Vortical boiling phenomenon based water cooling block

Abstract

A convective cooling cell is providing the vortical boiling regime of flow of coolant inside of it that allows exploiting important advantages of the vortical boiling phenomenon: highest coefficient of the heat transfer at very small increase of the hydro-resistance, unchangeable or even increasing performance (thermo-resistance) at increase of the coolant's discharge, and anti-adhesive action of stream inside the cooling cell.

Description

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates generally to an apparatus for and a method of cooling of heat generating surfaces. It claims priority under U.S. Provisional Patent USA 61/336,655 filed Jan. 25, 2010.

2. Description of the Related Art

Thirty years ago, new phenomena in hydrodynamics forced a re-examination of the entire approach to the efficiency problem in convective cooling processes. That central problem was to overcome the losses of efficiency of convective cooling with the increasing of the coolant's velocity. The solution was in the study of laminar flow, which is based on the premise that fields of velocity of any stable flow are determined locally if the source of energy, the boundary walls, and free surfaces are all known. It was concluded that there are two types of concavities on the globally smooth surfaces: those that are allow a laminar streamlining were called a potential concavities and those that do not allow any laminar streamlining, even at arbitrarily small velocities of the fluid were called a non-potential concavities.

The investigation of said non-potential concavities has lead to the discovery of a new type of self-organization of the fluid at streamlining of cavities: the vortical boiling phenomenon.

• • This type of flow was predicted, discovered and investigated in 1980-85 in the Khurchatov Institute of the Atomic Energy in Moscow (Russia) (see, for example, [1-2], and the cumulative report [3]) and its physical nature and features were described and explained in series of works of S. T. Belyaev and Y. K. Krasnov [4-6]. During following 30 years this type of flow was exploit by many groups for many areas of applications (Detailed report on that matter one can find on www.thequalitics.com in [7], “Presentation of the Vortical Boiling Flow”).

The essence of vortical boiling phenomenon is in the fact that the surface of non-potential concavity generates so-called Rotons—the smallest laminar rotating inviscid excitations of the streamlining fluid. These Rotons are growing in numbers and become self-organized in a mesoscopic vortex inside concavity until the size of this vortex will exceed some critical level at given rate of the flow of the streamlining fluid. After that said vortex with entire of its fluid atmosphere is ejected from the cavity, leaving a space for creation of the next one, and so on. Like air bubbles at the boiling of water, said generated vortices, surrounded by their fluid atmospheres, are heated up to surface temperature, and, therefore, do carry out a lot of heat.

Because said vortices with their fluid atmospheres are laminar inviscid excitations of the streamlining fluid, they do not increase the turbulence of said fluid (see the cumulative report [3]). This feature of vortical boiling together with highly efficient heat transfer on the streamlined surface accompanied with incredibly small hydraulic resistance delivers the solution of the mentioned central problem of the entire convective heat exchange technique: which is to overcome losses of efficiency of the convective cooling with the increase of the coolant's velocity.

The present invention is a novel application of vortical boiling flows for cooling of computer microprocessors (integrated circuits) that are producing a high level of heat. The present invention solves a long-standing problem of providing of the equally effective convective cooling at the wide range of generated heat power due to a simple measure: appropriate changes of the velocity of the coolant that is flowing over the heated surface.

SUMMARY OF THE INVENTION

It is an object of the present invention to teach means of using of the all profound features of the vortical boiling phenomenon at convective cooling of the highly heated devices, and particularly—computer integral circuit chips

It is an object of the present invention to teach means how to avoid a high hydro-resistance in the channel of cooling cell while saving the heat transfer in this channel on extremely efficient level.

BRIEF DESCRIPTION OF THE DRAWINGS

Advantages and features of the present invention are better understood with reference to the following and more detailed description and claims taken in conjunction with accompanying drawings, in which like elements are identified with like symbols.

FIG. 1 shows a built model QualiCell of the computer chips cooler based on the methods and principles that are disclosed in the present invention.

FIG. 2 shows a size comparison of QualiCell with standard SANYO Cell phone.

FIG. 3 shows a side view of Inlet (Outlet) channel that is used in QualiCell.

FIG. 4 shows a face view of Inlet (Outlet) channel that is used in QualiCell.

FIG. 5 shows a back view of Inlet (Outlet) channel that is used in QualiCell.

FIG. 6 shows a structure of flow from the used Inlet channel.

FIG. 7 shows a few types of the triangular lattices of sectored spherical dimples that should be used in the heat intake box of cooling devices to provide vortical boiling regime of flow of the coolant in it.

FIG. 8 shows the orientation of the lattice of dimples against flow of coolant and direction of sending of dimples in lattice to provide easy ways (saddle-like paths) for the generated vortices to escape dimples.

FIG. 9 shows the structure of flow over triangular lattice of the non-potential dimples in the regime of well-developed vortical boiling streamlining. Generally, each dimple generates two vortical tubes that are connecting this dimple with two neighbor dimples placed ahead and along the stream.

FIG. 10 shows schematics of conjugation of streamlining surfaces inside QualiCell to avoid parasitic turbulizations of coolant's flow inside of it.

FIG. 11 shows schematics of assembling QualiCell of two parts—Upper half and Lower half of it that could be manufactured through the stamping or melting processes.

FIG. 12 shows schematics of a multi-store setting of coolant channels in the same cooling cell when heat generating layers of an integral circuit are suited between said channels.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

The best mode for carrying out the invention is presented in terms of its preferred embodiment, herein depicted within the Figures.

