Wafer transfer apparatus

Information

  • Patent Grant
  • D562524
  • Patent Number
    D562,524
  • Date Filed
    Wednesday, January 5, 2005
    19 years ago
  • Date Issued
    Tuesday, February 19, 2008
    16 years ago
  • US Classifications
    Field of Search
    • US
    • D34 29
    • D34 35
    • 198 771000
    • 198 866000
    • 198 890000
    • 198 367000
    • 198 890100
    • 198 370100
    • 198 370040
    • 198 782000
    • 198 722000
    • 193 0350A0
    • 193 0350C0
    • 438 220000
    • 438 232000
    • 438 005000
    • 438 689000
  • International Classifications
    • 1205
    • Term of Grant
      14Years
Abstract
Description


FIG. 1 is a top view of the wafer transfer apparatus of the present design;



FIG. 2 is a front elevational view thereof;



FIG. 3 is a back elevational view thereof;



FIG. 4 is a bottom view thereof;



FIG. 5 is a right side view thereof;



FIG. 6 is a left side view thereof;



FIG. 7 is a reference figure showing a perspective view seen from a back-left hand side of the apparatus;



FIG. 8 is a reference figure showing a top view seen from a back-left hand side of the apparatus;



FIG. 9 is a reference figure showing a perspective view seen from a front-right hand side of the apparatus;



FIG. 10 is a reference figure showing a perspective view seen from a back-right hand side of the apparatus;



FIG. 11 is a reference figure showing a right side view seen from a back side of the apparatus;



FIG. 12 is a reference figure showing a perspective view seen from the back-left hand side of the apparatus;



FIG. 13 is a reference figure showing a perspective view seen from a front-right hand side of the apparatus;



FIG. 14 is a reference figure showing a perspective view seen from the front-left hand side of the apparatus;



FIG. 15 is a reference figure showing a perspective view seen from a back-left hand side of the apparatus; and,



FIG. 16 is a reference figure showing a perspective view seen from a back-right hand side of the apparatus.


The broken line showing of wafers in some of the figures is included for the purpose of illustrating environment and forms no part of the claimed design.


Claims
  • We claim the ornamental design for a wafer transfer apparatus, as shown and described.
Priority Claims (1)
Number Date Country Kind
2004-21726 Jul 2004 JP national
US Referenced Citations (17)
Number Name Date Kind
4810019 Brucher Mar 1989 A
6279730 Schreger et al. Aug 2001 B1
6927181 Wakizako et al. Aug 2005 B2
6949466 Jeong Sep 2005 B2
D525408 Nitadori Jul 2006 S
7104867 Jeong Sep 2006 B2
20020162742 Bae et al. Nov 2002 A1
20030064902 Ng et al. Apr 2003 A1
20040048474 Asano Mar 2004 A1
20040092069 Ishii et al. May 2004 A1
20050145584 Buckley et al. Jul 2005 A1
20050255609 Kumagai et al. Nov 2005 A1
20060046376 Hofer et al. Mar 2006 A1
20060105580 Wirth et al. May 2006 A1
20060166503 Sasaki et al. Jul 2006 A1
20060169674 Mao et al. Aug 2006 A1
20060194445 Hayashi et al. Aug 2006 A1