The present invention relates to a wire rod feeding device for feeding a wire rod formed of a soft material and a wire solder used for the device.
In soldering electronic equipment, a manual soldering technique, in which a wire solder formed by fabricating a solder into a wire form or a resin flux cored solder formed by impregnating the interior of wire solder with a flux-component such as rosin is applied with a soldering iron, is used. In particular, the manual soldering technique is widely used for soldering parts that cannot be soldered by flow soldering or reflow soldering or for making correction after soldering. As the size of electronic equipment has decreased in recent years, electronic components have decreased in size, and hence the wire diameter of the wire solder or resin flux cored solder that is used for manual soldering has also decreased. If the wire diameter decreases, the solder, which is formed of a soft material, is bent at the time of supply. As a device for supplying a solder with a small wire diameter, a device in which a wire solder is run out by a chuck that can be opened and closed and can be moved back and forth is known (refer to Patent Document 1). Specifically, a chuck formed with a triangular protrusion for holding a wire solder is arranged in an outer cylinder, and a holding member for preventing the wire solder from retreating (returning) is arranged at a position in front of and separated from the chuck. Also, at the rear of the chuck, a lever for performing an operation for feeding the wire solder by advancing the chuck against the urging force of a coil spring is provided.
The above-described conventional art has high usability because a fixed amount of wire solder can be run out by the operation of the lever.
Also, generally, most of the wire solders now used have a diameter of 0.7 to 1.0 mm, and in recent years, the wire solders with a diameter of 0.5 mm or 0.3 mm have been demanded and have been used. The sizes of products have been decreased year by year, and therefore parts contained in the products have been decreased in size, so that the diameter of wire solder has been decreased with the decrease in part size.
However, in inserting the wire solder whose diameter is decreased as described above into the above-described wire rod feeding device, some problem arises. Specifically, since the chuck is normally closed by the coil spring, the insertion work must be performed while the chuck is opened by the operation of lever. That is to say, aside from the insertion of a thick wire solder, a thin wire solder is inserted by one hand while the lever operation is performed against the urging force by the other hand, so that it is difficult to perform positioning of the tip end of wire solder, and sometimes the wire solder comes into contact with the inner surface of chuck and thereby is bent.
Patent Document: Microfilm of Japanese Utility Model Application-No. 62-169776 (Japanese Utility Model Laid-Open No. 1-72974)
An object of the present invention is to provide a wire rod feeding device in which a soft wire rod such as a wire solder can be inserted easily.
To achieve the above object, the present invention provides, as a first gist of the invention, a wire rod feeding device which is a device for feeding a wire rod formed of a soft material, characterized in that the wire rod is gripped and released, and is run out by a chuck body which is movable back and forth; and opening means for keeping an opened state of the chuck body is provided, provides, as a second gist of the invention, a wire rod feeding device which is a device for feeding a wire rod formed of a soft material, characterized in that the wire rod is gripped and released, and is run out by a chuck body which is movable back and forth; and a returning operation of an operating member for operating the chuck body is performed gradually, provides, as a third gist of the invention, a wire rod feeding device which is a device for feeding a wire rod formed of a soft material, characterized in that the wire rod is gripped and released, and is run out by a chuck body which is movable back and forth; and the length of a wire rod gripping portion of the chuck body is set so as to be longer than the running-out amount of the wire rod, and provides, as a fourth gist of the invention, a wire rod feeding device which is a device for feeding a wire rod formed of a soft material, characterized in that wire rod storage means for storing the soft wire rod is provided on a device body.
The wire rod formed of a soft material is a wire rod formed of a material having a hardness, for example, equal to or lower than 45 in the Brinell hardness test though various measuring methods are available. As one example, a wire solder, an enameled wire, a copper wire, a tussah, a thread for sewing, and the like can be cited. In the case of the wire solder, a wire solder having a hardness of 4 to 20 in the Brinell hardness test is generally used.
According to the above-described configuration, the soft wire rod can be inserted easily in the wire rod feeding device.
The operation of the wire rod feeding device in accordance with the present invention is explained below. At the time of wire rod insertion, since the chuck body is open, the wire rod is inserted easily in the chuck body, and the wire rod passing through an internal space of the wire rod feeding device is supplied to the chuck body. Also, when the chuck body is returned from an open state, the operating member returns gradually. Further, the soft wire rod in a curved state is pressed by the opening and closing chuck body, and is corrected into a straight-line shape by the pressing force thereof. Moreover, since the amount (length) being pressed and corrected is larger than the running-out amount of wire rod, the wire solder is not run out without being corrected, and is always run out in a pressed and corrected state at least once. Also, the wire rod is supplied from the wire rod storage means provided on the device body and is run out.
