Wafer holder for manufacturing semiconductor

Information

  • Patent Grant
  • D766850
  • Patent Number
    D766,850
  • Date Filed
    Friday, September 12, 2014
    10 years ago
  • Date Issued
    Tuesday, September 20, 2016
    8 years ago
  • US Classifications
    Field of Search
    • US
    • D13 182
    • 118 715000
    • 118 500000
    • 118 728000
    • 118 729000
    • 211 041180
    • 432 253000
    • 432 258000
    • 156 345510
    • 156 345520
    • 156 345530
    • 156 345550
    • 414 217000
    • 414 220010
    • 414 935-941
    • CPC
    • C23C16/458
    • C23C16/4581
    • C23C16/4582
    • C23C16/4583
    • C23C16/4854
    • C23C16/4586
    • C23C16/4587
    • C23C16/4588
    • C30B31/14
    • H01L21/673
    • H01L21/67303
    • H01L21/67306
    • H01L21/67309
    • H01L21/67313
    • H01L21/67316
    • H01L21/67323
    • H01L21/67326
    • H01L21/6733
  • International Classifications
    • 1303
    • Term of Grant
      14Years
Abstract
Description


FIG. 1 is a front view of a wafer holder for manufacturing semiconductor showing our new design;



FIG. 2 is a rear view thereof;



FIG. 3 is a top plan view thereof;



FIG. 4 is a bottom plan view thereof;



FIG. 5 is a right side view thereof;



FIG. 6 is a left side view thereof;



FIG. 7 is a front perspective view thereof;



FIG. 8 is an enlarged cross sectional view taken along line 8-8 in FIG. 1;



FIG. 9 is an enlarged portion view taken along line 9-9 in FIG. 1; and,



FIG. 10 is another front perspective view of FIG. 1 shown in a used condition with wafers shown in broken lines.


The features shown in dotted lines depict environmental subject matter only and form no part of the claimed design.


Claims
  • The ornamental design for a wafer holder for manufacturing semiconductor, as shown and described.
Priority Claims (4)
Number Date Country Kind
D2014-006724 Mar 2014 JP national
D2014-006725 Mar 2014 JP national
D2014-006726 Mar 2014 JP national
D2014-006727 Mar 2014 JP national
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