Patent Application
20080224366
This disclosure, in general, relates to composite materials, articles formed thereof and methods for making such composite materials and articles.
In industries such as aerospace, automobile manufacturing, and semiconductor manufacturing, increasingly intricate components and tools are used in high temperature environments. Traditionally, manufacturers have used metal and ceramic materials to form such components and tools based on the tolerance of such materials with high temperatures.
Increasingly, polymeric materials are being used as alternatives to metal and ceramic materials. In general, polymeric materials are less expensive, lighter in weight, and easier to form than metal and ceramic materials. Typically, polymer materials are significantly lighter than metal. In addition, polymers often cost less than 1/10 the cost of ceramic materials, can be molded at lower temperatures than ceramics, and are easier to machine than ceramic materials.
However, unlike metal and ceramic materials, polymeric materials tend to degrade at high temperatures. Typically, at elevated temperatures polymeric materials lose mechanical strength. In addition, when exposed to elevated temperatures in an atmosphere including oxygen, polymeric materials tend to lose mass through oxidation and off-gassing. Such a loss of mass often results in changes in the dimensions of an article formed of such polymeric materials. In addition, such a loss of mass typically results in reduced mechanical strength, such as a decrease in tensile strength and elongation properties.
In addition, polymers may be susceptible to water absorption. In general, water absorption may influence the mechanical properties of the polymer. Further, water absorption may add weight to a polymer that is exposed to the elements. Such weight may be undesirable if the polymer is used in weight sensitive applications, such as aerospace applications. Further, a polymer that absorbs water may introduce undesirable variability in humidity in sensitive semiconductor processes.
As such, an improved polymeric material would be desirable.
In a particular embodiment, a composite material includes polyimide material, a particulate metal oxide dispersed in the polyimide material in an amount between about 0.1 wt % and about 20.0 wt %, and a carbonaceous material dispersed in the polyimide material in an amount between about 0.0 wt % and about 45.0 wt %.
In another embodiment, a method of forming a composite material includes adding a polyamic acid precursor to a mixture, adding a metal oxide particulate to the mixture, and adding a carbonaceous material to the mixture. The polyamic acid precursor reacts to form polyamic acid. The method further includes imidizing the polyamic acid to form a polyimide matrix including the metal oxide and carbonaceous material.
In a further embodiment, a method of forming a composite material includes adding a polyamic acid precursor to a mixture and adding a metal oxide particulate to the mixture. The polyamic acid precursor reacts to form polyamic acid. The method further includes imidizing the polyamic acid to form a polyimide matrix including the metal oxide.
In a particular embodiment, a composite material includes a polyimide matrix and a metal oxide particulate dispersed or dissolved in the polyimide matrix. The composite material may include about 0.1 wt % to about 50.0 wt % metal oxide. In an exemplary embodiment, the composite material may exhibit a water absorption of not greater than 6.0%.
In an exemplary method, the composite material may be formed by preparing a mixture including a polyamic acid precursor and a metal oxide particulate. The metal oxide particulate may be milled prior to preparing the mixture. The polyamic acid precursor may react, such as with a second polyamic acid precursor, to form polyamic acid. The method further includes imidizing or dehydrating the polyamic acid to form a polyimide matrix including the metal oxide.
The polyamic acid precursor includes a chemical species that may react with itself or another species to form polyamic acid, which may be dehydrated to form polyimide. In particular, the polyamic acid precursor may be one of a dianhydride or a diamine. Dianhydride and diamine may react to form polyamic acid, which may be imidized to form polyimide.
In an exemplary embodiment, the polyamic acid precursor includes dianhydride, and, in particular, aromatic dianhydride. An exemplary dianhydride includes pyromellitic dianhydride, 2,3,6,7-naphthalenetetracarboxylic acid dianhydride, 3,3′,4,4′-diphenyltetracarboxylic acid dianhydride, 1,2,5,6-naphthalenetetracarboxylic acid dianhydride, 2,2′,3,3′-diphenyltetracarboxylic acid dianhydride, 2,2-bis-(3,4-dicarboxyphenyl)-propane dianhydride, bis-(3,4-dicarboxyphenyl)-sulfone dianhydride, bis-(3,4-dicarboxyphenyl)-ether dianhydride, 2,2-bis-(2,3-dicarboxyphenyl)-propane dianhydride, 1,1-bis-(2,3-dicarboxyphenyl)-ethane dianhydride, 1,1-bis-(3,4-dicarboxyphenyl)-ethane dianhydride, bis-(2,3-dicarboxyphenyl)-methane dianhydride, bis-(3,4-dicarboxyphenyl)-methane dianhydride, 3,4,3′,4′-benzophenonetetracarboxylic acid dianhydride or a mixture thereof. In a particular example, the dianhydride is pyromellitic dianhydride (PMDA). In another example, the dianhydride is benzophenonetetracarboxylic acid dianhydride (BTDA), or diphenyltetracarboxylic acid dianhydride (BPDA).
