using a liquid coolant without phase change in electronic enclosures

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CPC
H05K7/20218

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K7/00Constructional details common to different types of electric apparatus

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H05K7/20218using a liquid coolant without phase change in electronic enclosures

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Modular heat-transfer systems
- Patent number 12,213,289
- Issue date Jan 28, 2025
- Coolit Systems, Inc.
- Geoff Sean Lyon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with heat-conductive cover
- Patent number 12,200,900
- Issue date Jan 14, 2025
- HTC Corporation
- Li-Hsun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid cooling structure with low-force quickseal joints for carryi...
- Patent number 12,200,905
- Issue date Jan 14, 2025
- Fulian Precision Electronics (Tianjin) Co., LTD.
- Pao-Ching Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Controlling the flow of coolant to resistance welding electrodes
- Patent number 12,186,823
- Issue date Jan 7, 2025
- Proteus Industries, Inc.
- Mark Nicewonger
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Closed clean energy generation and reuse system for use in mission...
- Patent number 12,184,075
- Issue date Dec 31, 2024
- Silent Partner Group of Companies, Inc.
- Dale Hobbie
- G05 - CONTROLLING REGULATING
Information Patent Grant
Optical leak detection of liquid cooling components within an elect...
- Patent number 12,169,180
- Issue date Dec 17, 2024
- Intel Corporation
- Prabhakar Subrahmanyam
- G01 - MEASURING TESTING
Information Patent Grant
Reduced vertical profile ejector for liquid cooled modules
- Patent number 12,144,110
- Issue date Nov 12, 2024
- Intel Corporation
- Guixiang Tan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat transfer component reinforcement structure
- Patent number 12,111,113
- Issue date Oct 8, 2024
- Asia Vital Components Co., Ltd.
- Sheng-Huang Lin
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Configurable power inverter
- Patent number 12,097,768
- Issue date Sep 24, 2024
- MERCEDES-BENZ GROUP AG
- Eric Pawelkowski
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Printed circuit board
- Patent number 12,075,558
- Issue date Aug 27, 2024
- HUAWEI DIGITAL POWER TECHNOLOGIES CO., LTD.
- Zhaozheng Hou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for liquid immersion cooling of transceivers
- Patent number 12,045,101
- Issue date Jul 23, 2024
- Dell Products L.P.
- Maunish A. Shah
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Space-saving high-density modular data systems and energy-efficient...
- Patent number 12,048,128
- Issue date Jul 23, 2024
- Inertech IP LLC
- Earl Keisling
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Liquid cooling device with water tank structure
- Patent number 12,025,385
- Issue date Jul 2, 2024
- SHENZHEN APALTEK CO., LTD.
- Qineng Xiao
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Cooled electronic system
- Patent number 12,022,638
- Issue date Jun 25, 2024
- ICEOTOPE GROUP LIMITED
- Daniel Chester
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Thin heat dissipation device and method for manufacturing the same
- Patent number 11,974,411
- Issue date Apr 30, 2024
- Ke Chin Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Series connected water cooling structure
- Patent number 11,942,397
- Issue date Mar 26, 2024
- Ablecom Technology Inc.
- Chien-Fa Liang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Water cooling head with sparse and dense fins
- Patent number 11,924,995
- Issue date Mar 5, 2024
- Chi-Chuan Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heatsink device with multiple inlets and related computing device a...
- Patent number 11,889,613
- Issue date Jan 30, 2024
- FLUIX INCORPORATED
- Eduardo A. Castillo Orozco
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Memory cooler
- Patent number 11,877,422
- Issue date Jan 16, 2024
- Hewlett Packard Enterprise Development LP
- John Franz
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Propenylamines and methods of making and using same
