Solder feeding devices Solder melting pans

Industry

CPC
B23K3/06

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B23Machine tools B23KSOLDERING OR UNSOLDERING WELDING CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY B23K3/00Tools, devices, or special appurtenances for soldering

Current Industry

B23K3/06Solder feeding devices Solder melting pans

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Coating device and component mounting machine
- Patent number 12,262,480
- Issue date Mar 25, 2025
- FUJI CORPORATION
- Jinya Imura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sliding device for supplying or removing a sliding process material...
- Patent number 12,240,011
- Issue date Mar 4, 2025
- Dexerials Corporation
- Takayuki Saito
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder paste bead recovery system and method
- Patent number 12,220,768
- Issue date Feb 11, 2025
- Illinois Tool Works Inc.
- William A. Losiewicz
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Synchronous motion selective soldering apparatus and method
- Patent number 12,214,447
- Issue date Feb 4, 2025
- Nordson Corporation
- Gregory E. Goodell
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for high strength titanium rod additive manufac...
- Patent number 12,186,827
- Issue date Jan 7, 2025
- Goodrich Corporation
- Noel C. Haynes
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Nozzle
- Patent number 12,179,229
- Issue date Dec 31, 2024
- Illinois Tool Works Inc.
- Guohua Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Squeegee blade holder with secondary blade mounting apparatus
- Patent number 12,162,096
- Issue date Dec 10, 2024
- Transition Automation, Inc.
- Mark J. Curtin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor wafer and method of ball drop on thin wafer with edge...
- Patent number 12,154,877
- Issue date Nov 26, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dual-type solder ball placement system
- Patent number 12,151,315
- Issue date Nov 26, 2024
- S.S.P. INC.
- Kyouho Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stencil device and method for stencil printing of brazing material...
- Patent number 12,145,217
- Issue date Nov 19, 2024
- Swep International AB
- Sven Andersson
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Applied force determination and control in joining process
- Patent number 12,138,713
- Issue date Nov 12, 2024
- II-VI DELAWARE, INC.
- Frank Schulze
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Soldering systems having a nozzle exchange unit including a nitroge...
- Patent number 12,128,505
- Issue date Oct 29, 2024
- Illinois Tool Works Inc.
- Antonie Cornelis Colijn
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of applying solid brazing material, method of producing coat...
- Patent number 12,115,601
- Issue date Oct 15, 2024
- HARIMA CHEMICALS, INCORPORATED
- Satoshi Moriya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder supply unit, solder piece manufacturing device, part mountin...
- Patent number 12,083,626
- Issue date Sep 10, 2024
- HIRATA CORPORATION
- Toshiomi Ikeda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding apparatus
- Patent number 12,057,428
- Issue date Aug 6, 2024
- Samsung Electronics Co., Ltd.
- Jongeun Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Robot apparatus for soldering
- Patent number 12,017,341
- Issue date Jun 25, 2024
- FANUC CORPORATION
- Yoshio Motowaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Prevention of dripping of material for material injection
- Patent number 11,969,828
- Issue date Apr 30, 2024
- International Business Machines Corporation
- Toyohiro Aoki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Welding devices and welding, installation and debugging methods the...
- Patent number 11,969,829
- Issue date Apr 30, 2024
- QUICK INTELLIGENT EQUIPMENT CO., LTD.
- Fuke Qin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Moving unit for moving two soldering assemblies for processing circ...
- Patent number 11,964,345
- Issue date Apr 23, 2024
- ERSA GmbH
- Markus Sendelbach
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Vacuum-assisted BGA joint formation
- Patent number 11,963,307
