Claims
- 1. A water-developable photosensitive resin composition capable of hot melt molding, which comprises:
- (1) water soluble or water dispersible polyvinyl alcohol which has a saponification degree of the vinyl ester unit of 50 to 70 mol % and a hot melt flow starting temperature of 60.degree. to 130.degree. C.; said polyvinyl alcohol being prepared by saponifying a copolymer of
- (a) a vinyl ester, and
- (b) a monomer selected from the group consisting of a monomer not having an ionic group (hereinafter nonionic monomer), a salt of a sulfonic acid group-containing monomer, and a mixture thereof,
- said nonionic monomer when selected being present in an amount of 0.1 to 20 mol %, said salt of a sulfonic acid group-consisting monomer when selected being present in an amount of 0.1 to 0.4 mol%, and when a mixture of the monomers is selected a total amount of the monomer mixture being 0.1 to 20 mol %,
- (ii) a polymerizable monomer, and
- (iii) a photopolymerization initiator.
- 2. A water-developable photosensitive resin composition capable of hot melt molding, which comprises:
- (i') a water soluble or water dispersible polyvinyl alcohol which has a saponification degree of the vinyl ester unit of 50 to 70 mol % and a hot melt flow starting temperature of 60.degree. to 130.degree. C.; said polyvinyl alcohol being prepared by saponifying a copolymer of
- (a) a vinyl ester, and
- (b') 0.1 to 10 mol % of a carboxylic acid group-containing monomer or a salt thereof,
- (ii') a polymerizable monomer having at least two free hydroxyl groups and represented by the following formula; ##STR16## wherein X represents ##STR17## Y represents ##STR18## wherein R.sub.1, R.sub.3 and R.sub.4, which are the same or different, respectively represents a hydrogen atom, or a methyl group, R.sub.2 represents an alkylene group having 1 to 5 carbon atoms and a hydroxyl group, R.sub.5 represents an alkyl group having 1 to 5 carbon atoms and a hydroxyl group, n is an integer of 4 to 23, m is 0 or 1 and p is an integer of 1 to 5, and
- (iii) a photopolymerization initiator.
- 3. The resin composition according to claim 1 wherein the polymerizable monomer has at least two free hydroxyl group and the following formula: ##STR19## wherein X represents ##STR20## Y represents ##STR21## wherein R.sub.1, R.sub.3 and R.sub.4, which is the same or different, respectively represents a hydrogen atom or a methyl group, R.sub.2 represents an alkylene group having 1 to 5 carbon atoms and a hydroxyl group, R.sub.5 represents an alkyl group having 1 to 5 carbon atoms and a hydroxyl group, n is an integer of 4 to 23, m is 0 or 1 and p is an integer of 1 to 5.
- 4. The resin composition according to claim 1 wherein the polymerization monomer is ##STR22##
- 5. The resin composition according to claim 1 or claim 2 wherein the photopolymerization initiator is an aromatic ketone.
- 6. The resin composition according to claim 1 comprising 50 to 300 parts of the component (i), and 0.01 to 10 parts of the component (iii) based on 100 parts of the component (ii).
- 7. The resin composition according to claim 1 or claim 2 having a water content of not more than 10% by weight.
- 8. A water-developable photosensitive resin plate which comprises a substrate and a water-developable photosensitive resin composition formed thereon, said water-developable photosensitive resin composition being that according to claim 1 or claim 2.
- 9. A relief printing plate which is prepared by the use of the photosensitive resin plate according to claim 8.
- 10. A method for preparing a relief printing plate comprising subjecting the photosensitive resin plate according to claim 8 to light through a negative film having an image and then washing the photosensitive composition at the unexposed part with water.
- 11. A method for preparing a water-developable photosensitive resin plate suitable for the manufacture of a relief printing plate, which comprises applying by hot melt molding a water-developable photosensitive resin composition to a substrate in which said water-developable photosensitive resin composition is that according to claim 1 or claim 2.
- 12. The method according to claim 11 wherein said water-developable photosensitive resin composition has a water content of not more than 10% by weight.
- 13. A method for preparing a relief printing plate comprising subjecting the photosensitive resin plate prepared according to claim 11 to light through a negative film having an image and then washing the photosensitive composition at the unexposed part with water.
- 14. The resin composition according to claim 1 wherein said vinyl ester is vinyl acetate.
- 15. The resin composition according to claim 1 wherein said salt of the sulfonic acid group containing monomer is sodium (meth)allylsulfonate or sodium vinylsulfonate.
- 16. The resin composition according to claim 1 wherein said nonionic monomer is a C.sub.1 -C.sub.10 alkyl acrylate.
- 17. The resin composition according to claim 1 wherein said polyvinyl alcohol has a saponification degree of 55 to 68 mol %.
- 18. The resin composition according to claim 2, wherein the monomers of said copolymer to be saponified further contains (c) a monomer selected from the group consisting of a nonionic monomer, a sulfonic acid group-containing monomer, a salt of the sulfonic acid group-containing monomer, and a mixture thereof, in addition to the monomers (a) and (b').
- 19. The resin composition according to claim 18 wherein said salt of the sulfonic acid group containing monomer is sodium (meth)allylsulfonate or sodium vinylsulfonate.
- 20. The resin composition according to claim 18 wherein said nonionic monomer is a C.sub.1 -C.sub.10 alkyl acrylate.
- 21. The resin composition according to claim 2 wherein said vinyl ester is vinyl acetate.
- 22. The resin composition according to claim 2 wherein said polyvinyl alcohol has a saponification degree of 55 to 68 mol %.
- 23. The resin composition according to claim 2, comprising 50 to 300 parts of the component (i'), and 0.01 to 10 parts of the component (iii), based on 100 parts of the component (ii').
Priority Claims (4)
Number |
Date |
Country |
Kind |
62-8810 |
Jan 1987 |
JPX |
|
62-8811 |
Jan 1987 |
JPX |
|
62-8812 |
Jan 1987 |
JPX |
|
62-8813 |
Jan 1987 |
JPX |
|
Parent Case Info
This application is a continuation of application Ser. No. 144,820, filed Jan. 15, 1988, now abandoned.
US Referenced Citations (2)
Number |
Name |
Date |
Kind |
2902365 |
Martin |
Sep 1959 |
|
4621044 |
Fujikawa |
Nov 1986 |
|
Foreign Referenced Citations (2)
Number |
Date |
Country |
0084851 |
Aug 1983 |
EPX |
0196571 |
Jun 1986 |
EPX |
Non-Patent Literature Citations (2)
Entry |
Photocurable Liquid Resin Composition, Abstract of Japan APP56-131609, from Patent Abstracts of Japan, Jun. 16, 1982. |
Research Disclosure 24919, "Process for Producing a Photosensitive Composition by Melt Extrusion," Jan. 1985. |
Continuations (1)
|
Number |
Date |
Country |
Parent |
144820 |
Jan 1988 |
|