- Patent number 11,858,875
- Issue date Jan 2, 2024
- 3M Innovative Properties Company
- William M. Lamanna
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Charging pile, power distribution system and power distribution met...
- Patent number 11,837,890
- Issue date Dec 5, 2023
- Delta Electronics (Shanghai) Co., Ltd.
- Chao Yan
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Apparatus with housing having structure for radiating heat
- Patent number 11,839,057
- Issue date Dec 5, 2023
- Samsung Electronics Co., Ltd.
- Sangsoo Yu
- F25 - REFRIGERATION OR COOLING COMBINED HEATING AND REFRIGERATION SYSTEMS HEA...
Information Patent Grant
Heat dissipation device
- Patent number 11,839,059
- Issue date Dec 5, 2023
- AAC Technologies Pte. Ltd.
- Xingzhi Huang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Thermal-control system of a video-recording doorbell and associated...
- Patent number 11,839,060
- Issue date Dec 5, 2023
- Google LLC
- Arun Prakash Raghupathy
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Power conversion device
- Patent number 11,837,966
- Issue date Dec 5, 2023
- Mitsubishi Electric Corporation
- Yoshifumi Mizuno
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Cooling electronic devices in a data center
- Patent number 11,832,396
- Issue date Nov 28, 2023
- Google LLC
- Madhusudan Krishnan Iyengar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stationary induction charging device for wireless energy transfer
- Patent number 11,820,245
- Issue date Nov 21, 2023
- Mahle International GmbH
- Sebastian Angermeier
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Thermal management system for an energy storage container
- Patent number 11,787,387
- Issue date Oct 17, 2023
- Caterpillar Inc.
- Umakanth Sakaray
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Thermal insulation and temperature control of components
- Patent number 11,785,705
- Issue date Oct 10, 2023
- Xerox Corporation
- Yunda Wang
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Choke structure with water cooling
- Patent number 11,778,773
- Issue date Oct 3, 2023
- PHIHONG TECHNOLOGY CO., LTD.
- Kao-Ping Lo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SPACE-SAVING HIGH-DENSITY MODULAR DATA SYSTEMS AND ENERGY-EFFICIENT...
- Publication number 20250024648
- Publication date Jan 16, 2025
- Inertech IP LLC
- Earl Keisling
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
COOLING DEVICE FOR VIRTUAL REALITY HEADSETS
- Publication number 20240349454
- Publication date Oct 17, 2024
- Jie Gui
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
WATER-COOLING HEAT DISSIPATION DEVICE WITH ADJUSTABLE FAN DIRECTION
- Publication number 20240324138
- Publication date Sep 26, 2024
- SILVERSTONE TECHNOLOGY CO., LTD.
- Yen-Shu CHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIQUID-COOLING RADIATING PIPE AND VACUUM INTERRUPTER WITH BUILT-IN...
- Publication number 20240234058
- Publication date Jul 11, 2024
- SICHUAN UNIVERSITY
- Xiaolong HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240237293
- Publication date Jul 11, 2024
- InnoLux Corporation
- Ker-Yih KAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Power electronic module, power electronic module block, printed cir...
- Publication number 20240222208
- Publication date Jul 4, 2024
- Schweizer Electronic AG
- Thomas GOTTWALD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hands-Free Connectors
- Publication number 20240213719
- Publication date Jun 27, 2024
- Microsoft Technology Licensing, LLC
- Wade J. DOLL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFIGURABLE POWER INVERTER
- Publication number 20240181888
- Publication date Jun 6, 2024
- MERCEDES-BENZ GROUP AG
- Eric Pawelkowski
- B60 - VEHICLES IN GENERAL
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE...
- Publication number 20240178093
- Publication date May 30, 2024
- Sony Semiconductor Solutions Corporation
- Takayuki TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULAR BATTERY TRAY
- Publication number 20240170778
- Publication date May 23, 2024
- Moment Energy Inc.
