The present invention is related to U.S. patent application Ser. No. 10/999,889, entitled “Voltage Controlled Delay Loop with Central Interpolator,” filed contemporaneously herewith and incorporated by reference herein.
The present invention is related to techniques for clock and data recovery (CDR) and, more particularly, to methods and apparatus for digital control of the generation and selection of different phases of a clock signal.
In many applications, including digital communications, clock and data recovery (CDR) must be performed before data can be decoded. Generally, in a digital clock recovery system, a reference clock signal of a given frequency is generated together with a number of different clock signals having the same frequency but with different phases. In one typical implementation, the different clock signals are generated by applying the reference clock signal to a delay network. Thereafter, one or more of the clock signals are compared to the phase of an incoming data stream and one or more of the clock signals are selected for data recovery.
A number of existing digital CDR circuits use voltage controlled delay loops (VCDL) to generate a number of clocks having the same frequency and different phase for data sampling (i.e., oversampling). For example, published International Patent Application No. WO 97/14214, discloses a compensated delay locked loop timing vernier. The disclosed timing vernier produces a set of timing signals of similar frequency and evenly distributed phase. An input reference clock signal is passed through a succession of delay stages. A separate timing signal is produced at the output of each delay stage. The reference clock signal and the timing signal output of the last delay stage are compared by an analog phase lock controller. The analog phase lock controller controls the delay of all stages so that the timing signal output of the last stage is phase locked to the reference clock. Based on the results of the oversampled data, the internal clock is delayed so that it provides data sampling adjusted to the center of the “eye.” The phase of the VCDL is adjusted to keep up with phase deviations of the incoming data.
While such voltage controlled delay loops effectively generate the sampling clocks and control the delay stages to maintain alignment of the reference clock signal and the last timing signal, they suffer from a number of limitations, which if overcome, could further improve the utility of such voltage controlled delay loops. For example, the analog implementation of the phase lock controller is complex and generally cannot be easily ported from one technology to another. In addition, digital-to-analog conversion is required to convert the digital phase adjustment control into analog signal control. A need therefore exists for voltage controlled delay loops with digital phase control.
Generally, a voltage controlled delay loop and method are disclosed for clock and data recovery applications. The voltage controlled delay loop generates clock signals having similar frequency and different phases. The voltage controlled delay loop comprises a plurality of delay elements; and an input that selectively injects a reference clock into any one of the plurality of delay elements. The plurality of delay elements are connected in series, such as in a loop. In one exemplary implementation, each delay element has an associated multiplexer that selects one of the reference clock and a signal from a previous delay element.
The injection point control of the present invention allows a desired phase relationship to be maintained between the reference clock and a sample clock. The granularity of the disclosed voltage controlled delay loop is equal to the delay associated with each delay element.
A more complete understanding of the present invention, as well as further features and advantages of the present invention, will be obtained by reference to the following detailed description and drawings.
The present invention provides voltage controlled delay loops with digital phase control. The present invention controls the phase offset from the reference clock to the data sampling clock by shifting the injection point of the reference clock into the voltage controlled delay loop.
The second data control loop 160 is comprised of a preamplifier 165, a data sampling block 170, an optional data decimator 175, a parallel data and clock output block 180 and a second order proportional and integral (PI) filter 190. The serial data is received and amplified by the preamplifier 165 and applied to the data sampling block 170. The data sampling block 170 samples the data using the plurality of phases, T0, S0, . . . Ti, Si. The data samples are then applied to the optional data decimator 175 that drops the data rate, for example, by a factor of two. In addition, the data sampling block 170 provides a recovered bit clock output that is applied to the data decimator 175, parallel data and clock output block 180 and second order PI filter 190. The parallel data and clock output block 180 outputs the sampled serial data and recovered lower frequency clock as parallel data (usually 16 or 20 bit wide) and clock. The second order PI filter 190 interprets the transition and sample information associated with the, T0, S0, . . . Ti, Si samples to generate phase control information for the VCDL 120. Generally, the phase control information ensures that the transitions are maintained close to the transition points (see
According to one aspect of the present invention, coarse phase control is provided. In order to control the phase offset between the PLL frequency and data sampling (Si) and transition sampling (Ti), the injection point of the PLL frequency into the VCDL 120 is shifted.
The delay stages 420-i may be embodied, for example, using current mode logic (CML) delay stages. In the exemplary implementation having 16 delay elements, each delay stage 420-i should provide a delay equal to one-eighth of the unit interval (i.e., the width of the “eye” in
The VCDL 300 of
A plurality of identical die are typically formed in a repeated pattern on a surface of the wafer. Each die includes a device described herein, and may include other structures or circuits. The individual die are cut or diced from the wafer, then packaged as an integrated circuit. One skilled in the art would know how to dice wafers and package die to produce integrated circuits. Integrated circuits so manufactured are considered part of this invention.
It is to be understood that the embodiments and variations shown and described herein are merely illustrative of the principles of this invention and that various modifications may be implemented by those skilled in the art without departing from the scope and spirit of the invention.
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