The present invention relates to a valve device adjusting flow volumes of a plurality of fluids for adjusting the temperature of an electronic device under test and a temperature adjusting system for an electronic device.
In the test of semiconductor integrated circuit devices and other electronic devices, it is required that the temperature of the electronic devices are held at a high temperature, ordinary temperature, or low temperature. Further, the electronic devices emit heat on their own during operation. Therefore, the electronic devices have to be adjusted in temperature.
When using a cooling medium and heating medium to adjust the temperature of an electronic device via a heat sink, there has been the problem that, unless precisely controlling their flow volumes, the temperature of the electronic device cannot be adjusted well.
The problem to be solved by the present invention is to provide a valve device and temperature control system enabling precision control of the flow volumes of a plurality of fluids.
According to the present invention, there is provided a valve device for adjusting flow volumes of a plurality of fluids for adjusting the temperature of an electronic device under test, characterized in that the valve device comprises: a plurality of flow paths through which the fluids are able to flow; and a merging section into which the plurality of flow paths merge, the merging section has a switching member internally and a first channel is formed in the switching member, and the switching member makes the first channel face at least two flow paths among the plurality of flow paths so as to connect the at least two flow paths.
While not particularly limited to this in the above invention, preferably the first channel has an opening width reduced toward its end parts.
While not particularly limited to this in the above invention, preferably the switching member is a rotary body provided rotatably inside the merging section.
While not particularly limited to this in the above invention, preferably the rotary body is a shaft provided rotatably inside the merging section, and the first channel is formed in a circumferential surface of the shaft.
While not particularly limited to this in the above invention, preferably a second channel is formed in the rotary body at a position symmetric with respect to the first channel around its axial center of rotation.
While not particularly limited to this in the above invention, preferably the second channel has an opening width reduced toward its end parts.
While not particularly limited to this in the above invention, preferably the rotary body has a bypass path running through the rotary body.
While not particularly limited to this in the above invention, preferably the plurality of flow paths merge into the merging section radially, and the first channel, the second channel, and the bypass path are arranged substantially in parallel.
While not particularly limited to this in the above invention, preferably the plurality of flow paths include: a first flow path; a second flow path which is adjacent to the first flow path; and a third flow path which is adjacent to the second flow path, and the rotary body can rotate among a first rotary position where the first channel faces the first flow path and the second flow path, a second rotary position where the first channel faces the first flow path, the second flow path, and the third flow path, and a third rotary position where the first channel faces the second flow path and the third flow path.
While not particularly limited to this in the above invention, preferably the first flow path is a first inflow path from which the cooling medium flows in, the second flow path is an outflow path from which at least one of the cooling medium or heating medium flows out, and the third flow path is a second inflow path from which the heating medium flows in.
While not particularly limited to this in the above invention, preferably when the rotary body is at the second rotary position, the cooling medium flowing in from the first inflow path and the heating medium flowing in from the second inflow path are mixed at the outflow path.
While not particularly limited to this in the above invention, preferably the first channel has an opening width reduced toward its end parts so that flow volume of fluids flowing from the first inflow path and the second inflow path to the outflow path is substantially constant.
While not particularly limited to this in the above invention, preferably the plurality of flow paths further include: a fourth flow path; a fifth flow path which is adjacent to the fourth flow path; and a sixth flow path which is adjacent to the fifth flow path, a second channel is formed in the rotary body, when the rotary body is at the first rotary position, the second channel faces the fourth flow path and the fifth flow path, when the rotary body is at the second rotary position, the second channel faces the fourth flow path, the fifth flow path, and the sixth flow path, and when the rotary body is at the third rotary position, the second channel faces the fifth flow path and the sixth flow path.
While not particularly limited to this in the above invention, preferably the fourth flow path is a first return path returning the cooling medium, the fifth flow path is a third inflow path from which at least one of the cooling medium or heating medium flows in, and the sixth flow path is a second return path return path returning the heating medium.
While not particularly limited to this in the above invention, preferably when the rotary body is at the second rotary position, fluid flowing in from the third inflow path is divided between the first return path and the second return path.
While not particularly limited to this in the above invention, preferably the second channel has an opening width gradually reduced toward its end parts so that flow volume of fluid flowing from the third inflow path to the first return path and the second return path is substantially constant.
While not particularly limited to this in the above invention, preferably the rotary body has a bypass path running through the rotary body, when the rotary body is at the first rotary position, the bypass path connects the third flow path and the sixth flow path, and when the rotary body is at the third rotary position, the bypass path connects the first flow path and the fourth flow path.
While not particularly limited to this in the above invention, preferably the first to sixth flow paths are connected to the merging section at equal intervals.
While not particularly limited to this in the above invention, preferably the device further comprises a rotation driving means for turning the rotary body turn.