First, a first embodiment of a wire rod feeding device in accordance with the present invention will be described. The wire rod feeding device of this embodiment is a device for running out a wire solder H. This device is what is called a side knock type wire rod feeding device in which a knock piece is provided on the side surface of an intermediate part of a barrel so that the wire solder H is run out by pressing the knock piece in the radial direction of barrel. The device of this embodiment may be a side slide type wire rod feeding device in which the wire solder H is run out by sliding the knock piece in the lengthwise direction of barrel, or may be a rear end knock type wire rod feeding device in which the wire solder H is run out by pressing the knock piece in the lengthwise direction of barrel. Hereunder, a specific explanation will be given. As shown in
In front of the slider member 2, a collet (two-piece or three-piece, etc.) type chuck body 7 for gripping and releasing the wire solder H is pressed in and fixed. A front part of the chuck body 7 is surrounded by a chuck ring 8 for opening and closing the chuck body 7. In
At the distal end of the barrel 1, a distal member 10 is detachably fixed by a means such as a screw. The distal member 10 may be formed integrally with the barrel 1. At the distal end of the distal member 10, a straight-line shaped distal end pipe (wire rod protective pipe) 11 is fixed. The distal end pipe 11 is formed of a metallic material such as stainless steel, iron, and aluminum, a heat resisting resin such as a fluorine-based resin, a metallic material covered with a heat resisting resin material, a metallic material coated with a heat resisting resin, or a heat resisting resin covered with a metallic material. The distal end pipe 11 may be a curved distal end pipe 12 as shown in
As shown in
Also, the maximum inside diameter a of the funnel-shaped through hole formed in the wire rod guide member 13 is two times or more as large as the outside diameter c of the wire solder H used. This setting guides the wire solder H easily into the through hole in the wire rod guide member 13. According to this setting, even if the tip end of the wire solder H is curved, the wire solder H can be guided gradually to the locking member 14 while being corrected. At the lower end of the distal end pipe 11, a small-diameter portion may be formed so that not only the outer peripheral portion but also the inner peripheral portion has a decreased diameter. Specifically, the distal end pipe 11 has an inside diameter of 0.5 mm, and the small-diameter portion may have an inside diameter of 0.38 mm. The diameter of the wire solder H is 0.3 mm. This permits that the stability (prevention of oscillation) of the wire solder H during operation is improved, and also the visibility is improved. Also, if the inside diameter b of the distal end pipe 11 is made about 1.25 to 10 times as large as the outside diameter c of the wire solder H used without being limited to this example, a good feeding operation can be obtained. On the other hand, if the inside diameter b of the pipe is less than 1.25 times the outside diameter c of the wire solder H, the sliding (passing) ability of the wire solder H is deteriorated by some curving thereof. If the inside diameter b of the pipe exceeds 10 times the outside diameter C of the wire solder H, there is a danger of occurring buckling of wire solder in the pipe. A preferable range of the inside diameter b of the distal end pipe 11 is 1.25 to 2 times the outside diameter c of the wire solder H. Also, considering the visibility and the stability at the pipe distal end, the protrusion length of the distal end pipe 11 is preferably in the range of 1.0 to 20.0 mm. Further, depending on the kind of object to be soldered, the feeding amount of the wire solder H is preferably set in the range of 0.5 to 2.0 mm.
As shown in
In
At the rear of the wire rod gripping portion, as shown in
The wire rod inserting member 17 is formed with a through hole 17a having an inside diameter equivalent to the inside diameter of the guide pipe 16, and is also formed with an inner surface conical portion 17b whose inside diameter decreases toward the lower end side of the wire rod inserting member 17. Also, on the upper outer surface of the wire rod inserting member 17, an outer surface conical portion 17c whose outside diameter decreases toward the upper end side of the wire rod inserting member 17 is formed. The longitudinal cross-sectional shape of this outer surface conical portion 17c has a substantially triangular portion that is formed when a thumb and the forefinger are brought into contact with each other (refer to
In
Although a ring member 20 is fixed to a front end part of the rear casing 19 in this example, the ring member 20 may be formed integrally with the rear casing 19. The circumscribed circle diameter of the ring member 20 is the maximum outside diameter of the contour of this feeding device. On the other hand, the rear inner surface of the rear casing 19 is circular in shape, but as shown in FIGS. 8 an 9, the rear inner surface of the rear casing 19 may be formed with a flat portion 21 similar to the plane portion 1a of the barrel 1. By forming the inner shape similar to the outer shape of the barrel 1, relative rotation of the rear casing 19 with respect to the barrel 1 is prevented.
