Inductive arrangements

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H01L23/645

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/645Inductive arrangements

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Planar magnetic radial inductors to enable VR disaggregation
- Patent number 12,362,295
- Issue date Jul 15, 2025
- Intel Corporation
- Kaladhar Radhakrishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coupled loop and void structure integrated in a redistribution laye...
- Patent number 12,354,978
- Issue date Jul 8, 2025
- Xilinx, Inc.
- Po-Wei Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Air-core transformer package with ferrite electro-magnetic interfer...
- Patent number 12,347,789
- Issue date Jul 1, 2025
- HIGH TECHNOLOGY LIMITED
- Chik Wai (David) Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor dies and devices with a coil for inductive coupling
- Patent number 12,347,796
- Issue date Jul 1, 2025
- Intel Corporation
- Martin Ostermayr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic core inductors on package substrates
- Patent number 12,336,196
- Issue date Jun 17, 2025
- Intel Corporation
- Krishna Bharath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inverted leads for packaged isolation devices
- Patent number 12,336,231
- Issue date Jun 17, 2025
- Texas Instruments Incorporated
- John Paul Tellkamp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanically tolerant couplers
- Patent number 12,327,164
- Issue date Jun 10, 2025
- International Business Machines Corporation
- Timothy Phung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Optoelectronic semiconductor component and arrangement
- Patent number 12,327,803
- Issue date Jun 10, 2025
- Osram Opto Semiconductors GmbH
- Matthias Hien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic substrate core having an embedded laser stop to control...
- Patent number 12,327,814
- Issue date Jun 10, 2025
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna and device configurations
- Patent number 12,315,986
- Issue date May 27, 2025
- QUALCOMM Incorporated
- Seong Heon Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit with guard ring
- Patent number 12,315,798
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chiao-Han Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate, electronic device package and method for manufac...
- Patent number 12,315,828
- Issue date May 27, 2025
- Advanced Semiconductor Engineering, Inc.
- Wu Chou Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an electronic device structure having an electron...
- Patent number 12,300,638
- Issue date May 13, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Shaun Bowers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module
- Patent number 12,293,973
- Issue date May 6, 2025
- HITACHI ENERGY LTD
- Slavo Kicin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for delivering power to semiconductors
- Patent number 12,289,050
- Issue date Apr 29, 2025
- Vicor Corporation
- Patrizio Vinciarelli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertically integrated device stack including system on chip and pow...
- Patent number 12,289,898
- Issue date Apr 29, 2025
- QUALCOMM Incorporated
- Peng Zou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package board
- Patent number 12,278,197
- Issue date Apr 15, 2025
- Murata Manufacturing Co., Ltd.
- Kenji Nishiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package with 3D magnetic core inductor
- Patent number 12,272,637
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device with integrated inductor and manufactu...
- Patent number 12,255,157
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component module
- Patent number 12,255,224
- Issue date Mar 18, 2025
- Murata Manufacturing Co., Ltd.
- Takafumi Kusuyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies having integrated magnetic core inductors
- Patent number 12,249,584
- Issue date Mar 11, 2025
- Intel Corporation
- Kristof Kuwawi Darmawikarta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and manufacturing method thereof
- Patent number 12,230,590
- Issue date Feb 18, 2025
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate embedded magnetic core inductors and method of making
- Patent number 12,230,430
- Issue date Feb 18, 2025
- Intel Corporation
- Srinivas Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic inductor device and method
- Patent number 12,224,253
- Issue date Feb 11, 2025
- Intel Corporation
- Xin Ning
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic core inductors in interposer
- Patent number 12,224,252
- Issue date Feb 11, 2025
- Intel Corporation
- Krishna Bharath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna boards and communication devices
- Patent number 12,218,408
- Issue date Feb 4, 2025
- Intel Corporation
- Trang Thai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power supply system and power supply module
- Patent number 12,211,827
- Issue date Jan 28, 2025
- Delta Electronics (Shanghai) Co., Ltd.
- Pengkai Ji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming semiconductor package wi...
- Patent number 12,211,803
- Issue date Jan 28, 2025
- STATS ChipPAC Pte. Ltd.
- HunTeak Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Extended via semiconductor structure and device
- Patent number 12,199,033
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hung Hsun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure and method
- Patent number 12,199,051