A preferred embodiment of the present invention is the model QualiCell that is shown in FIG. 1-2. Due to two elastic tubes that are fixed (using appropriate standard bandages, if necessary) on the two couplers on the ends of inlet and outlet channels of QualiCell, the device can be incorporated into any appropriate coolant transport system, which will provide device with continuous flow of said coolant through the heat intake box.

The coolant flows into the specifically shaped (see FIG. 3-5) inlet channel and gradually takes shape of uniform flat stream (see FIG. 6) on the entrance into the heat intake box. Therefore, inside the heat intake box the regime of steady uniform flow of coolant is realized.

The inner top and bottom surfaces of the heat intake box have the shape of an appropriate triangular lattice of dimples (see FIG. 7) that do not allow a potential streamlining by the coolant at any its velocity, so that the vortical boiling regime of streamlining has to develop. The mutual orientation of said lattice and bulk flow of the streamlining coolant is shown in FIG. 8, so that in the well-developed stage of the vortical boiling regime of streamlining the picture of the flow inside the heat intake box has a structure as it is shown in FIG. 9.

It is important to avoid any parasitic turbulization of stream of coolant all over convective cooling cell, what requires proper conjugation of all heat exchange surfaces inside of it, as it is shown in FIG. 10.

In another embodiment, the invented convective cooling cell can be assembled from two parts—Upper half and Lower half of it, as it is shown in FIG. 11. These parts could be manufactured through the stamping or melting process. Being soldered or welded one on top of other, those parts accomplish said convective cooling cell.

Because the present invention is realizing the unique feature of vortical boiling as the highly efficient heat transfer on the streamlined surface accompanied with incredibly small hydraulic resistance, it allows another embodiment, where multi-store setting of coolant channels in the same cooling cell are formed by the heat generating layers of an integral circuit the external surfaces of which are modified with triangular lattice of hemi-spherical dimples, and which are suited horizontally on some distance from each other, being electrically connected due to set of tinny vertical posts, so that channels for coolant are created as spaces between said layers, as it is shown schematically in FIG. 12.

The foregoing descriptions of specific embodiments of the present invention are presented for purposes of illustration and description. They are not intended to be exhaustive or to limit the invention to precise forms disclosed and, obviously, many modifications and variations are possible in light of the above teaching. The embodiments are chosen and described in order to best explain principles of the invention and its practical application, to thereby enable others skilled in the art to best utilize the invention and its various embodiments with various modifications as are suited to the particular use contemplated. It is intended that a scope of the invention be defined broadly by the Drawings and Specification appended hereto and to their equivalents. Therefore, the scope of the invention is in no way to be limited only by the following exemplary claims nor by any possible, adverse inference under the rulings of Warner-Jenkins Company, v. Hilton Davis Chemical, 520 US 17 (1997) or Festo Corp. V. Shoketsu Kinzoku Kogyo Kabushiki Co., 535 U.S. 722 (2002), or other similar case law or subsequent precedent should not be made if such claims are amended subsequent to this Provisional Patent Application.

REFERENCES

[1] G. I. Kiknadze, Y. K. Krasnov, N. F. Podymaka, and V. B. Khobenski, “Self-organization of vortex structures in water flowing over a hemispherical cavity”, Doklady Academia Nauk SSSR, vol. 291, p. 0315 (1986).

[2] “The heat exchange surface”, USSR Patent 1554537, priority by May 29, 1987.

[3] I. A. Gachechiladze, G. I. Kiknadze, Y. K. Krasnov, et all, “Heat/mass transfer”, MIF, “Heat transfer with self-organization of whirlwind-like structures”, The problem reports, Sessions 1-2. “Convective, irradiated, and compound heat transfers”. Minsk (USSR), 1988, pp. 270.

[4] S. T. Belyaev, Y. K. Krasnov, The vortex and the ditch-streaming, Preprint No 217-90 of the Sibirian Division of The Academia of Science of USSR, Novosibirsk, (1990).

[5] Belyaev, S. T., Krasnov, Y. K., “On the intrinsic mass of a singular vortex thread”, Doklady Academia Nauk SSSR, 1991, vol. 319, No. 1, pp. 150-153.

[6] Y. K. Krasnov, The Dynamics of Quantum Vortices, (2001), E-book available on www.thequalitics.com

[7] “Vortical Boiling Presentation”, Developed by Qualitics, Inc. (USA) and BASERT (Russia), 2001, www.thequalitics.com

Claims

1. A convective cooling cell, that being in good contact with a heated surface, providing an intake of heat from this surface and transport of it into an appropriate refrigerator by the fluid coolant that is passing through said cell, comprising: a heat intake box, the top and bottom inner surfaces of which are shaped in the form of triangular lattice of sectored spherical dimples;an inlet and outlet coolant transporting channels; andcouplers on the ends of each channel to connect said cell with the external coolant transporting communications;

2. The apparatus of claim 1, further comprising two parts—an upper part and a lower part that, being soldered or welded one on top of other, accomplish said convective cooling cell.

3. The apparatus of claim 1, wherein the heat intake cell comprises multi-store set of channels for coolant's flow and heat generating layers are suited between those channels, just as it is illustrated in FIG. 12, so that external surfaces of said layers, being modified by triangular lattice of hemi-spherical dimples, are forming the boundary walls of said channels.