Wafer processing apparatus

Abstract

A wafer processing apparatus (10), for processing a wafer (20) with a surface protective film (110) attached on the front surface (21) on which at least one circuit pattern is formed, includes a dicing tape application unit (30) for attaching a dicing tape (3) on a frame (36) and the wafer, a surplus dicing tape take-up unit (40) for taking up the surplus part of the dicing tape attached on the frame and the wafer and a surface protective film peeling unit (50) for peeling the surface protective film from the wafer using a peeling tape (4). At least one of the dicing tape application unit, the surplus dicing tape take-up unit and the surface protective film peeling unit is slidably arranged in that order on common rails (91, 92). As a result, tape can be loaded and the maintenance work on each unit can be carried out easily.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a plan view of a wafer processing apparatus according to this invention.

FIG. 2 is a side view of the wafer processing apparatus shown in FIG. 1.

FIG. 3 a is a first diagram for explaining the operation of the wafer processing apparatus.

FIG. 3 b is a second diagram for explaining the operation of the wafer processing apparatus.

FIG. 4 a is a third diagram for explaining the operation of the wafer processing apparatus.

FIG. 4 b is a fourth diagram for explaining the operation of the wafer processing apparatus.

FIG. 5 a is a fifth diagram for explaining the operation of the wafer processing apparatus.

FIG. 5 b is a sixth diagram for explaining the operation of the wafer processing apparatus.

FIG. 6 a is a top plan view of a holding unit used in the wafer processing apparatus.

FIG. 6 b is a sectional view taken in line A′-A′ in FIG. 6a.

FIG. 7 is a partially enlarged view of the front surface of the wafer.

FIG. 8 a is a sectional view of the wafer taken along a line segment perpendicular to pattern grooves ga.

FIG. 8 b is a plan view schematically showing the wafer and a peeling roller in a surface protective film peeling unit.

FIG. 9 is a partially enlarged side view of the wafer processing apparatus according to the invention.

FIG. 10 a is a sectional view schematically showing a cleaning nozzle.

FIG. 10 b is a perspective view schematically showing the cleaning nozzle of FIG. 10a.

Claims

1. A wafer processing apparatus for processing the wafer having a front surface, on which a circuit pattern is formed and on which a surface protective film is attached, comprising: a dicing tape application unit for attaching a dicing tape on the mount frame and the back surface of the wafer thereby to integrate the mount frame and the wafer; anda surplus dicing tape take-up unit for taking up the surplus part of the dicing tape attached on the mount frame and the wafer;wherein at least one of the dicing tape application unit and the surplus dicing tape take-up unit is arranged slidably on at least one rail of the wafer processing apparatus.

2. A wafer processing apparatus according to claim 1, further comprising a surface protective film peeling unit for peeling the surface protective film from the front surface of the wafer using a peeling tape, wherein at least one of the dicing tape application unit, the surplus dicing tape take-up unit and the surface protective film peeling unit is slidably arranged on the rail.

3. A wafer processing apparatus according to claim 2, wherein the dicing tape application unit, the surplus dicing tape take-up unit and the surface protective film peeling unit are slidably arranged in that order on the rail.

4. A wafer processing apparatus according to claim 2wherein at least one of the dicing tape application unit, the surplus dicing tape take-up unit and the surface protective film peeling unit has a cleaning nozzle for supplying a cleaning fluid.

5. A wafer processing apparatus according to claim 2, further comprising a holding means for holding the mount frame of the wafer, wherein after the surplus dicing tape is taken up by the surplus dicing tape take-up unit, the holding means rotates the mount frame together with the wafer by 180 degrees around a horizontal rotation axis thereby to transport while inverting the mount frame and the wafer.

6. A wafer processing apparatus according to claim 1, wherein a table for supporting the wafer in the surface protective film peeling unit can be rotated around a vertical axis; andwherein the table is rotated in such a manner that the peeling direction in which the surface protective film is peeled by the surface protective film peeling unit and the bisector of the corner of the circuit pattern of the wafer supported on the table are substantially parallel to each other.

7. A wafer processing apparatus according to claim 1, wherein the surface protective film has the ultraviolet curing characteristic and is adapted to be cured by the radiation of the ultraviolet light thereon,the apparatus further comprising a first ultraviolet light radiation means for radiating the ultraviolet light on the surface protective film before the surface protective film is peeled.

8. A wafer processing apparatus according to claim 1, wherein the dicing tape has the ultraviolet curing characteristic and is adapted to be cured by the radiation of the ultraviolet light thereon,the apparatus further comprising a second ultraviolet light radiation means for radiating the ultraviolet light on the dicing tape after the surface protective film is peeled.