Also, as shown in
As shown in
As shown in
The above is an explanation of the example in which the knock piece 5 is returned gradually. In the case where the elastic spring force of the elastically springing member 9 is small, or the knock piece 5 is surely prevented from popping out from the barrel 1, as shown in
The rear casing 19 is described in further detail below. At the rear of the rear casing 19, holding elements 25 are extendingly provided at opposed positions, and in a gap 26 formed between the holding elements 25, a reel 27, which is wire rod storage means around which the wire solder H is wound, is arranged rotatably and detachably. Specifically, as shown in
The width D (refer to
Modified examples of the rear casing 19 and the reel 27 are shown in
Further modified example of the reel 27 is shown in
It is noted that for a reel that is not formed with the grooves 29b, as shown in
The groove 29b is especially effective for a reel in which the outside diameter of the rotating shaft portion 29 is five to ten times the wire diameter of the wire solder used. If the outside diameter of the rotating shaft portion 29 is less than five times, the above-described effect cannot be achieved regardless of the presence of groove. If the outside diameter of the rotating shaft portion 29 exceeds forty times, the next wound wire solder drops onto the surface of the rotating shaft portion gently and hence is wound neatly even if the groove is absent. Needless to say, the groove may be formed even in a reel in which the outside diameter of the rotating shaft portion 29 exceeds forty times.
In the above-described first embodiment, a rotatable reel is used as storage means for wire rod. However, the configuration may be such that, for example, a wound or folded wire solder H is stored in a case, and the case is insertedly provided in the wire rod feeding device so that the wire solder H is run out from the case in consecutive order. Since the wire solder H is stored in the case, the wire solder H is prevented from coming loose not only during insertion but also before insertion.
Also, in this embodiment, the reel 27 (34), which is the wire rod storage means around which the wire solder H is wound, is attached to the rear casing 19 to improve the workability (handling properties of feeding device). However, in the case where the wire solder H is used in large amounts temporarily, as shown in
Also, on the inner surface of an intermediate part of the rear casing 19, as shown in
Further, arc-shaped chamfering (chamfered portion 41) is performed above the through hole 30 on the rear inner surface of the holding element 25. If the rotating shaft portion 29 of the reel 27 is put on the rear end of the holding element 25 and is pressed in, the rotating shaft portion 29 is introduced so as to be guided in the central direction by the chamfered portion 41, and hence arrives at and fits in the through hole 30 easily.
Also, in
As explained above, this example shows a wire rod (wire solder H) feeding device used to solder electronic components onto a substrate. For this reason, the barrel 1, the wire rod inserting member 17, the rear casing 19, the reel 27, and the like are molded of a conductive resin. That is to say, by allowing the generated static electricity to radiate onto a floor etc., the electronic components are prevented from being damaged by the static electricity. The conductive resin preferably has a volume resistivity equal to or lower than 1010 Ω·cm. Commercially-available products of the resin are cited below. As POM (polyacetal), Tenac TFC64 and EF750 (manufactured by Asahi Chemical Industry Co., Ltd.), Duracon CH-10, CH-15, CH-20, EB-08, EB-10 and ES-5 (manufactured by Polyplastics Co., Ltd.), and Iupital ET-20 (manufactured by Mitsubishi Engineering-Plastics Corporation) can be cited. Also, as ABS (acrylonitrile butadiene styrene), Stylac ABS IC10N and IC10E (manufactured by Asahi Chemical Industry Co., Ltd.) can be cited, and as PC (polycarbonate), SDPolycaCF5101V, CF5201V, CF5301V and FD-9082I-2 (manufactured by Sumitomo Dow Ltd.) can be cited. Further, as PP (polypropylene), Daicel PP PB2N1 (manufactured by Daicel Polymer Ltd.) can be cited, and as PBT (polybutylene terephthalate), DURANEX CD7400B5 (manufactured by Polyplastics Co., Ltd.) can be cited. Still further, as PPS (polyphenylene sulfide), FORTORN 2130A1, 7140A4 and 7340A4 (manufactured by Polyplastics Co., Ltd.) and Torelina A756MX02 (manufactured by Toray Industries, Inc.) can be cited, and as PPE (modified polyphenylene ether), Iupiace EV08, EV12 and EV20 (manufactured by Mitsubishi Engineering-Plastics Corporation) can be cited.
