Claims
- 1. A circuit assembly, comprising:
a primary winding having a first conductive strip, wherein the primary winding is positioned in a first plane; a secondary winding having a second conductive strip, wherein the secondary winding is positioned in a second plane, wherein second plane is substantially parallel to the first plane; a dielectric material positioned between the primary and secondary windings; and a conductive material positioned and formed to provide electrical communication between an interior of the primary winding and an interior of the secondary winding.
- 2. The circuit assembly of claim 1, wherein the conductive material is also configured to function as a common ground node between the primary and secondary winding.
- 3. The circuit assembly of claim 1, wherein the first and second conductive strips are substantially vertically aligned.
- 4. The circuit assembly of claim 1, wherein the primary and secondary windings are positioned at a distance of less than 8 microns from each other.
- 5. The circuit assembly of claim 1, wherein the primary and secondary windings are constructed of copper.
- 6. The circuit assembly of claim 1, wherein the conductive material is formed from a single via.
- 7. A circuit assembly, comprising:
a primary winding having a first conductive strip, wherein the primary winding is positioned in a first plane; a secondary winding having a second conductive strip, wherein the secondary winding is positioned in a second plane, wherein second plane is substantially parallel to the first plane; a dielectric material positioned between the primary and secondary winding; a first conductive material positioned to provide electrical communication between an interior section of the primary winding and a common conductor; and a second conductive material positioned to provide electrical communication between an exterior section of the secondary winding and the common conductor.
- 8. The circuit assembly of claim 7, wherein the primary and secondary windings are positioned at a distance less than 8 microns from each other.
- 9. The circuit assembly of claim 7, wherein the first and second conductive strips are substantially vertically aligned.
- 10. The circuit assembly of claim 7, wherein the primary and secondary windings are constructed of copper.
- 11. The circuit assembly of claim 7, wherein the first conductive material is formed from a single via.
- 12. The circuit assembly of claim 7, wherein the second conductive material is formed from a via.
- 13. A transformer for use in an integrated circuit, comprising:
a primary winding disposed in a first layer of the integrated circuit; a secondary winding disposed in a second layer of the integrated circuit, the second layer being separated from the first layer by a dielectric layer; wherein the primary and secondary windings are positioned such that the windings are inductively coupled.
- 14. The transformer of claim 13, wherein the primary and secondary windings are substantially vertically aligned in the integrated circuit.
- 15. The transformer of claim 13, further comprising one or more additional windings disposed in separate layers of the integrated circuit and positioned to be inductively coupled to the primary or secondary windings of the transformer.
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application is a continuation of application Ser. No. 09/706,328, filed Nov. 3, 2000, now U.S. Pat. No. ______, issued ______, which is a nonprovisional application claiming the benefit under 35 U.S.C. § 119(e) of U.S. Provisional Application No. 60/163,294 filed on Nov. 3, 1999, and titled “3-D VERTICAL MMIC STRUCTURES AND SOFTWARE FOR CAPACITORS, TRANSFORMERS, RESONATORS AND OTHER COMPONENTS,” the subject matter of which is specifically incorporated herein by reference.
Provisional Applications (1)
|
Number |
Date |
Country |
|
60163294 |
Nov 1999 |
US |
Continuations (1)
|
Number |
Date |
Country |
Parent |
09706328 |
Nov 2000 |
US |
Child |
10334661 |
Dec 2002 |
US |