BACKGROUND OF THE DISCLOSURE
Technical Field
The technical field relates to a water-cooling heat dissipation device, and more particularly relates to a water-cooling heat dissipation device with adjustable fan direction.
Description of Related Art
As the computing speed of electronic components such as central processing units (CPUs) in electronic products continues to increase, the heat generated by these components is also getting higher and higher. As a result, general air-cooling heat dissipation devices no longer meet the heat dissipation requirements at the current stage, and it is bound to use a water-cooling heat dissipation device with the function of circulating a working liquid such as water in order to efficiently dissipate the heat generated by the electronic components.
Although the related-art water-cooling heat dissipation device has already solved the aforementioned problem of the air-cooling heat dissipation device, the following problems still exist. Most fans used for the water-cooling heat dissipation device are installed above or inside the cooling object, and thus the fans can only dissipate heat for a single electronic heat-generating component, and heat is still accumulated or stacked at other electronic heat-generating components, and thus the heat dissipation of the overall system is limited. In addition, the installation positions of the mainboard and related electronic components produced by different manufacturers are not the same.
In view of the aforementioned problem, the discloser proposed this disclosure based on his expert knowledge and elaborated researches to overcome the problem of the related art and meet the needs of each manufacturer at the same time.
SUMMARY OF THE DISCLOSURE
It is a primary objective of this disclosure to provide a water-cooling heat dissipation device with adjustable fan direction, which may adjust the position of a fan to provide direct cooling airflow according to the heat dissipation requirements of the electronic components around the central processing unit.
To achieve the aforementioned objectives, this disclosure discloses a water-cooling heat dissipation device with adjustable fan direction, which includes a water block and a fan module, the water block includes a main body, a water inlet joint communicating to the main body and a water outlet joint communicating to the main body, the main body has a first connector; the fan module is installed on the water block and includes a base and a fan, the base is connected to the main body and has a second connector electrically connected to the first connector and the fan, and the fan is rotatably connected to the base and has a vane wheel formed outside the main body.
This disclosure has the following advantageous effects. The disclosure has taken into account the heat dissipation requirements of the central processing unit and other heat-generating components around the central processing unit. The position of the fan may be adjusted easily to provide a cooling airflow and avoid the fan from being collided or interfered by other related components around the fan. The disclosure also provides extended functions for lighting, data operation, temperature and other related parameters according to actual using requirements.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is a perspective view of a fan module of this disclosure;
FIG. 2 is a cross-sectional view of a fan module of this disclosure;
FIG. 3 is an exploded view of a water-cooling heat dissipation device of this disclosure;
FIG. 4 is a perspective view of a water-cooling heat dissipation device of this disclosure;
FIG. 5 is a cross-sectional view of a water-cooling heat dissipation device applied to a mainboard in accordance with this disclosure;
FIG. 6 is a perspective view of a fan module of another embodiment of this disclosure;
FIG. 7 is a perspective view of a fan module of a further embodiment of this disclosure;
FIG. 8 is an exploded view of a water-cooling heat dissipation device in accordance with another embodiment of this disclosure;
FIG. 9 is a perspective view of a water-cooling heat dissipation device in accordance with another embodiment of this disclosure;
FIG. 10 is a partially exploded view of a water-cooling heat dissipation device in accordance with a further embodiment of this disclosure a further;
FIG. 11 is a perspective view of a water-cooling heat dissipation device in accordance with a further embodiment of this disclosure;
FIG. 12 is an exploded view of a water-cooling heat dissipation device in accordance with another embodiment of this disclosure; and
FIG. 13 is a perspective view of a water-cooling heat dissipation device in accordance with another embodiment of this embodiment.
DETAILED DESCRIPTION
The technical contents of this disclosure will become apparent with the detailed description of embodiments accompanied with the illustration of related drawings as follows. It is intended that the embodiments and drawings disclosed herein are to be considered illustrative rather than restrictive.
With reference to FIGS. 1 to 5 for a water-cooling heat dissipation device with adjustable fan direction in accordance with this embodiment, the water-cooling heat dissipation device mainly includes a water block 10 and a fan module 20.
In FIGS. 3 and 4, the water block 10 mainly includes a main body 11, a water inlet joint 12 and a water outlet joint 13, the main body 11 is mainly used for attaching to and cooling an electronic heat-generating component such as a central processing unit (CPU), a heat exchange chamber, a liquid channel, a water pump, and related components are formed inside the main body for flowing water in and out, the top of the main body 11 is provided with a first connector 111, the first connector 111 mainly includes a socket 112, a circuit board 113 and a plurality of conductive terminals 114. Each conductive terminal 114 is electrically connected to the socket 112 through a circuit on the circuit board 113, the socket 112 is disposed on a side edge of the main body 11, and each conductive terminal 114 is formed on the top surface of the main body 11. The main body 11 further includes a plurality of embedded grooves 115 and a plurality of positioning columns 116 disposed on the top surface of the main body 11, the embedded grooves 115 are disposed symmetrically and spacedly, and the positioning columns 116 are disposed on the center line of the main body 11 and spaced apart. The water inlet joint 12 is connected to the main body 11 and communicates with the interior of the main body 11, the water outlet joint 13 is connected to the main body 11 and communicates with the interior of the main body 11, and the water outlet joint 13 is formed at a side edge of the water inlet joint 12.
In an embodiment, the water block 10 includes a fixed frame 14 fixed to the bottom of the main body 11.