While not particularly limited to this in the above invention, preferably the switching member is a moving body provided slidably inside the merging section.
While not particularly limited to this in the above invention, preferably a second channel is formed in the moving body at a symmetric position with respect to the first channel.
While not particularly limited to this in the above invention, preferably the second channel has an opening width gradually reduced toward its end parts.
While not particularly limited to this in the above invention, preferably the moving body has a bypass path running through the moving body.
Further, according to the present invention, there is provided a temperature control system for controlling a temperature of an electronic device under test, characterized in that the temperature control system comprises: a heat sink contacting the electronic device under test; a cooling medium feeding means for feeding a cooling medium to the heat sink; a heating medium feeding means for feeding a heating medium to the heat sink; and the above valve device interposed between the heat sink and the cooling medium feeding means and between the heat sink and the heating medium feeding means.
While not particularly limited to this in the above invention, preferably the heat sink is connected to the outflow path and the third inflow path, the cooling medium feeding means is connected to the first inflow path and the first return path, and the heating medium feeding means is connected to the second inflow path and the second return path.
In the present invention, a first channel which is formed in a switching member faces at least two flow paths so as to connect the flow paths, so the flow volumes of a plurality of fluids can be precisely controlled.
Below, embodiments of the present invention will be explained based on the drawings.
First, a temperature adjusting system 1 for an electronic device in which a valve device 40 according to the present embodiment is used will be explained.
A temperature adjusting system 1 for an electronic device in the present embodiment is a system using a cooling medium and heating medium to adjust the temperature of an electronic device while a thermal chuck 30 for pushing an electronic device under test against a socket of a test head etc. contacts the electronic device. As the cooling medium and heating medium, for example, a fluorine-based inert fluid (for example, Fluorinert® made by 3M) or a water-based heat conductive fluid (for example, Dynalene HC-10 made by Dynalene Inc.) etc. may be mentioned.
This temperature adjusting system 1, as shown in
The cooling medium feed system 10 comprises a pump 11, accumulator 12, regulator 13, chuck valve 14, and chiller 15. In this cooling medium feed system 10, the pump 11 pumps the cooling medium so that the cooling medium circulates inside the system. Further, the cooling medium passes through a heat exchange part 151 of the chiller 15 whereby the cooling medium is cooled to a set temperature.
Also the heating medium feed system 20 comprises a pump 21, accumulator 22, regulator 23, chuck valve 24, and boiler 25. In this heating medium feed system 20 as well, the pump 21 pumps the heating medium so that the heating medium circulates inside the system. Further, the heating medium passes through a heat exchange part 251 of the boiler 25 whereby the heating medium is heated to a set temperature.
The cooling medium passed through the heat exchange part 151 of the chiller 15 is guided through the cooling medium feed pipe 16 to the valve device 40. Similarly, the heating medium passing through the heat exchange part 251 of the boiler 25 is also guided through a heating medium feed pipe 26 to the valve device 40. The valve device 40 mixes the cooling medium and heating medium while adjusting their flow volumes so that the temperature of the electronic device becomes the target temperature, and it guides the mixed solution to the heat sink 90.
A chamber 91 through which the mixed solution can flow is formed inside the heat sink 90. A large number of fins 92 are provided at the bottom surface of this chamber 91 in order to improve the cooling/heating efficiency. When the mixed solution is guided from the valve device 40 to the inside of the chamber 91, the electronic device and mixed solution exchange heat via the heat sink 90. Further, the used mixed solution is returned from the heat sink 90 to the valve device 40, and it returns to the cooling medium feed system 10 and heating medium feed system 20 via the recovery pipes 17, 27.
Next, the structure of the valve device 40 in the present embodiment will be explained.
The valve device 40, as shown in
As shown in
The first connection port 51a is connected to the cooling medium feed pipe 16 of the cooling medium feed system 10, while the second connection port 51b is connected to the heating medium feed pipe 26 of the heating medium feed system 20. On the other hand, the third connection port 51c is connected to the cooling medium recovery pipe 17 of the cooling medium feed system 10, while the fourth connection port 51d is connected to the heating medium recovery pipe 27 of the heating medium feed system 20.
Further, as shown in
The first and second inflow paths 52a, 52c are both channels bent into bow shapes from the corners to the center at the bottom surface of the upper member 50. One end of the first inflow path 52a is connected to the first connection port 51a and cooling medium flows in from the cooling medium feed system 10. On the other hand, one end of the second inflow path 52c is connected to the second connection port 51b and heating medium flows in from the heating medium feed system 20.