As the wire solder used in the feeding device in accordance with the present invention, a wire solder formed by extruding or elongating a columnar solder into a linear shape is used. The wire solder having a wire diameter of 0.1 to 2.0 mm can be used. By changing the shape of gripping portion of the chuck body, a wire solder having an appropriate diameter can be used. Regarding the solder material used in the feeding device, not only the conventional Sn—Pb solder such as 60 mass % Sn—40 mass % Pb or 63 mass % Sn—37 mass % Pb but also a lead-free solder in which other elements are added to Sn, the main component, such as Sn—3.0 mass % Ag—0.5 mass % Cu, and which will be used in the future in consideration of environment can be used.
Further, in the feeding device in accordance with the present invention, a resin flux cored solder formed by impregnating the interior of wire solder with a flux component such as rosin can also be used.
These wire solder and resin flux cored solder are used by being wound around a reel member formed with disc-shaped collar portions at both ends of a winding portion. The wire solder and the resin flux cored solder that are used for the feeding device in accordance with the present invention are easily subjected to winding collapse after being wound around the reel member because they are soft. Therefore, as described above, the through hole 29a is provided in the connecting portion between the rotating shaft portion 29 and the inner surface of the collar 28 of the reel 27, and thereby the wire solder is inserted and wound at the winding start time, by which the winding collapse can be prevented. The through hole 29a formed in the reel 27 is not necessarily be triangular in shape, and may be circular or elliptical. Considering the fixing property of the end part of the wire solder H and the reel 27, the through hole 29a is preferably triangular as described above.
Next, an application example of the wire rod feeding device will be explained. In order to insert the wire solder in this device, the rear casing 19 is advanced. By the advance of the rear casing 19, the wire rod inserting member 17 is completely exposed from the rear casing 19. At this time, the ring member 20 (rear casing 19) of the rear casing 19 is in a state of covering the knock piece 5 and presses the knock piece 5, so that the chuck body 7 is in an opened state. Then, the wire solder H is pinched by the thumb and the forefinger, and the thumb and the forefinger are brought into contact with each other so as to cover the outer surface conical portion 17c of the wire rod inserting member 17. At the same time, the wire solder H is introduced by the inner surface conical portion 17b and is guided into the guide pipe 16. When this operation is performed continuously, the wire solder H passing through the guide pipe 16 is inserted into the chuck body 7 and the distal end pipe 11 (refer to
Next, an application example in which the knock piece 5 is formed with the depressed portion 5c. The inserting operation of the wire rod into the wire rod inserting member 17 is the same. After the completion of insertion, when the rear casing 19 is retreated, the front inner surface of the ring member 20 comes into contact with the depressed portion 5c of the knock piece 5 (refer to
When the knock piece 5 is pressed in the state in which the wire solder H is inserted, the slider member 2 and the chuck body 7 are advanced by the contact of the pressing portion 6 with the inclined surface 3 of the slider member 2. At this time, since the wire solder H is also gripped by the gripping portion of the chuck body 7, the wire solder H is run out from the reel 27, and is advanced while sliding in a state in which some frictional resistance is given by the guide pipe 16. As a result, the wire solder H is run out from the small-diameter portion of the distal end pipe 11. Before long, the chuck ring 8 comes into contact with the inner surface step portion 10a, so that the advance movement of the wire solder H is regulated, and the chuck body 7 is opened. In this process, the wire solder H run out from the reel 27 passes through an internal space of the rear casing 19, so that the wire solder H is supplied exactly without being subject to the influence of external force etc. and hence without being bent. Also, the wire solder H is advanced so as to be drawn by the wire rod inserting member 17 and the guide pipe 16, so that even a somewhat bent wire solder is corrected into a straight state. Further, since the amount (length) of the wire solder H pressed and corrected by the gripping operation of the chuck body 7 is larger than the amount of the wire solder H run out, the wire solder H is not run out without being corrected, and is run out in a pressed and corrected state always at least once, so that the wire solder H is forced into a further straight state, and is run out reliably. Then, when the pressing operation of the knock piece 5 is released, the chuck body 7 and the slider member 2 are retreated and returned by the urging force of the elastically springing member 9.