In another exemplary embodiment, the polyamic acid precursor includes diamine. An exemplary diamine includes oxydianiline (ODA), 4,4′-diaminodiphenylpropane, 4,4′-diaminodiphenylmethane, 4,4′-diaminodiphenylamine, benzidine, 4,4′-diaminodiphenyl sulfide, 4,4′-diaminodiphenyl sulfone, 3,3′-diaminodiphenyl sulfone, 4,4′-diaminodiphenyl ether, bis-(4-aminophenyl)diethylsilane, bis-(4-aminophenyl)-phenylphosphine oxide, bis-(4-aminophenyl)-N-methylamine, 1,5-diaminonaphthalene, 3,3′-dimethyl-4,4′-diaminobiphenyl, 3,3′-dimethoxybenzidine, 1,4-bis-(p-aminophenoxy)-benzene, 1,3-bis-(p-aminophenoxy)-benzene, m-phenylenediamine (MPD) or p-phenylenediamine (PPD), or a mixture thereof. In a particular example, the diamine is oxydianiline (ODA). In another example, the diamine is m-phenylenediamine (MPD) or p-Phenylenediamine (PPD).
The polyamic acid precursors, and, in particular, dianhydride and diamine, may react to form polyamic acid, which is imidized to form polyimide. In a particular embodiment, the polyimide includes the imidized product of PMDA and ODA. The polyimide forms a polymer matrix of a composite material in which a metal oxide may be dispersed.
The metal oxide particulate may include an oxide of a metal or a semi-metal selected from groups 1 through 16 of the periodic table. In particular, the metal oxide component may be an oxide of a metal or a semi-metal selected from groups 1 through 13, group 14 at or below period 3, group 15 at or below period 3, or group 16 at or below period 5. For example, the metal oxide may include an oxide of a metal or semi-metal selected from the group consisting of aluminum, antimony, barium, bismuth, boron, calcium, cerium, cesium, chromium, cobalt, copper, gallium, hafnium, iron, magnesium, manganese, molybdenum, nickel, niobium, phosphorous, silicon, tantalum, tellurium, tin, titanium, tungsten, vanadium, yttrium, zirconium, and zinc. In a particular embodiment, the metal oxide may include a metal oxide of aluminum, antimony, boron, calcium, cerium, gallium, hafnium, manganese, molybdenum, phosphorous, tantalum, tellurium, tin, tungsten, yttrium, zinc or a mixture thereof. In a particular example, the metal oxide includes boronsilicate. In another embodiment, the metal oxide includes an oxide of gallium. In a further embodiment, the metal oxide includes an oxide of antimony. Also, the metal oxide may include an oxide of tungsten. In addition, the metal oxide may include an oxide of phosphorous. In another example, the metal oxide includes an oxide of calcium. In a further example, the metal oxide may include an oxide of cerium. Herein, the term metal oxide is generally used to refer to oxides of metals and semi-metals.
In general, the metal oxide is in the form of particulate material. In an example, the particulate material has an average particle size not greater than about 100 microns, such as not greater than about 45 microns or not greater than about 5 microns. For example, the particulate material may have an average particle size not greater than about 1000 nm, such as not greater than about 500 nm, or not greater than about 150 nm. Further, the average particle size may be at least about 5 nm, such as at least about 10 nm, or at least about 50 nm. Alternatively, the average particle size may be between about 5 nm and about 150 nm, such as between about 5 nm and about 50 nm, or between about 5 nm and about 20 nm.
In a particular embodiment, the particulate material has a low aspect ratio. The aspect ratio is an average ratio of the longest dimension of a particle to the second longest dimension perpendicular to the longest dimension. For example, the particulate material may have an average aspect ratio not greater than about 2.0, such as about 1.0 or generally spherical.
