Inductive arrangements

Industry

CPC
H01L23/645

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/645Inductive arrangements

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Integrated fan-out package with 3D magnetic core inductor
- Patent number 12,272,637
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device with integrated inductor and manufactu...
- Patent number 12,255,157
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Wen-Shiang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component module
- Patent number 12,255,224
- Issue date Mar 18, 2025
- Murata Manufacturing Co., Ltd.
- Takafumi Kusuyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies having integrated magnetic core inductors
- Patent number 12,249,584
- Issue date Mar 11, 2025
- Intel Corporation
- Kristof Kuwawi Darmawikarta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and manufacturing method thereof
- Patent number 12,230,590
- Issue date Feb 18, 2025
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate embedded magnetic core inductors and method of making
- Patent number 12,230,430
- Issue date Feb 18, 2025
- Intel Corporation
- Srinivas Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic inductor device and method
- Patent number 12,224,253
- Issue date Feb 11, 2025
- Intel Corporation
- Xin Ning
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic core inductors in interposer
- Patent number 12,224,252
- Issue date Feb 11, 2025
- Intel Corporation
- Krishna Bharath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna boards and communication devices
- Patent number 12,218,408
- Issue date Feb 4, 2025
- Intel Corporation
- Trang Thai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power supply system and power supply module
- Patent number 12,211,827
- Issue date Jan 28, 2025
- Delta Electronics (Shanghai) Co., Ltd.
- Pengkai Ji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming semiconductor package wi...
- Patent number 12,211,803
- Issue date Jan 28, 2025
- STATS ChipPAC Pte. Ltd.
- HunTeak Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Extended via semiconductor structure and device
- Patent number 12,199,033
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hung Hsun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure and method
- Patent number 12,199,051
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming microelectronic device assemblies and packages
- Patent number 12,199,068
- Issue date Jan 14, 2025
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid glass core for wafer level and panel level packaging applica...
- Patent number 12,191,240
- Issue date Jan 7, 2025
- Intel Corporation
- Jieying Kong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded inductors and integrated voltage regulators for packaged s...
- Patent number 12,183,692
- Issue date Dec 31, 2024
- SARAS MICRO DEVICES, INC.
- Carlos Riera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated magnetic assembly with conductive field plates
- Patent number 12,183,693
- Issue date Dec 31, 2024
- Texas Instruments Incorporated
- Enis Tuncer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with integrated voltage regulator device and...
- Patent number 12,176,305
- Issue date Dec 24, 2024
- Advanced Semiconductor Engineering, Inc.
- Pao-Nan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device for enhancing quality factor of inductor and m...
- Patent number 12,176,385
- Issue date Dec 24, 2024
- Richwave Technology Corp.
- Chia-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,165,960
- Issue date Dec 10, 2024
- Rohm Co., Ltd.
- Hiroaki Matsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,165,993
- Issue date Dec 10, 2024
- Renesas Electronics Corporation
- Tohru Kawai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolation device and method of transmitting a signal across an isol...
- Patent number 12,166,146
- Issue date Dec 10, 2024
- MPICS INNOVATIONS PTE. LTD
- Kok Keong Richard Lum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic substrates having embedded inductors
- Patent number 12,159,844
- Issue date Dec 3, 2024
- Intel Corporation
- Benjamin Duong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and method of fabricating the same
- Patent number 12,154,875
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductor devices and stacked power supply topologies
- Patent number 12,154,937
- Issue date Nov 26, 2024
- Infineon Technologies Austria AG
- Danny Clavette
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Organic interposer including a dual-layer inductor structure and me...
- Patent number 12,142,582
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Wei-Han Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package embedded magnetic inductor structures and manufacturing tec...
- Patent number 12,132,015
- Issue date Oct 29, 2024
- Intel Corporation
- William J. Lambert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductor built-in substrate
- Patent number 12,125,626
- Issue date Oct 22, 2024
- Ibiden Co., Ltd.
- Satoru Kawai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-scale planar-coil transformer with shield
- Patent number 12,125,630
- Issue date Oct 22, 2024
- Analog Devices International Unlimited Company
- Baoxing Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier module
- Patent number 12,119,793