As opposed to this, the outflow path 52b, unlike the first and second inflow paths 52a, 52c, is a channel extending straight and short at the bottom surface of the upper member 50. One end of this outflow path 52b is connected to a first communicating hole 62 (explained later) of the lower member 60, and cooling medium and heating medium flowing in through the first and second inflow paths 52a, 52c flow out to the chamber 91 of the heat sink 90. This outflow path 52b is arranged between the first inflow path 52a and the second inflow path 52c.
The third inflow path 52e, like the outflow path 52b, is also a channel extending straight and short at the bottom surface of the upper member 50. One end of this third inflow path 52e is connected to a second communicating hole 63 (explained later) of the lower member 60, and the used mixed solution flows in from the chamber 91 of the heat sink 90.
As opposed to this, the first and second return paths 52d, 52f both, in the same way as the first and second inflow paths 52a, 52c, are channels bent into bow shapes from corners toward the center at the bottom surface of the upper member 50. One end of the first return path 52d is connected with the third connection port 51c, while one end of the second return path 52f is connected to the fourth connection port 51d. The used mixed solution is returned through the first and second return paths 52d, 52f to the cooling medium feed system 10 and the heating medium feed system 20.
These six flow paths 52a to 52f, as shown in
The lower member 60, as shown in
The merging section 65, as shown in
When assembling the upper member 50 and the lower member 60, the first opening 65a faces the first inflow path 52a. Similarly, the second opening 65b faces the outflow path 52b, the third opening 65c faces the second inflow path 52c, the fourth opening 65d faces the first return path 52d, the fifth opening 65e faces the third inflow path 52e, and the sixth opening 65f faces the second return path 52f.
Furthermore, as shown in
As shown in
The valve shaft 70, as shown in
As shown in
Further, as shown in
This valve shaft 70, as shown in
The large-diameter part 71 of the valve shaft 70 is held rotatably inside the merging section 65 and is designed to be able to continuously rotate to the first to third positions shown in
At the first rotary position shown in
At this first rotary position, the first inflow path 52a and the outflow path 52b are communicated through the first channel 72, so the mixed solution fed to the chamber 91 of the heat sink 90 consists of only the cooling medium fed from the cooling medium feed system 10. Similarly, the first return path 52d and the third inflow path 52e are communicated through the second channel 73, so the used mixed solution flowing in from the heat sink 90 is returned to the cooling medium feed system 10 in full.
On the other hand, the heating medium fed from the heating medium feed system 20 is not fed to the heat sink 90 at all and is returned through the bypass path 74 and second return path 52f to the heating medium feed system 20 in full. Due to this bypass path 74, leakage of the heating medium due to pressure can be suppressed and a drop in temperature of the heating medium due to stagnant flow can be suppressed.
At the second rotary position shown in
At this second rotary position, the first inflow path 52a, outflow path 52b, and second inflow path 52c are communicated through the first channel 72, so the cooling medium fed through the first inflow path 52a from the cooling medium feed system 10 and the heating medium fed through the second inflow path 52c from the heating medium feed system 20 are mixed at the merging section 65, then the mixed solution flows out through the outflow path 52b into the chamber 91 of the heat sink 90. The ratio of the cooling medium and heating medium forming this mixed solution is 50:50.
Similarly, at this second rotary position, the first return path 52d, third inflow path 52e, and second return path 52f are communicated through the second channel 73, so the mixed solution flowing in through the third inflow path 52e to the merging section 65 is returned through the first and second return paths 52d, 52f to the cooling medium feed system 10 and the heating medium feed system 20 in a divided fashion. The divided ratio of the mixed solution at this time is also 50:50.
At the third rotary position shown in
At this third rotary position, the outflow path 52b and the second inflow path 52c are communicated through the first channel 72, so the mixed solution fed to the chamber 91 of the heat sink 90 consists of only the heating medium fed from the heating medium feed system 20. Similarly, the third inflow path 52e and the second return path 52f are communicated through the second channel 73, so the used mixed solution flowing in from the heat sink 90 is returned to the heating medium feed system 20 in full.
On the other hand, the cooling medium fed from the cooling medium feed system 10 is not fed to the heat sink 90 at all and is returned through the bypass path 74 and first return path 52d to the cooling medium feed system 10 in full. Due to this bypass path 74, leakage of the cooling medium due to pressure can be suppressed and a rise in temperature of the cooling medium due to stagnant flow can be suppressed.
In the present embodiment, the opening width of the first channel 72 is gradually reduced at its ends. Due to this, when turning the valve shaft 70 from the second rotary position to the first rotary position, as shown in
Similarly, the opening of the second channel 73 is gradually reduced at its ends. Due to this, when turning the valve shaft 70 from the second rotary position to the first rotary position, while not particularly illustrated, the flow volume of the mixed solution flowing out to the first return path 52d continuously increases, and the flow volume of the mixed solution flowing out to the second return path 52f continuously decreases. As a result, the flow volume of the mixed solution flowing in through the third inflow path 52e from the heat sink 90 is substantially constant at all times.