In the case where the wire solder H stored on the reel 27 is used up, the two holding elements 25 are pinched by fingers etc. to open the holding elements 25, and the reel 27 in which the wire solder H is used up is removed. Next, a wire solder H is drawn out to some extent from a new reel 27, the wire solder H being caused to pass through the wire rod inserting member 17, the guide pipe 16, and the like and being gripped by the chuck body 7 as described above, and then the reel 27 is attached to the holding elements 25.
Next, a second embodiment of a wire rod feeding device in accordance with the present invention will be described with reference to FIGS. 28 to 30. In the above-described first embodiment, the wire solder H is run out by pressing the knock piece provided on the side wall of the barrel. By contrast, in the second embodiment, a knock piece 44 is provided in the rear part of the barrel 43. Hereunder, a specific explanation is given. A slider member 45 having the chuck body 7 is formed extending to a position near the rear part of the barrel 43, and a protrusion 46 is formed so as to project transversely from a rear end part of the slider member 45. The protrusion 46 engages with the knock piece 44 installed slidably at the rear of the barrel 43. Namely, when the knock piece 44 is pressed downward, the chuck body 7 advances via the slider member 45.
Also, the guide pipe 16 is fixed in the chuck body 7 as in the first embodiment. Although the wire rod inserting member 17 is fixed to a rear part of the guide pipe 16, the configuration may be such that the rear part of the guide pipe 16 is slidable in the wire rod inserting member 17.
In order to keep the opened state of the chuck body 7, engagement means is provided on the barrel 43 and the knock piece 44. Specifically, a convex portion 47 is formed in an outer peripheral part of the barrel 43, and a concave portion 48 engaging with the convex portion 47 is formed in the inner surface of the knock piece 44. Namely, when the knock piece 44 is advanced exceeding the ordinary wire rod feeding operation to advance and open the chuck body 7, the convex portion 47 of he barrel 43 and the concave portion 48 of the knock piece 44 are engaged with each other, by which the opening of the chuck body 7 is maintained. The wire solder H is inserted in the state in which the chuck body 7 is open. After the insertion, if the knock piece 44 is disengaged from the barrel 43, the chuck body 7 grips the wire solder H again, and the running-out can be performed.
Next, a third embodiment of a wire rod feeding device in accordance with the present invention will be described with reference to
On the other hand, the cartridge portion 51 includes a rear cylinder 52 detachably connected to the front casing 50, the rear casing 19 and the wire rod inserting member 17, which are attached so as to be slidable with respect to the rear cylinder 52 as in the above-described embodiments, and the reel 27 provided detachably on the holding element 25 of the rear casing 19. Reference numeral 16 denotes the guide pipe fixed to the wire rod inserting member 17. The wire solder H can be guided exactly by this guide pipe 16.
By forming the rear part of the barrel 49 as a cartridge in this manner, the user etc. can replace the wire solder H without touching directly the wire solder H, so that poor bonding of the wire solder H due to sweat, hand grease, etc. can be prevented. Namely, from the state shown in
Manual soldering of electronic equipment was performed by using the wire rod feeding device in accordance with the present invention. The wire rod used was a lead-free resin flux cored solder formed of a material of Sn—3.0 mass % Ag—0.5 mass % Cu and having a wire diameter of 0.3 mm, and chip components of a cellular phone substrate was corrected by using this wire rod. A wire rod of about 0.6 mm could be run out by one knock, and a resin flux cored solder of 5 meters was used for 8-hour work. During this work, the running-out amount of wire rod was not changed, and the outline shape of wire rod was not damaged.
The wire rod feeding device in accordance with the present invention can use not only a soldering material but also a wire rod made of a soft material having a hardness equal to or lower than 20 in the Brinell hardness test. For the wire rod feeding device, for example, a gold wire used for semiconductor wire bonding, an enameled wire and copper wire used for a coil, a tussah, and a thread for sewing can be used. In the case of the wire solder, a wire solder having a hardness of 4 to 20 in the Brinell hardness test is preferably used.
Number | Date | Country | Kind |
---|---|---|---|
2003-183011 | Jun 2003 | JP | national |
2003-371320 | Oct 2003 | JP | national |
2003-399558 | Nov 2003 | JP | national |
2003-430563 | Dec 2003 | JP | national |
2004-023471 | Jan 2004 | JP | national |
2004-052412 | Feb 2004 | JP | national |
2004-052602 | Feb 2004 | JP | national |
2004-101809 | Mar 2004 | JP | national |
2004-103109 | Mar 2004 | JP | national |
Filing Document | Filing Date | Country | Kind | 371c Date |
---|---|---|---|---|
PCT/JP04/08877 | 6/24/2004 | WO | 11/3/2005 |