- Issue date Oct 15, 2024
- Murata Manufacturing Co., Ltd.
- Takashi Yamada
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
TECHNOLOGIES FOR A COAXIAL INDUCTOR IN A GLASS CORE
- Publication number 20250112179
- Publication date Apr 3, 2025
- Intel Corporation
- Brandon Christian Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COAXIAL METAL INDUCTOR LOOPS AND ASSOCIATED METHODS
- Publication number 20250104911
- Publication date Mar 27, 2025
- Intel Corporation
- Jaeil Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE WITH EMBEDDED AND SHIELDED INDUCTORS
- Publication number 20250096089
- Publication date Mar 20, 2025
- ADVANCED MICRO DEVICES, INC.
- Robert Grant SPURNEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE AND METHOD
- Publication number 20250096163
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SUPPLY SYSTEM AND POWER SUPPLY MODULE
- Publication number 20250062296
- Publication date Feb 20, 2025
- DELTA ELECTRONICS (SHANGHAI) CO.,LTD.
- Pengkai JI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250062199
- Publication date Feb 20, 2025
- ROHM CO., LTD.
- Hiroaki MATSUBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR ASSEMBLY INCLUDING THE SAME
- Publication number 20250054825
- Publication date Feb 13, 2025
- Samsung Electronics Co., Ltd.
- Jaehyun LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER AND FABRICATION THEREOF
- Publication number 20250054883
- Publication date Feb 13, 2025
- UNITED MICROELECTRONICS CORP.
- Da-Jun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250054884
- Publication date Feb 13, 2025
- RENESAS ELECTRONICS CORPORATION
- Tohru KAWAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20250046738
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE
- Publication number 20250029939
- Publication date Jan 23, 2025
- Fuji Electric Co., Ltd.
- Motohito HORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FUNCTIONAL SUBSTRATE AND METHOD FOR MANUFACTURING SAME
- Publication number 20250029938
- Publication date Jan 23, 2025
- BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Yifan WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE EMBEDDED MAGNETIC INDUCTOR STRUCTURES AND MANUFACTURING TEC...
- Publication number 20250022814
- Publication date Jan 16, 2025
- Intel Corporation
- William J. LAMBERT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATING CHIP AND SIGNAL TRANSMISSION DEVICE
- Publication number 20250014799
- Publication date Jan 9, 2025
- Rohm Co., Ltd.
- Bungo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR POWER DELIVERY THROUGH PACKAGE SUBSTRATES...
- Publication number 20250006611
- Publication date Jan 2, 2025
- Intel Corporation
- Srinivas Venkata Ramanuja Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR POWER DELIVERY THROUGH PACKAGE SUBSTRATES...
- Publication number 20250006612
- Publication date Jan 2, 2025
- Intel Corporation
- Srinivas Venkata Ramanuja Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD OF MANUFACTURE
- Publication number 20240413120
- Publication date Dec 12, 2024
- STMicroelectronics S.r.l
- Giovanni GRAZIOSI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240405122
- Publication date Dec 5, 2024
- Fuji Electric Co., Ltd.
- Yosuke SAKURAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISTRIBUTING ON CHIP INDUCTORS FOR MONOLITHIC VOLTAGE REGULATION
- Publication number 20240404966
- Publication date Dec 5, 2024
- Oracle International Corporation
- Michael Henry Soltau Dayringer
- G05 - CONTROLLING REGULATING
Information Patent Application
TRANSFORMER-BASED ISOLATOR WITH SENSE COIL
- Publication number 20240395736
- Publication date Nov 28, 2024
- ALLEGRO MICROSYSTEMS, LLC
- John Horan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240395735
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shih-Yuan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOWIRE, FABRICATION METHOD OF ARRAY SUBSTRATE, ARRAY SUBSTRATE AN...
- Publication number 20240387631
- Publication date Nov 21, 2024
- BOE TECHNOLOGY GROUP CO., LTD.
- Hao WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ORGANIC INTERPOSER INCLUDING A DUAL-LAYER INDUCTOR STRUCTURE AND ME...
- Publication number 20240379589
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Wei-Han CHIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240379574
- Publication date Nov 14, 2024
- Rohm Co., Ltd.
- Yoshizo OSUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MAKING THE SAME
- Publication number 20240371787
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chieh HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH CORE VIA COAXIAL-TYPE INDUCTORS WITH TWO OR MORE MAGNETIC M...
- Publication number 20240371799
- Publication date Nov 7, 2024
- Intel Corporation
- Aleksander ALEKSOV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFORMER DESIGN WITH BALANCED INTERWINDING CAPACITANCE FOR IMPRO...
- Publication number 20240371800
- Publication date Nov 7, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Raul Blecic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240371801
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTOR STRUCTURE, SEMICONDUCTOR PACKAGE AND FABRICATION METHOD TH...
- Publication number 20240363559
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240363606
- Publication date Oct 31, 2024
- ROHM CO., LTD.
- Yoshizo OSUMI
- H01 - BASIC ELECTRIC ELEMENTS