- Issue date Apr 16, 2024
- International Business Machines Corporation
- Matthew Doyle
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Brazing material application method and manufacturing method of met...
- Patent number 11,945,052
- Issue date Apr 2, 2024
- Harima Chemicals, Inc.
- Aoi Tazuru
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Varied ball ball-grid-array (BGA) packages
- Patent number 11,916,003
- Issue date Feb 27, 2024
- Intel Corporation
- Xiao Lu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microwave heating method, microwave heating apparatus, and chemical...
- Patent number 11,883,789
- Issue date Jan 30, 2024
- National Institute of Advanced Industrial Science and Technology
- Yuichi Watanabe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
IR non-contact temperature sensing in a dispenser
- Patent number 11,858,070
- Issue date Jan 2, 2024
- Illinois Tool Works Inc.
- Thomas C. Prentice
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flux tool using elastic pad
- Patent number 11,850,683
- Issue date Dec 26, 2023
- S.S.P. INC.
- Kyouho Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wave solder pallets for optimal solder flow and methods of manufact...
- Patent number 11,850,684
- Issue date Dec 26, 2023
- Flex Ltd.
- Zohair Mehkri
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Micro solder joint and stencil aperture design
- Patent number 11,839,031
- Issue date Dec 5, 2023
- Western Digital Technologies, Inc.
- John Patrick Burke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for attaching semiconductor parts
- Patent number 11,823,920
- Issue date Nov 21, 2023
- JMJ KOREA CO., LTD.
- Yun Hwa Choi
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Creating a standoff for a low-profile component without adding a pr...
- Patent number 11,812,562
- Issue date Nov 7, 2023
- International Business Machines Corporation
- Phillip Isaacs
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reliable transportation mechanism for micro solder balls
- Patent number 11,780,022
- Issue date Oct 10, 2023
- Western Digital Technologies, Inc.
- Yusuke Matsumoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
STORAGE AND FEEDING ASSEMBLY FOR A WELDING WIRE FOR A WELDING OR BR...
- Publication number 20250100058
- Publication date Mar 27, 2025
- SAFRA S.P.A.
- Andrea LOMBARDI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BALL MOUNTING APPARATUS WITH BALL ATTACH VOLUME CONTROL
- Publication number 20250096189
- Publication date Mar 20, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Chen Chao
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER JETTING HEAD CAPABLE OF REDUCING SOLDER PASTE ACCUMULATION,...
- Publication number 20250091150
- Publication date Mar 20, 2025
- Kulicke and Soffa Hi-Tech Co., Ltd.
- Lu-Min Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER JETTING HEAD CAPABLE OF ABSORBING IMPACT, AND RELATED SYSTEM...
- Publication number 20250091149
- Publication date Mar 20, 2025
- Kulicke and Soffa Hi-Tech Co., Ltd.
- Lu-Min Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR WAFER AND METHOD OF BALL DROP ON THIN WAFER WITH EDGE...
- Publication number 20250062263
- Publication date Feb 20, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. SEDDON
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SELF CORRECTING OVEN TECHNOLOGY
- Publication number 20250033131
- Publication date Jan 30, 2025
- Jabil Inc.
- Charles Santhakumar
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SINGLE-HEAD TIN BALL IMPLANTATION SPRAY HEAD
- Publication number 20250018491
- Publication date Jan 16, 2025
- DONGGUAN D-TEK TECHNOLOGY CO., LTD.
- Houyong LUO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER SUPPLY UNIT, SOLDER PIECE MANUFACTURING DEVICE, PART MOUNTIN...
- Publication number 20240383061
- Publication date Nov 21, 2024
- HIRATA CORPORATION
- Toshiomi IKEDA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BRAZING SYSTEM AND BRAZING METHOD
- Publication number 20240367249
- Publication date Nov 7, 2024
- LS ELECTRIC CO., LTD.
- Ki Jeong KWON
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
RADIANT CURTAIN HEATING ASSEMBLY FOR WAVE SOLDERING MACHINE
- Publication number 20240246162
