically would be substantially similar. In some embodiments, however, the spacing between certain pairs of conductors 16 in a particular array 14 could differ from the spacing between other pairs of conductors 16 in the particular array 14. For example, a given pair of conductors 16 could be spaced more closely together than another pair of conductors 16.
In embodiments wherein conductors 16 take other forms, conductors 16 can be sized as desired. For example, in embodiments wherein conductors 16 are substantially straight wires or ribbons, conductors 16 could have widths ranging from 0.5 mm or narrower to 25 mm or wider. In such embodiments, the center-to-center conductor spacing (or pitch) typically would be about 0.5 mm or less to about 25 mm or more. Typically, all of conductors 16 within a particular conductor array 14 would have substantially similar or identical shapes and widths. In some embodiments, however, the various conductors within a particular conductor array 14 could have substantially dissimilar shapes and/or widths.
Conductor assemblies 10A and 10B could be joined back-to-back (for example, with second substrate 18A of conductor assembly 10A abutting first substrate 12B of conductor assembly 10B). Alternatively, conductor assemblies 10A and 10B could be separated by some intervening structure or void, for example, another substrate or an air gap. Conductor assemblies 10A and 10B could be joined to each other using any suitable means, for example, an adhesive layer, ultrasonic welding, or others, as would be understood by one skilled in the art.
Preferably, conductor assemblies 10A and 10B are arranged such that connecting portions 36 of conductors 16A cross connecting portions 36 conductors 16B and such that diamond-shaped portions of conductors 16B do not overlie diamond-shaped portions of conductors 16A. In some embodiments, a portion of the diamond-shaped portions of conductors 16B could overlie a portion of the diamond-shaped portions of conductors 16A. In
As discussed above, all of conductors 16A typically would be of substantially similar or identical shape and width and would be substantially equally spaced. Also, all of conductors 16B typically would be of substantially similar or identical shape and width and would be substantially equally spaced. Conductors 16B, however, could be of substantially different shape and/or width than conductors 16A and could be spaced differently, as well.
The spacing between layers of conductors 16A and 16B would be a function of at least the thickness of the dielectric layer(s) separating them. In an embodiment, this spacing could be about 0.5 mm. In other embodiment, the spacing could be greater or lass than 0.5 mm, as desired and/or practical.
As shown in
Control circuit 40 can have signal generation means for providing excitation signals to individual ones of conductors 16A, 16B and detection means for detecting the presence of a finger or other object (that is, a stimulus) near individual ones of conductors 16A, 16B using capacitive sensing or another technology, as would be understood by one skilled in the art and as discussed further below. For example, control circuit 40 can be adapted to detect a finger or other object touching or in proximity to a portion of substrate 12A or substrate 18B that is in proximity to one or more of conductors 16A, 16B. The signal generation means and detection means could be adapted to use principles of self-capacitance and/or mutual capacitance, as would be recognized by one skilled in the art and as may be suggested by the discussions of operation below. Generally, detection means adapted to use principles of mutual capacitance may be preferable in embodiments in which it is desired to simultaneously detect multiple touches (touches at several locations) to substrate 12A and/or substrate 18B.
With reference to
Control circuit 40 (or another circuit and/or microprocessor connected thereto) can be programmed with software and/or firmware (or implemented with hardware or otherwise) to provide various predetermined control outputs in response to control circuit 40 detecting a stimulus to a particular conductor 16A and a particular conductor 16B at substantially the same time (the design of the control circuit might preclude it from detecting a stimulus to more than one conductor at exactly the same time), as might occur when a user touches or brings a finger near a corresponding portion of substrate 12A or substrate 18B. For example, with reference to
Similarly, control circuit 40 can be programmed to provide a second control output in response to control circuit 40 detecting a stimulus to another particular pair of conductors 16A and 16B at substantially the same time as might occur when a user touches or brings a finger near another corresponding portion of substrate 12A or substrate 18B. For example, control circuit 40 could be programmed to provide a second control output when it substantially simultaneously detects a stimulus to at least one of conductors 16A and at least one of conductors 16B underlying touch surface 32D. More particularly, control circuit 40 could be programmed to provide the second control output when it substantially simultaneously detects a stimulus to one or more of conductor pairs 16A1 and 16B1, 16A2 and 16B1, 16A2 and 16B1, and 16A2 and 16B2.