Conversely, even when turning the valve shaft 70 from the first rotary position to the second rotary position, as shown in
When turning the valve shaft 70 from the second rotary position to the third rotary position as well, since the opening width of the first channel 72 gradually decreases at its ends, as shown in
Similarly, since the opening width of the second channel 73 gradually decreases at its ends, when turning the valve shaft 70 from the second rotary position to the third rotary position as well, while not particularly illustrated, the flow volume of the mixed solution flowing out to the first return path 52d continuously decreases, and the flow volume of the mixed solution flowing out to the second return path 52f continuously increases. As a result, the flow volume of the mixed solution flowing in through the third inflow path 52e from the heat sink 90 is substantially constant.
Conversely, when turning the valve shaft 70 turn from the third rotary position to the second rotary position as well, as shown in
In the above way, in the present embodiment, the first channel 72 formed in the valve shaft 70 faces at least two flow paths 52a to 52c so as to communicate these flow paths 52a to 52c, so the flow volumes of the cooling medium and the heating medium can be precisely controlled and good temperature control of the electronic device can be performed.
Note that, instead of the valve shaft 70, a block shaped valve block 70B may also be used to configure the valve device.
This valve block 70B, as shown in
As shown in
When the cooling medium and the heating medium are mixed in a ratio of 50:50 and supplied to the heat sink 90 by the valve device, as shown in
As opposed to this, when supplying only the cooling medium to the heat sink 90, as shown in
Further, when the valve device supplies only the heating medium to the heat sink 90, as shown in
In the valve device comprising the valve block 70B explained above, by sliding the valve block 70B inside the merging section 65B, the mixing ratio of the cooling medium and the heating medium can be continuously changed.
Note that the above-explained embodiments were described in order to facilitate understanding of the present invention and were not described in order to limit the present invention. Therefore, the elements disclosed in the above embodiments include all design modifications and equivalents falling under the technical scope of the present invention.
For example, it is also possible to provide the heat sink 90 with two independent chambers and circulating a cooling medium and heating medium in the heat sink 90 independently without mixing.
Further, the shape of the rotary body in the present invention is not limited to a rod shaped one and may be a spherical shaped one as well.
Filing Document | Filing Date | Country | Kind | 371c Date |
---|---|---|---|---|
PCT/JP2009/059703 | 5/27/2009 | WO | 00 | 5/10/2010 |
Publishing Document | Publishing Date | Country | Kind |
---|---|---|---|
WO2010/137137 | 12/2/2010 | WO | A |
Number | Name | Date | Kind |
---|---|---|---|
627019 | Streubel | Jun 1899 | A |
2822821 | Gordon | Feb 1958 | A |
3211534 | Ridgway | Oct 1965 | A |
3354904 | Federle et al. | Nov 1967 | A |
3411538 | Gruner et al. | Nov 1968 | A |
3536296 | Burris | Oct 1970 | A |
3710251 | Hagge et al. | Jan 1973 | A |
3721265 | Hoffland | Mar 1973 | A |
3927693 | Johnston | Dec 1975 | A |
4164956 | Takahashi et al. | Aug 1979 | A |
4846213 | Hutchens et al. | Jul 1989 | A |
5108075 | Downard et al. | Apr 1992 | A |
5135026 | Manska | Aug 1992 | A |
5375622 | Houston | Dec 1994 | A |
5529758 | Houston | Jun 1996 | A |
5634352 | Nagai et al. | Jun 1997 | A |
6352105 | Serratto | Mar 2002 | B1 |
20040210162 | Wyatt et al. | Oct 2004 | A1 |
20090127068 | Ikeda et al. | May 2009 | A1 |
Number | Date | Country |
---|---|---|
2042546 | Aug 1989 | CN |
500506 | Feb 1939 | GB |
53-040417 | Apr 1978 | JP |
54-104033 | Aug 1979 | JP |
61-114376 | Jul 1986 | JP |
62-062073 | Apr 1987 | JP |
03-033384 | Apr 1991 | JP |
2001-330004 | Nov 2001 | JP |
2004-027394 | Jan 2004 | JP |
10-2009-0008896 | Jan 2009 | KR |
Entry |
---|
China Office action, mail date is Aug. 1, 2012. |
Korea Office action dated Jan. 3, 2012. |
China Office action dated Jan. 10, 2012. |
Japan Office action, dated Jun. 25, 2013 along with an english translation thereof. |
China Office action, mail date is Aug. 14, 2013. |
China Office action, mail date is Feb. 18, 2013. |
Number | Date | Country | |
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20110126931 A1 | Jun 2011 | US |