In an exemplary embodiment, the composite material includes about 0.1 wt % to about 50.0 wt % of the metal oxide particulate. For example, the composite material may include about 0.1 wt % to about 20.0 wt % of the metal oxide particulate, such as about 0.1 wt % to about 10.0 wt %, or about 0.1 wt % to about 5.0 wt % of the metal oxide particulate. In a particular example, the composite material may include less than about 5.0 wt %, such as about 0.1 wt % to about 2.5 wt % of the metal oxide particulate, such as about 0.5 wt % to about 2.5 wt %, or about 0.5 wt % to about 1.5 wt % of the metal oxide particulate.
In another exemplary embodiment, the composite material may include large amounts of a second filler, such as a non-carbonaceous filler. In particular, the polyimide matrix may include at least about 55 wt % of a non-carbonaceous filler. Alternatively, the composite material may be free of other non-carbonaceous filler. Further, the composite material may include a coupling agent, a wetting agent, or a surfactant. In a particular embodiment, the composite material is free of coupling agents, wetting agents, and surfactants.
In addition, the composite material may include additives, such as carbonaceous materials. Carbonaceous materials are those materials, excluding polymers, that are formed predominantly of carbon (or organic materials processed to form predominantly carbon), such as graphite, amorphous carbon, diamond, carbon fibers, and fullerenes. In particular, the composite material may include graphite or amorphous carbon. In an exemplary embodiment, the composite material includes 0.0 wt % to about 45.0 wt % carbonaceous material, such as about 10.0 wt % to about 40.0 wt % or about 15.0 wt % to about 25.0 wt %. Alternatively, particular embodiments are free of carbonaceous materials.
In an exemplary embodiment, the composite material exhibits improved temperature stability. The temperature stability may be characterized by a decrease in thermal oxidative stability weight loss during exposure to an oxygen atmosphere at 60 psi at elevated temperatures or an increase in Degradation Onset Temperature based on thermal gravimetric analysis (TGA). The thermal oxidative stability weight loss is defined as the loss in weight when exposed to air at 371° C. (700° F.) and at 60 psi (total) for a period of 100 hours. In particular, the improvement in thermal stability may be characterized by a percent decrease in thermal oxidative weight loss of the composite relative to the base polyimide without metal oxide particulate when exposed to thermal oxidative conditions (air at 371° C. (700° F.) and at atmospheric pressure for a period of 100 hours), herein termed “Thermal Oxidative Performance.” For example, the composite material may exhibit a Thermal Oxidative Performance of at least about 5.0%, such as at least about 10.0% or at least about 25.0%, relative to the polyimide without metal oxide. In particular embodiments, the composite material may exhibit a thermal oxidative stability weight loss not greater than 3.0%. For example, the composite material may exhibit a thermal oxidative stability weight loss of not greater than 2.7% or not greater than 2.5%.
The Degradation Onset Temperature is generally defined as the temperature at which the composite material loses 1.0 wt % when exposed to air at atmospheric pressure and ambient humidity for a period of 48 hours. The Degradation Onset Temperature is measured in a TGA Q500 by TA instruments. For example, the composite material may exhibit an Degradation Onset Temperature of at least about 550° C., such as at least about 560° C.
In an additional embodiment, the composite material may exhibit increased glass transition temperature (Tg) as determined by dynamic mechanical thermal analysis (DMA). DMA is performed using a DMA Q800 by TA Instruments under the conditions: amplitude 15 microns, frequency lHz, air atmosphere, and a temperature program increasing from room temperature to 600° C. at a rate of 5° C./min. For example, the composite material may exhibit an increase in glass transition temperature (Tg) over the base polyimide without metal oxide particulate, herein “Glass Transition Temperature Performance,” of at least about 5.0%, such as at least about 10.0%, at least about 15.0%, or, in particular embodiments, at least about 20.0%. In a particular embodiment, the composite material exhibits a glass transition temperature of at least about 400° C., such as at least about 410° C., at least about 420° C., or at least about 430° C.