As would be recognized by one skilled in the art, control circuit 40 can be programmed to provide further control outputs in response to stimuli to other predetermined pairs of conductors 16A and 16B. The locations of such conductor pairs typically would correspond to the locations of respective predetermined touch surfaces on substrate 12A and/or 18B.
Control circuit 40 also can be programmed to provide a null control output (which could be yet another predetermined control output or no control output at all) in response to the detection of a stimulus to only a single conductor 16A, 16B or to the lack of detection of a stimulus to any of conductors 16A, 16B. Control circuit 40 further can be programmed to provide a null control output in response to the substantially simultaneous detection of a stimulus to one of conductors 16A and one of conductors 16B not corresponding to touch surfaces 32A-32D or other particular, predetermined portions of substrate 12A or substrate 18B. For example, with reference to
With reference to
With reference to
In some embodiments, sensor array 30 can be attached to a separate user interface substrate (not shown) using adhesives or other means, as would be understood by one skilled in the art. In such embodiments, the labels (or decorations) referred to in the foregoing discussion of
Because control circuit 40 can be hardwired or programmed with software to respond in particular, predetermined ways to stimuli to particular, predetermined portions of sensor array 30 (and/or a separate user interface panel), a single sensor array 30 can be used in any number of user interface applications having any number of touch surface layouts without modification to the underlying structure or orientation of conductors 16A, 16B. For example,
Array 30 is described above as being made from two pre-fabricated conductor assemblies 10A, 10B. In other embodiments, one of layers 18A, 12B could be omitted so that only a single dielectric layer is present between conductors 16A and 16B. In other embodiments, additional dielectric layers could be present between conductors 16A and 16B. In further embodiments, conductors 16A, 16B could be disposed on opposite sides of a substrate (for example, a printed wiring board or flexible circuit carrier) without discrete outer dielectric layers. Discrete outer dielectric layers optionally could be added to such a structure.
The structures described above could be used in numerous applications, and could be scaled as desired. Generally, it may be desirable to increase the conductor size/width/pitch with increasing size of the application. For example, it may be desirable to use a relatively small conductor size/pitch/width in a user interface panel for a small appliance, such as a blender, and to use a relatively large conductor size/pitch/width in a user interface panel for a large appliance, such as a range. Although relatively small conductor size/pitch/width could be used in a large scale application as well as a small scale application, it could be less complex and costly to use a relatively large conductor size/pitch/width wherever feasible because it could involve the use of less overall conductive material and processing power. More particularly, relatively large scale conductors could be embodied in a partially open, rather than solid, form. Also, an array of relatively large scale conductors would involve relatively few conductors per unit of array area, thus reducing the amount processing requirements for the control circuit, as would be understood by one skilled in the art. An excessively large conductor size/pitch/width, however, could negatively impact the ability to configure the array to emulate discrete, individual sensors, at certain predetermined locations of the array.
The foregoing description and accompanying drawings are intended to illustrate the principles of the invention and not to limit its scope. One skilled in the art would recognize that the disclosed embodiments could be modified in various ways without departure form the scope of the invention as defined by the following claims. Also, to the extent that specific features might be discussed herein only in connection with a specific embodiment, the features discussed in connection with any embodiment generally could be used in connection with any other embodiment except to the extent that context indicates otherwise.
This application claims the benefit of priority under 35 U.S.C. §119(e) to U.S. Provisional Patent Application No. 61/604,923, filed Feb. 29, 2012, the disclosure of which is incorporated herein by reference in its entirety
Number | Date | Country | |
---|---|---|---|
61604923 | Feb 2012 | US |