Inductive arrangements

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Integrated fan-out package with 3D magnetic core inductor

Semiconductor package device with integrated inductor and manufactu...

Electronic component module

Microelectronic assemblies having integrated magnetic core inductors

Electronic package and manufacturing method thereof

Substrate embedded magnetic core inductors and method of making

Magnetic inductor device and method

Magnetic core inductors in interposer

Antenna boards and communication devices

Power supply system and power supply module

Semiconductor device and method of forming semiconductor package wi...

Extended via semiconductor structure and device

Integrated circuit structure and method

Methods of forming microelectronic device assemblies and packages

Hybrid glass core for wafer level and panel level packaging applica...

Embedded inductors and integrated voltage regulators for packaged s...

Integrated magnetic assembly with conductive field plates

Semiconductor package with integrated voltage regulator device and...

Semiconductor device for enhancing quality factor of inductor and m...

Semiconductor device

Semiconductor device

Isolation device and method of transmitting a signal across an isol...

Electronic substrates having embedded inductors

Package and method of fabricating the same

Inductor devices and stacked power supply topologies

Organic interposer including a dual-layer inductor structure and me...

Package embedded magnetic inductor structures and manufacturing tec...

Inductor built-in substrate

Micro-scale planar-coil transformer with shield

Power amplifier module

Patents Applicationslast 30 patents

TECHNOLOGIES FOR A COAXIAL INDUCTOR IN A GLASS CORE

COAXIAL METAL INDUCTOR LOOPS AND ASSOCIATED METHODS

CHIP PACKAGE WITH EMBEDDED AND SHIELDED INDUCTORS

INTEGRATED CIRCUIT STRUCTURE AND METHOD

POWER SUPPLY SYSTEM AND POWER SUPPLY MODULE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR ASSEMBLY INCLUDING THE SAME

INTERPOSER AND FABRICATION THEREOF

SEMICONDUCTOR DEVICE

PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE

FUNCTIONAL SUBSTRATE AND METHOD FOR MANUFACTURING SAME

PACKAGE EMBEDDED MAGNETIC INDUCTOR STRUCTURES AND MANUFACTURING TEC...

INSULATING CHIP AND SIGNAL TRANSMISSION DEVICE

METHODS AND APPARATUS FOR POWER DELIVERY THROUGH PACKAGE SUBSTRATES...

METHODS AND APPARATUS FOR POWER DELIVERY THROUGH PACKAGE SUBSTRATES...

SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD OF MANUFACTURE

SEMICONDUCTOR DEVICE

DISTRIBUTING ON CHIP INDUCTORS FOR MONOLITHIC VOLTAGE REGULATION

TRANSFORMER-BASED ISOLATOR WITH SENSE COIL

ELECTRONIC DEVICE

NANOWIRE, FABRICATION METHOD OF ARRAY SUBSTRATE, ARRAY SUBSTRATE AN...

ORGANIC INTERPOSER INCLUDING A DUAL-LAYER INDUCTOR STRUCTURE AND ME...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MAKING THE SAME

THROUGH CORE VIA COAXIAL-TYPE INDUCTORS WITH TWO OR MORE MAGNETIC M...

TRANSFORMER DESIGN WITH BALANCED INTERWINDING CAPACITANCE FOR IMPRO...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

INDUCTOR STRUCTURE, SEMICONDUCTOR PACKAGE AND FABRICATION METHOD TH...

SEMICONDUCTOR DEVICE