The composite material may also exhibit improved mechanical properties. For example, the composite material may exhibit improved tensile strength and elongation properties relative to the base polyimide used to form the composite material. In an exemplary embodiment, the composite material exhibits a Strength Performance of at least about 2.0%. The Strength Performance is defined as a percentage increase in tensile Strength Performance relative to the base polyimide without metal oxide particulate. For example, the composite material may exhibit a Strength Performance of at least about 4.5%, such as at least about 7.1%, or at least about 10.0%. For a particular polyimide, such as the imidized product of PMDA and ODA, the tensile strength of the composite material may be at least about 72.3 MPa (10500 psi), such as at least about 82.0 MPa (11900 psi), at least about 84.1 MPa (12200 psi), or at least about 86.2 MPa (12500 psi). The tensile strength and elongation may, for example, be measured using standard techniques, such as ASTM D6456 using specimens conforming to D1708 and E8.
In addition, the composite material may exhibit an improved elongation, such as an Elongation Performance defined as a percentage increase in elongation-at-break of the composite material relative to the base polyimide. For example, the composite material may exhibit an Elongation Performance of at least about 5.0%, such as at least about 10.0%, or at least about 20.0%. In particular embodiments, the composite material exhibits an elongation-at-break of at least about 10.5%, such as at least about 11.5%, at least about 12.5%, or at least about 15.0%.
Further, the composite material may exhibit an improved resistance to water absorption. For example, the composite material may exhibit a Water Absorption of not greater than about 6.0%, such as not greater than about 4.5%, not greater than about 3.5%, or even, not greater than about 3.2%. Water Absorption is the increase in weight caused by the absorption of water and may be determined in accordance with ASTM D-570, in which samples are immersed in a water bath at 80° C. for 7 days. Further, the improvement may be expressed in terms of Absorption Index, which is the percent decrease in Water Absorption relative to the Water Absorption of the polymer absent metal oxide additive. In particular, the Absorption Index of the composite material may be at least about 10, such as at least about 20, at least about 30, at least about 35, at least about 50, or even at least about 55.
In an exemplary method, the composite material is formed by preparing a mixture including unreacted polyamic acid precursors and a metal oxide particulate. In a particular example, the mixture includes the metal oxide particulate and at least one of a dianhydride and a diamine. The mixture may further include a solvent or a blend of solvents.
A solvent may be selected whose functional groups do not react with either of the reactants to any appreciable extent. In addition to being a solvent for the polyamic acid, the solvent is typically a solvent for at least one of the reactants (e.g., the diamine or the dianhydride). In a particular embodiment, the solvent is a solvent for both of the diamine and the dianhydride.
The solvent may be a polar solvent, a non-polar solvent or a mixture thereof. In an exemplary embodiment, the solvent is an aprotic dipolar organic solvent. An exemplary aprotic dipolar solvent includes N,N-dialkylcarboxylamide, N,N-dimethylformamide, N,N-dimethylacetamide, N,N-diethylformamaide, N,N-diethylacetamide, N,N-dimethylmethoxyacetamide, N-methyl caprolactam, dimethylsulfoxide, N-methyl-2-pyrrolidone, tetramethyl urea, pyridine, dimethylsulfone, hexamethylphosphoramide, tetramethylene sulfone, formamide, N-methylformamide, butylrolactone, or a mixture thereof. An exemplary non-polar solvent includes benzene, benzonitrile, dioxane, xylene, toluene, cyclohexane or a mixture thereof. Other exemplary solvents are of the halohydrocarbon class and include, for example, chlorobenzene.
In one exemplary embodiment, the solvent mixture includes a mixture of at least two solvents. In one exemplary embodiment, the resulting solvent mixture includes an aprotic dipolar solvent and a non-polar solvent. The aprotic dipolar solvent and non-polar solvent may form a mixture having a ratio of 1:9 to 9:1 aprotic dipolar solvent to non-polar solvent, such as 1:3 to 6:1. For example, the ratio may be 1:1 to 6:1, such as 3.5:1 to 4:1 aprotic dipolar solvent to non-polar solvent.
For solution formed polyimide, reactants may be provided in solvent mixtures or added to solvent mixtures. Additional solvents may be added prior to dehydration or imidization, such as prior to azeotropic distillation. For precipitation formed polyimide, reactants may be provided in solvents or added to solvents. Polyimide may be precipitated from the solvent mixture through addition of dehydrating agents.