- Publication date Jul 25, 2024
- Illinois Tool Works Inc.
- Jonathan M. Dautenhahn
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
REPAIR OF SOLDER BUMPS
- Publication number 20240222302
- Publication date Jul 4, 2024
- ORBOTECH LTD.
- Zvi KOTLER
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER PRINTING APPARATUS
- Publication number 20240217014
- Publication date Jul 4, 2024
- Samsung Electronics Co., Ltd.
- Seongchan HAN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEALED SQUEEGEE FOR SUPPLYING SOLDER PASTE WITH UNIFORM DENSITY
- Publication number 20240217013
- Publication date Jul 4, 2024
- ESE Co., LTD.
- Hyung Rae KO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BALL ATTACHMENT APPARATUS
- Publication number 20240207961
- Publication date Jun 27, 2024
- Samsung Electronics Co., Ltd.
- Youngja KIM
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER BALL SUPPLY DEVICE AND SOLDER BALL SUPPLY METHOD
- Publication number 20240165727
- Publication date May 23, 2024
- FUJI CORPORATION
- Yuji KAWASAKI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
VARIED BALL BALL-GRID-ARRAY (BGA) PACKAGES
- Publication number 20240162134
- Publication date May 16, 2024
- Intel Corporation
- Xiao LU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
QUALITY DETERMINATION DEVICE AND QUALITY DETERMINATION METHOD
- Publication number 20240149363
- Publication date May 9, 2024
- FUJI CORPORATION
- Seijiro HAGI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Laser-Assisted Soldering Apparatus
- Publication number 20240109144
- Publication date Apr 4, 2024
- Pac Tech - Packaging Technologies GmbH
- Matthias Fettke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ADDITIVELY DEPOSITING BRAZE MATERIAL
- Publication number 20240082940
- Publication date Mar 14, 2024
- Pratt & Whitney Canada Corp.
- Charles Trent Daulton
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER BALL ATTACHING APPARATUS
- Publication number 20240071983
- Publication date Feb 29, 2024
- Samsung Electronics Co., Ltd.
- Bongken YU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ASSEMBLY DEVICE OF SEAL
- Publication number 20240058908
- Publication date Feb 22, 2024
- Illinois Tool Works Inc.
- Zhixue Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICRO SOLDER JOINT AND STENCIL APERTURE DESIGN
- Publication number 20240057261
- Publication date Feb 15, 2024
- Western Digital Technologies, Inc.
- John Patrick Burke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR DETERMINING THE WAVE HEIGHT OF A SOLDERING WAVE, DEVICE...
- Publication number 20240033841
- Publication date Feb 1, 2024
- Florian Völker
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAD ASSEMBLY FOR MOUNTING CONDUCTIVE BALL
- Publication number 20240009747
- Publication date Jan 11, 2024
- PROTEC CO., LTD.
- Youn Sung Ko
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WELDING DEVICES AND WELDING, INSTALLATION AND DEBUGGING METHODS THE...
- Publication number 20230415254
- Publication date Dec 28, 2023
- QUICK INTELLIGENT EQUIPMENT CO., LTD.
- Fuke QIN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIQUID METAL (LM) DISPENSING APPARATUS AND METHODS FOR DESIGN AND O...
- Publication number 20230415253
- Publication date Dec 28, 2023
- Intel Corporation
- Sangeon Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER PASTE BEAD RECOVERY SYSTEM AND METHOD
- Publication number 20230390847
- Publication date Dec 7, 2023
- Illinois Tool Works Inc.
- William A. Losiewicz
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
JET SOLDERING APPARATUS
- Publication number 20230390846
- Publication date Dec 7, 2023
- SENJU METAL INDUSTRY CO., LTD.
- Hirokazu ICHIKAWA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICRO SOLDER JOINT AND STENCIL APERTURE DESIGN
- Publication number 20230328892
- Publication date Oct 12, 2023
- Western Digital Technologies, Inc.
- John Patrick Burke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF ATTACHING A CONNECTOR TO A GLAZING
- Publication number 20230303433
- Publication date Sep 28, 2023
- Carlex Glass America, LLC
- Jacob Daniel RIGELMAN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Solder feeding devices Solder melting pans