- James Daniel EVANS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND DEVICE FOR INDIRECT COOLING OF HEAT SOURCES OF A SYSTEM...
- Publication number 20240164047
- Publication date May 16, 2024
- SCHOLLY FIBEROPTIC GMBH
- Pascal BOER
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
LIQUID-COOLING RADIATING PIPE AND VACUUM INTERRUPTER WITH BUILT-IN...
- Publication number 20240136131
- Publication date Apr 25, 2024
- SICHUAN UNIVERSITY
- Xiaolong HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLING SYSTEM AND METHOD OF MANUFACTURING A COOLING SYSTEM
- Publication number 20240114663
- Publication date Apr 4, 2024
- LEAR CORPORATION
- Ramon SANCHEZ ROVIRA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Water Cooling System for Semiconductor Package
- Publication number 20240105550
- Publication date Mar 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tung-Liang Shao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER ADAPTER AND ELECTRONIC DEVICE SYSTEM
- Publication number 20240098879
- Publication date Mar 21, 2024
- Huawei Digital Power Technologies Co., Ltd.
- Chunxia Xu
- B60 - VEHICLES IN GENERAL
Information Patent Application
MEMS-BASED FLOW SYSTEMS IN WATERPROOF DEVICES
- Publication number 20230422433
- Publication date Dec 28, 2023
- Frore Systems Inc.
- Prabhu Sathyamurthy
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
APPARATUS HAVING A PULSE INVERTER
- Publication number 20230422434
- Publication date Dec 28, 2023
- Dr. Ing. h.c.F. Porsche Aktiengesellschaft
- Maximilian BARKOW
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
A MODULAR ELECTRONICS ASSEMBLY
- Publication number 20230413465
- Publication date Dec 21, 2023
- Tritium Holdings Pty Ltd
- Bernard Brian WALSH
- B60 - VEHICLES IN GENERAL
Information Patent Application
SYSTEMS AND ASSEMBLIES FOR COOLING SERVER RACKS
- Publication number 20230363106
- Publication date Nov 9, 2023
- Inertech IP LLC
- Earl Keisling
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT SINK AND COMMUNICATION DEVICE
- Publication number 20230354557
- Publication date Nov 2, 2023
- Huawei Technologies Co., Ltd
- Yu ZHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTOR ASSEMBLY
- Publication number 20230337393
- Publication date Oct 19, 2023
- Molex, LLC
- Che-Yuan YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OUTDOOR UNIT OF AIR CONDITIONER
- Publication number 20230324054
- Publication date Oct 12, 2023
- Toshiba Carrier Corporation
- Yuichi HANDA
- F24 - HEATING RANGES VENTILATING
Information Patent Application
Electronic Control Unit with Separable Cooling and Memory Modules
- Publication number 20230292459
- Publication date Sep 14, 2023
- Aptiv Technologies Limited
- Falk Rademacher
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER ADAPTER
- Publication number 20230246400
- Publication date Aug 3, 2023
- Huawei Digital Power Technologies Co., Ltd.
- Chenglong WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MANAGEMENT SYSTEM FOR PORTABLE ELECTRONIC DEVICES
- Publication number 20230240039
- Publication date Jul 27, 2023
- Magic Leap, Inc.
- Guillermo Padin Rohena
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HEAT RADIATION STRUCTURE, AND BATTERY PROVIDED WITH SAME
- Publication number 20230238604
- Publication date Jul 27, 2023
- Shin-Etsu Polymer Co., Ltd.
- Hitoshi ANDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLING SYSTEMS FOR A CIRCUIT BOARD
- Publication number 20230239993
- Publication date Jul 27, 2023
- Microsoft Technology Licensing, LLC
- Wade J. DOLL
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD TO ALLOW FOR HIGHER USABLE POWER CAPACITY IN A REDUNDANT POW...
- Publication number 20230229223
- Publication date Jul 20, 2023
- Lenovo Global Technology (United States) Inc.
- Robert R. Wolford
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
WIRE HARNESS UNIT
- Publication number 20230230723
- Publication date Jul 20, 2023
- AUTONETWORKS TECHNOLOGIES, LTD.
- Takeo MARUCHI
- B60 - VEHICLES IN GENERAL
Information Patent Application
HEAT DISSIPATION DEVICE AND ELECTRONIC EQUIPMENT
- Publication number 20230209778
- Publication date Jun 29, 2023
- Lenovo (Beijing) Limited
- Xintong DING
- H01 - BASIC ELECTRIC ELEMENTS