According to an embodiment, the metal oxide particulate may be added along with at least one polyamic acid precursor to a solvent prior to polymerization of the polyamic acid precursors. The addition may be performed under high shear conditions. In a particular embodiment, the metal oxide particulate may be milled, such as through ball milling, prior to addition to the mixture.
In an exemplary method, a second polyamic acid precursor may be added to the mixture either in the form of a second mixture or as a dry component. For example, the polyamic acid mixture may be prepared by reacting a diamine component with a dianhydride component. In an exemplary embodiment, the dianhydride component is added to a solvent mixture including the diamine component. In another exemplary embodiment, the dianhydride component is mixed with the diamine without solvent to form a dry mixture. Solvent is added to the dry mixture in measured quantities to control the reaction and form the polyamic acid mixture. In such an example, the metal oxide particulate may be mixed with the dry mixture prior to addition of the solvent. In a further exemplary embodiment, a mixture including diamine and a solvent is mixed with a second mixture including the dianhydride component and a solvent to form the polyamic acid mixture. The metal oxide particulate may be included in one or both of the mixtures.
In general, the polyamic acid reaction is exothermic. As such, the mixture may be cooled to control the reaction. In a particular embodiment, the temperature of the mixture may be maintained or controlled between about −10° C. and about 100° C., such as about 25° C. and about 70° C.
Once formed, the polyamic acid may be dehydrated or imidized to form polyimide. The polyimide may be formed in mixture from the polyamic acid mixture. For example, a Lewis base, such as a tertiary amine, may be added to the polyamic acid mixture and the polyamic acid mixture heated to form a polyimide mixture. Portions of the solvent may act to form azeotropes with water formed as a byproduct of the imidization. In an exemplary embodiment, the water byproduct may be removed by azeotropic distillation.
In another exemplary embodiment, polyimide may be precipitated from the polyamic acid mixture, for example, through addition of a dehydrating agent. Exemplary dehydrating agents include fatty acid anhydrides formed from acetic acid, propionic acid, butyric acid, or valeric acid, aromatic anhydride formed from benzoic acid or napthoic acid, anhydrides of carbonic acid or formic acid, aliphatic ketenes, or mixtures thereof.
In general, the polyimide product forms solids that are typically filtered, washed, and dried. For example, polyimide precipitate may be filtered and washed in a mixture including methanol, such as a mixture of methanol and water. The washed polyimide may be dried at a temperature between about 150° C. and about 300° C. for a period between 5 and 30 hours and, in general, at or below atmospheric pressure, such as partial vacuum (500-700 torr) or full vacuum (50-100 torr). As a result, a composite material is formed including a polyimide matrix having metal oxide particulate dispersed therein. The metal oxide particulate is generally evenly dispersed. Alternatively particular metal oxides at least partially dissolve in the polyimide. In general, the metal oxides form a complex or react with the monomer.
In a particular example, the resulting polyimide material is a powder, such as a molding powder. The powder may have a particle size distribution in which 90% of the particles have a particle size not greater than about 650 micrometers, such as not greater than about 500 micrometers, not greater than about 250 micrometers, or even not greater than about 100 micrometers. Further, the polyimide powder may be compression moldable, such as direct formable. Compression moldable powders are polyimide powders that may be formed into articles through compression and sintering, the sintering being either concurrent with compression or following compression. Direct formable powders are compression moldable powders that may be compressed into a green article and subsequently sintered.
To form an article, the composite material may be hot pressed or press sintered. In another example, the composite material may be pressed and subsequently sintered to form the component. For example, the polyimide may be molded using high pressure sintering at temperatures of about 250° C. to about 450° C., such as about 350° C. and pressures at least about 351 kg/cm2 (5 ksi), such as about 351 kg/cm2 (5 ksi) to about 1406 kg/cm2 (20 ksi) or, in other embodiments, as high as about 6250 kg/cm2 (88.87 ksi).
Samples of a composite material including polyimide and including a metal oxide particulate are prepared and tested to determine mechanical properties and thermal stability. A mixture of oxydianiline (ODA), N-methylpyrrolidone (NMP), and xylene is prepared. Metal oxide is added to the mixture under high shear conditions. Pyromellitic dianhydride (PMDA) is added to the mixture under reaction conditions to a ratio of 1.000:1.0085 ODA to PMDA. The resulting mixture is azeotropically distilled and the thus formed polyimide is filtered, washed, and dried as described above.