In FIGS. 1 and 2, the fan module 20 is installed above the water block 10 and mainly includes a base 21 and a fan 22, the base 21 is substantially a round body connected to the main body 10, the base 21 includes a second connector 211, the second connector 211 has components such as a socket, a circuit board, a conductive terminal etc. The first connector 111 is plugged into and electrically connected to the corresponding second connector 211. The fan 22 is rotatably connected to the base 21 and mainly includes a frame 221 and a vane wheel (first vane wheel) 226, and the frame 221 mainly includes a first ring 222 and a second ring 223 connected to the first ring 222, the second ring 223 and the first ring 222 are installed side by side. The first ring 222 sheathes the base 21 and may rotate relative to the base 21, the vane wheel 226 is installed in the second ring 223 and electrically connected to the second connector 211 through a conductive wire (not shown in the figures). The vane wheel 226 of the fan 22 is disposed outside the main body 10.
In an embodiment, the base 21 includes a plurality of embedding plates 212 and a plurality of positioning grooves 213, each embedding plate 212 is plugged into each corresponding embedded groove 115, and each positioning groove 213 is provided for accommodating each corresponding positioning column 116.
In an embodiment of this disclosure as shown in FIGS. 3 and 4, the water-cooling heat dissipation device with adjustable fan direction further includes a light emitting module 30 installed on the fan module 20 and electrically connected to the fan module 20, the light emitting module 30 mainly includes a base plate 31, a third connector 32, a light emitting body 33 and a light-penetrable cover 34, the third connector 32 is fixed onto the base plate 31 and has components such as a socket, a circuit board and a conductive terminal, the third connector 32 is electrically connected to the second connector 211, the light emitting body 33 is installed onto the circuit board and electrically connected to the third connector 32, and the light-penetrable cover 34 covers the light emitting body 33 and is connected to the base plate 31.
In FIG. 5, during use, the water-cooling heat dissipation device of this disclosure is installed onto a mainboard 8, the mainboard 8 has a circuit board 81, a central processing unit 82 and other electronic heat-generating components 83 (such as southbridge chip, northbridge chip, display card module, transformer, electrical connector, etc.) installed on the circuit board 81, each electronic heat-generating component 83 is formed in an area around the central processing unit 82. The main body 11 of the water block 10 is attached onto the top surface of the central processing unit 82, and connected to the circuit board 81 and the fixed frame 14 by screws or other locking elements for fixation. When the electronic heat-generating component 83 needs to be cooled, the direction of the frame 221 is turned to set the vane wheel 226 to a position above each electronic heat-generating component 83, so as to provide direct cooling airflow.
In FIG. 6, the frame 221A of the fan module 20A of this embodiment includes a third ring 224 and another vane wheel (second vane wheel) 227, the third ring 224 is extended from the first ring 222 and spaced apart from the second ring 223, the other vane wheel 227 is installed in the third ring 224 and electrically connected to the second connector 211 through a conductive wire. When each electronic heat-generating component 83 around the central processing unit 82 needs to be cooled, the direction of the frame 221 is turned to set the vane wheel 226 and the other vane wheel 227 to the positions above each electronic heat-generating component 83 respectively, so as to provide direct cooling airflow.
In FIG. 7, the fan module 20B of this embodiment has the aforementioned structure of the fan module 20A, and the frame 221B further includes a fourth ring 225 and a further vane wheel (third vane wheel) 228, the fourth ring 225 is extended from the first ring 222 and spaced apart from the second ring 223 and the third ring 224, the further vane wheel 228 is installed in the fourth ring 225 and electrically connected to the second connector 211 through a conductive wire. When each electronic heat-generating component 83 around the central processing unit 82 needs to be cooled, the direction of the frame 221 is turned to set the vane wheel 226, the other vane wheel 227, and the further vane wheel 228 to the positions above each electronic heat-generating component 83 respectively, so as to provide direct cooling airflow.
In an embodiment as shown in FIGS. 8 and 9, the plurality of fan modules 20 is stacked on one another. When each electronic heat-generating component 83 around the central processing unit 82 needs to be cooled, the direction of the frame 221 is turned to set each vane wheel 226 to a position above each electronic heat-generating component 83, so as to provide direct cooling airflow.
In an embodiment as shown in FIGS. 10 and 11, the water-cooling heat dissipation device with adjustable fan direction of this disclosure further includes a display module 40 installed on the fan module 20, the display module 40 mainly includes a display screen 41 and a port 42 electrically connected to the display screen 41, the port 42 is provided for plugging and connecting a cable (not shown in the figures), and the display screen 41 provides related parameters such as rotating speed, temperature, etc. of each component.
In an embodiment as shown in FIGS. 12 and 13, the base 21 of the fan module 20C and the main body of the water block 10 are integrally formed (or formed in one piece), a plurality of pivots 214 is formed on and spaced apart from the base 21, each fan 22 mainly includes a vane wheel 226 and a pivot ring seat 229, the vane wheel 226 is installed in the pivot ring seat 229, each vane wheel 2261 is electrically connected to the second connector 21 through a conductive wire, and each pivot ring seat 229 is rotatably connected to each pivot 214. These arrangements also provide the same effect as the above-mentioned embodiments.
While this disclosure has been described by means of specific embodiments, numerous modifications and variations could be made thereto by those skilled in the art without departing from the scope and spirit of this disclosure set forth in the claims.
Patent Application
20240324138