using a liquid coolant without phase change in electronic enclosures

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Modular heat-transfer systems

Electronic device with heat-conductive cover

Liquid cooling structure with low-force quickseal joints for carryi...

Controlling the flow of coolant to resistance welding electrodes

Closed clean energy generation and reuse system for use in mission...

Optical leak detection of liquid cooling components within an elect...

Reduced vertical profile ejector for liquid cooled modules

Heat transfer component reinforcement structure

Configurable power inverter

Printed circuit board

Systems and methods for liquid immersion cooling of transceivers

Space-saving high-density modular data systems and energy-efficient...

Liquid cooling device with water tank structure

Cooled electronic system

Thin heat dissipation device and method for manufacturing the same

Series connected water cooling structure

Water cooling head with sparse and dense fins

Heatsink device with multiple inlets and related computing device a...

Memory cooler

Propenylamines and methods of making and using same

Charging pile, power distribution system and power distribution met...

Apparatus with housing having structure for radiating heat

Heat dissipation device

Thermal-control system of a video-recording doorbell and associated...

Power conversion device

Cooling electronic devices in a data center

Stationary induction charging device for wireless energy transfer

Thermal management system for an energy storage container

Thermal insulation and temperature control of components

Choke structure with water cooling

Patents Applicationslast 30 patents

SPACE-SAVING HIGH-DENSITY MODULAR DATA SYSTEMS AND ENERGY-EFFICIENT...

COOLING DEVICE FOR VIRTUAL REALITY HEADSETS

WATER-COOLING HEAT DISSIPATION DEVICE WITH ADJUSTABLE FAN DIRECTION

LIQUID-COOLING RADIATING PIPE AND VACUUM INTERRUPTER WITH BUILT-IN...

ELECTRONIC DEVICE

Power electronic module, power electronic module block, printed cir...

Hands-Free Connectors

CONFIGURABLE POWER INVERTER

SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE...

MODULAR BATTERY TRAY

METHOD AND DEVICE FOR INDIRECT COOLING OF HEAT SOURCES OF A SYSTEM...

LIQUID-COOLING RADIATING PIPE AND VACUUM INTERRUPTER WITH BUILT-IN...

COOLING SYSTEM AND METHOD OF MANUFACTURING A COOLING SYSTEM

Water Cooling System for Semiconductor Package

POWER ADAPTER AND ELECTRONIC DEVICE SYSTEM

MEMS-BASED FLOW SYSTEMS IN WATERPROOF DEVICES

APPARATUS HAVING A PULSE INVERTER

A MODULAR ELECTRONICS ASSEMBLY

SYSTEMS AND ASSEMBLIES FOR COOLING SERVER RACKS

HEAT SINK AND COMMUNICATION DEVICE

CONNECTOR ASSEMBLY

OUTDOOR UNIT OF AIR CONDITIONER

Electronic Control Unit with Separable Cooling and Memory Modules

POWER ADAPTER

THERMAL MANAGEMENT SYSTEM FOR PORTABLE ELECTRONIC DEVICES

HEAT RADIATION STRUCTURE, AND BATTERY PROVIDED WITH SAME

COOLING SYSTEMS FOR A CIRCUIT BOARD

METHOD TO ALLOW FOR HIGHER USABLE POWER CAPACITY IN A REDUNDANT POW...

WIRE HARNESS UNIT

HEAT DISSIPATION DEVICE AND ELECTRONIC EQUIPMENT