The resulting polyimide is pressed and sintered into sheets and cut into standard shapes for testing. Table 1 illustrates the influence of metal oxide on mechanical properties, such as tensile strength and elongation, and Table 2 illustrates the influence of metal oxides on glass transition temperature and Degradation Onset Temperature. Tensile strength and elongation are determined in accordance with ASTM D6456 using sample conforming to D1708 or E8.
As illustrated in Table 1, particular metal oxides in amounts from 0.5 wt % to 2.0 wt % increase tensile strength, an improvement over the base polymer sample, Sample 1 (Meldin® 7001). For example, samples including oxides of boron, tungsten, gallium, or antimony exhibit increased tensile strength relative to Sample 1. As illustrated, oxides of boron increase tensile strength in the base polyimide at 0.5 wt %, 1.0 wt % and 2.0 wt %. In particular, such Samples exhibit increased tensile strength of at least about 2.0%, and, in some examples, at least about 10.0% over the base polyimide.
In addition, several samples including metal oxides increase elongation properties relative to the base polyimide sample, Sample 1. In particular, samples including oxides of boron, antimony or tungsten exhibit elongation greater than 14%, and even greater than 15%.
As illustrated in Table 2, samples including metal oxide exhibit high glass transition temperature (Tg) and high thermal oxidative stability. The glass transition temperatures are determined using dynamic mechanical thermal analysis (DMA). DMA is performed using a DMA Q800 by TA Instruments under the conditions: amplitude 15 microns, frequency 1 Hz, Air atmosphere, and a temperature program increasing from room temperature to 600° C. at a rate of 5° C./min. The Degradation Onset Temperature is determined using thermal gravimetric analysis (TGA) wherein the Degradation Onset Temperature is defined as the temperature at which the sample exhibits a 1.0% loss in weight when exposed to the temperature and air for 48 hours at atmospheric pressure. The Degradation Onset Temperature is measured in a TGA Q500 by TA instruments. The samples exhibit a glass transition temperature (Tg) of at least 400° C. Particular samples, including Samples 15 and 17, exhibit glass transition temperatures (Tg) greater than 410° C., and other samples, including Samples 7, 9, 10, 12, and 14, exhibit glass transition temperatures (Tg) greater than 420° C. As such, particular examples exhibit increased glass transition temperature (Tg) at least about 5% and, in some examples, at least about 20% over the base polyimide.
Further, the samples exhibit high Degradation Onset Temperatures. For example, Samples 4, 9 and 14 exhibit Degradation Onset Temperatures above 550° C. and Samples 6, 7, 8, 10, 12, 15, and 17 exhibit Degradation Onset Temperatures above 560° C.
Exemplary samples are prepared as described below and tested for mechanical properties and thermal oxidative loss.
A mixture including 80 parts of oxydianiline (ODA), 1000 parts of N-methylpyrrolidone (NMP) and a specified amount of metal oxide are introduced into a reaction vessel. A second mixture including 122.4 parts PMDA and 183 parts NMP are added to the reaction vessel. When the reaction is complete, 6.42 parts of PMDA are added. In addition, 280 parts xylene are added to the mixture and the mixture is heated. Water is removed from the reaction mixture through azeotropic distillation. The polyimide precipitate including the metal oxide is filtered and washed with methanol. The filtered polyimide is dried for 15 hours at 100° C. to 130° C. at partial vacuum (500-700 torr) followed by 15-20 hours at 200° C. to 250° C. at full vacuum (10-50 torr).
As illustrated in Table 3, the samples are tested for elongation properties, tensile strength and thermal oxidative stability weight loss (TOS). For example, to determine thermal oxidative stability weight loss, the samples are exposed to air at a temperature of 371° C. (700° F.) and at 60 psi pressure for a period of 100 hours in a TGA apparatus.
As illustrated in Table 3, the samples including an oxide of boron or an oxide of antimony, respectively, exhibit increased tensile strength and elongation-at-break relative to the sample including no oxide. In addition, the oxide containing samples exhibit decreased thermal oxidation rate, implying improved temperature stability and an increased maximum operating temperature.