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
TRANSFORMER PACKAGES WITH MAGNETIC CORE SUSPENSION
- Publication number 20250239397
- Publication date Jul 24, 2025
- ALLEGRO MICROSYSTEMS, LLC
- William P. Taylor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL POWER DELIVERY IN SPACE-CONSTRAINED SYSTEM-ON-PACKAGE
- Publication number 20250233088
- Publication date Jul 17, 2025
- Intel Corporation
- Rinkle Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED INDUCTORS AND INTEGRATED VOLTAGE REGULATORS FOR PACKAGED S...
- Publication number 20250226337
- Publication date Jul 10, 2025
- SARAS MICRO DEVICES, INC.
- Carlos Andres Riera Cercado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR CERAMIC COMPONENTS EMBEDDED IN A SUBSTRATE CORE
- Publication number 20250218982
- Publication date Jul 3, 2025
- Intel Corporation
- Suddhasattwa Nad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL INTERCONNECTS FOR PACKAGES CONTAINING PHOTONIC INTEGRATE...
- Publication number 20250219034
- Publication date Jul 3, 2025
- Celestial AI Inc.
- Matteo Staffaroni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR A STACK OF COMPONENTS EMBEDDED IN A SUBSTRATE CORE
- Publication number 20250218962
- Publication date Jul 3, 2025
- Intel Corporation
- Mahdi Mohammadighaleni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Technologies for Components Embedded in a Substrate Core
- Publication number 20250219040
- Publication date Jul 3, 2025
- Intel Corporation
- Tolga ACIKALIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR CONNECTED COMPONENTS EMBEDDED IN A SUBSTRATE CORE
- Publication number 20250218964
- Publication date Jul 3, 2025
- Intel Corporation
- Kyle J. Arrington
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULATION TECHNIQUES FOR COMPONENTS EMBEDDED IN A CORE LAYER OF...
- Publication number 20250218984
- Publication date Jul 3, 2025
- Intel Corporation
- Zhixin Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COIL COMPONENT AND IC CARD HAVING THE SAME
- Publication number 20250210237
- Publication date Jun 26, 2025
- TDK Corporation
- Ryota UCHIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVE STRUCTURES IN EMBEDDED BRIDGE ARCHITECTURES
- Publication number 20250183179
- Publication date Jun 5, 2025
- Intel Corporation
- Brandon C. MARIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PANEL SCALE PACKAGING OF A PLURALITY OF TRANSFORMER DEVICES FOR RED...
- Publication number 20250183201
- Publication date Jun 5, 2025
- Danger Devices Inc.
- Nicholas SUTARDJA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR POWER MODULE, MOTOR CONTROLLER, AND VEHICLE
- Publication number 20250183134
- Publication date Jun 5, 2025
- BYD COMPANY LIMITED
- Chunjiang LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE WITH INTEGRATED INDUCTOR AND MANUFACTU...
- Publication number 20250183202
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- WEN-SHIANG LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging module and manufacturing method therefor
- Publication number 20250157903
- Publication date May 15, 2025
- SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD
- Jian WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250149471
- Publication date May 8, 2025
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20250140716
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EFFICIENT IGBT SWITCHING
- Publication number 20250132755
- Publication date Apr 24, 2025
- EHT Ventures LLC
- Timothy Ziemba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250125256
- Publication date Apr 17, 2025
- Samsung Electronics Co., Ltd.
- Jae Sup Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATES WITH COMPONENTS INCLUDED IN CAVITIES OF GLASS CORES
- Publication number 20250125201
- Publication date Apr 17, 2025
- Intel Corporation
- Brandon Christian Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250125318
- Publication date Apr 17, 2025
- Mitsubishi Electric Corporation
- Shin Chaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR A COAXIAL INDUCTOR IN A GLASS CORE
- Publication number 20250112179
- Publication date Apr 3, 2025
- Intel Corporation
- Brandon Christian Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COAXIAL METAL INDUCTOR LOOPS AND ASSOCIATED METHODS
- Publication number 20250104911
- Publication date Mar 27, 2025
- Intel Corporation
- Jaeil Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE WITH EMBEDDED AND SHIELDED INDUCTORS
- Publication number 20250096089
- Publication date Mar 20, 2025
- ADVANCED MICRO DEVICES, INC.
- Robert Grant SPURNEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE AND METHOD
- Publication number 20250096163
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SUPPLY SYSTEM AND POWER SUPPLY MODULE
- Publication number 20250062296
- Publication date Feb 20, 2025
- DELTA ELECTRONICS (SHANGHAI) CO.,LTD.
- Pengkai JI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250062199
- Publication date Feb 20, 2025
- ROHM CO., LTD.
- Hiroaki MATSUBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR ASSEMBLY INCLUDING THE SAME
- Publication number 20250054825
- Publication date Feb 13, 2025
- Samsung Electronics Co., Ltd.
- Jaehyun LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER AND FABRICATION THEREOF
- Publication number 20250054883
- Publication date Feb 13, 2025
- UNITED MICROELECTRONICS CORP.
- Da-Jun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250054884
- Publication date Feb 13, 2025
- RENESAS ELECTRONICS CORPORATION
- Tohru KAWAI
- H01 - BASIC ELECTRIC ELEMENTS