Samples of polyimide including particular metal oxides exhibit higher tensile strength and elongation properties than the base polyimide without metal oxide after exposure to high temperatures. Samples are prepared in accordance with Example 1. Table 4 illustrates tensile strength and elongation properties for samples after exposure to 427° C. (800° F.) in still air at atmospheric pressure for a period of 24 hours. As illustrated, samples including oxide exhibit higher tensile strength and higher elongation after exposure to thermal oxidative conditions.
Samples including metal oxide and including graphite are exposed to thermal oxidative conditions. Samples are prepared in accordance with Example 1 with the addition of 40 wt % graphite. Table 5 illustrates the thermal oxidative stability weight loss (TOS) of the samples. The sample including both metal oxide, such as B2O3, and graphite exhibits increased thermal oxidative stability relative to the sample including graphite and no metal oxide after exposure to 371° C. (700° F.) in air at atmospheric pressure for 120 hours as indicated by a decrease in wt % loss.
Samples including metal oxide and including graphite are immersed in a water bath for 7 days at 80° C. in accordance with ASTM D-570 to determine Water Absorption and Absorption Index. The samples are prepared in accordance with Example 1 with the addition of 40 wt % graphite. Table 6 illustrates the Water Absorption and Absorption Index of the samples. The sample including both metal oxide, such as Sb2O3, and graphite exhibits lower Water Absorption relative to the sample including graphite and no metal oxide after immersion in water at 80° C. for 7 days.
Polyimide powder samples are prepared and molded as described in US Patent Application Publication No. 2007/0154717. The powder is molded into tensile bars at 70,000 psi followed by sintering for 4 hrs at 413° C. The pieces of tensile bars are submerged in 80° C. water and weighed periodically. The highest measured water absorption when weighed between two consecutive measurements is less than about 1% or about 5 mg.
As illustrated in Table 7, powder samples including antimony oxide exhibit lower water absorption and thus, an Absorption Index greater than about 10.0. In particular, samples that include graphite and metal oxide out perform samples including graphite alone and exhibit an Absoprtion Index greater than 30.
Note that not all of the activities described above in the general description or the examples are required, that a portion of a specific activity may not be required, and that one or more further activities may be performed in addition to those described. Still further, the order in which activities are listed are not necessarily the order in which they are performed.
In the foregoing specification, the concepts have been described with reference to specific embodiments. However, one of ordinary skill in the art appreciates that various modifications and changes can be made without departing from the scope of the invention as set forth in the claims below. Accordingly, the specification and figures are to be regarded in an illustrative rather than a restrictive sense, and all such modifications are intended to be included within the scope of invention.
As used herein, the terms “comprises,” “comprising,” “includes,” “including,” “has,” “having” or any other variation thereof, are intended to cover a non-exclusive inclusion. For example, a process, method, article, or apparatus that comprises a list of features is not necessarily limited only to those features but may include other features not expressly listed or inherent to such process, method, article, or apparatus. Further, unless expressly stated to the contrary, “or” refers to an inclusive-or and not to an exclusive-or. For example, a condition A or B is satisfied by any one of the following: A is true (or present) and B is false (or not present), A is false (or not present) and B is true (or present), and both A and B are true (or present).
Also, the use of “a” or “an” are employed to describe elements and components described herein. This is done merely for convenience and to give a general sense of the scope of the invention. This description should be read to include one or at least one and the singular also includes the plural unless it is obvious that it is meant otherwise.
Benefits, other advantages, and solutions to problems have been described above with regard to specific embodiments. However, the benefits, advantages, solutions to problems, and any feature(s) that may cause any benefit, advantage, or solution to occur or become more pronounced are not to be construed as a critical, required, or essential feature of any or all the claims.
After reading the specification, skilled artisans will appreciated that certain features are, for clarity, described herein in the context of separate embodiments, may also be provided in combination in a single embodiment. Conversely, various features that are, for brevity, described in the context of a single embodiment, may also be provided separately or in any subcombination. Further, references to values stated in ranges include each and every value within that range.
The present application claims priority from U.S. Utility patent application Ser. No. 11/324,022, filed Dec. 30, 2005, entitled “THERMALLY STABLE COMPOSITE MATERIAL,” naming inventors Mark W. Beltz, Gwo Swei, and Pawel Czubarow, which application is incorporated by reference herein in its entirety.
| Number | Date | Country | |
|---|---|---|---|
| Parent | 11324022 | Dec 2005 | US |
| Child | 11967930 | US |