Inductive arrangements

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Planar magnetic radial inductors to enable VR disaggregation

Coupled loop and void structure integrated in a redistribution laye...

Air-core transformer package with ferrite electro-magnetic interfer...

Semiconductor dies and devices with a coil for inductive coupling

Magnetic core inductors on package substrates

Inverted leads for packaged isolation devices

Mechanically tolerant couplers

Optoelectronic semiconductor component and arrangement

Electronic substrate core having an embedded laser stop to control...

Antenna and device configurations

Integrated circuit with guard ring

Package substrate, electronic device package and method for manufac...

Method of forming an electronic device structure having an electron...

Power semiconductor module

Method and apparatus for delivering power to semiconductors

Vertically integrated device stack including system on chip and pow...

Package board

Integrated fan-out package with 3D magnetic core inductor

Semiconductor package device with integrated inductor and manufactu...

Electronic component module

Microelectronic assemblies having integrated magnetic core inductors

Electronic package and manufacturing method thereof

Substrate embedded magnetic core inductors and method of making

Magnetic inductor device and method

Magnetic core inductors in interposer

Antenna boards and communication devices

Power supply system and power supply module

Semiconductor device and method of forming semiconductor package wi...

Extended via semiconductor structure and device

Integrated circuit structure and method

Patents Applicationslast 30 patents

TRANSFORMER PACKAGES WITH MAGNETIC CORE SUSPENSION

VERTICAL POWER DELIVERY IN SPACE-CONSTRAINED SYSTEM-ON-PACKAGE

EMBEDDED INDUCTORS AND INTEGRATED VOLTAGE REGULATORS FOR PACKAGED S...

TECHNOLOGIES FOR CERAMIC COMPONENTS EMBEDDED IN A SUBSTRATE CORE

ELECTRICAL INTERCONNECTS FOR PACKAGES CONTAINING PHOTONIC INTEGRATE...

TECHNOLOGIES FOR A STACK OF COMPONENTS EMBEDDED IN A SUBSTRATE CORE

Technologies for Components Embedded in a Substrate Core

TECHNOLOGIES FOR CONNECTED COMPONENTS EMBEDDED IN A SUBSTRATE CORE

ENCAPSULATION TECHNIQUES FOR COMPONENTS EMBEDDED IN A CORE LAYER OF...

COIL COMPONENT AND IC CARD HAVING THE SAME

PASSIVE STRUCTURES IN EMBEDDED BRIDGE ARCHITECTURES

PANEL SCALE PACKAGING OF A PLURALITY OF TRANSFORMER DEVICES FOR RED...

SEMICONDUCTOR POWER MODULE, MOTOR CONTROLLER, AND VEHICLE

SEMICONDUCTOR PACKAGE DEVICE WITH INTEGRATED INDUCTOR AND MANUFACTU...

Packaging module and manufacturing method therefor

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

EFFICIENT IGBT SWITCHING

SEMICONDUCTOR PACKAGE

PACKAGE SUBSTRATES WITH COMPONENTS INCLUDED IN CAVITIES OF GLASS CORES

SEMICONDUCTOR DEVICE

TECHNOLOGIES FOR A COAXIAL INDUCTOR IN A GLASS CORE

COAXIAL METAL INDUCTOR LOOPS AND ASSOCIATED METHODS

CHIP PACKAGE WITH EMBEDDED AND SHIELDED INDUCTORS

INTEGRATED CIRCUIT STRUCTURE AND METHOD

POWER SUPPLY SYSTEM AND POWER SUPPLY MODULE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR ASSEMBLY INCLUDING THE SAME

INTERPOSER AND FABRICATION THEREOF

SEMICONDUCTOR DEVICE