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Coating device and component mounting machine

Sliding device for supplying or removing a sliding process material...

Solder paste bead recovery system and method

Synchronous motion selective soldering apparatus and method

Systems and methods for high strength titanium rod additive manufac...

Nozzle

Squeegee blade holder with secondary blade mounting apparatus

Semiconductor wafer and method of ball drop on thin wafer with edge...

Dual-type solder ball placement system

Stencil device and method for stencil printing of brazing material...

Applied force determination and control in joining process

Soldering systems having a nozzle exchange unit including a nitroge...

Method of applying solid brazing material, method of producing coat...

Solder supply unit, solder piece manufacturing device, part mountin...

Wire bonding apparatus

Robot apparatus for soldering

Prevention of dripping of material for material injection

Welding devices and welding, installation and debugging methods the...

Moving unit for moving two soldering assemblies for processing circ...

Vacuum-assisted BGA joint formation

Brazing material application method and manufacturing method of met...

Varied ball ball-grid-array (BGA) packages

Microwave heating method, microwave heating apparatus, and chemical...

IR non-contact temperature sensing in a dispenser

Flux tool using elastic pad

Wave solder pallets for optimal solder flow and methods of manufact...

Micro solder joint and stencil aperture design

Apparatus for attaching semiconductor parts

Creating a standoff for a low-profile component without adding a pr...

Reliable transportation mechanism for micro solder balls

Patents Applicationslast 30 patents

STORAGE AND FEEDING ASSEMBLY FOR A WELDING WIRE FOR A WELDING OR BR...

BALL MOUNTING APPARATUS WITH BALL ATTACH VOLUME CONTROL

SOLDER JETTING HEAD CAPABLE OF REDUCING SOLDER PASTE ACCUMULATION,...

SOLDER JETTING HEAD CAPABLE OF ABSORBING IMPACT, AND RELATED SYSTEM...

SEMICONDUCTOR WAFER AND METHOD OF BALL DROP ON THIN WAFER WITH EDGE...

SELF CORRECTING OVEN TECHNOLOGY

SINGLE-HEAD TIN BALL IMPLANTATION SPRAY HEAD

SOLDER SUPPLY UNIT, SOLDER PIECE MANUFACTURING DEVICE, PART MOUNTIN...

BRAZING SYSTEM AND BRAZING METHOD

RADIANT CURTAIN HEATING ASSEMBLY FOR WAVE SOLDERING MACHINE

REPAIR OF SOLDER BUMPS

SOLDER PRINTING APPARATUS

SEALED SQUEEGEE FOR SUPPLYING SOLDER PASTE WITH UNIFORM DENSITY

BALL ATTACHMENT APPARATUS

SOLDER BALL SUPPLY DEVICE AND SOLDER BALL SUPPLY METHOD

VARIED BALL BALL-GRID-ARRAY (BGA) PACKAGES

QUALITY DETERMINATION DEVICE AND QUALITY DETERMINATION METHOD

Laser-Assisted Soldering Apparatus

ADDITIVELY DEPOSITING BRAZE MATERIAL

SOLDER BALL ATTACHING APPARATUS

ASSEMBLY DEVICE OF SEAL

MICRO SOLDER JOINT AND STENCIL APERTURE DESIGN

METHOD FOR DETERMINING THE WAVE HEIGHT OF A SOLDERING WAVE, DEVICE...

HEAD ASSEMBLY FOR MOUNTING CONDUCTIVE BALL

WELDING DEVICES AND WELDING, INSTALLATION AND DEBUGGING METHODS THE...

LIQUID METAL (LM) DISPENSING APPARATUS AND METHODS FOR DESIGN AND O...

SOLDER PASTE BEAD RECOVERY SYSTEM AND METHOD

JET SOLDERING APPARATUS

MICRO SOLDER JOINT AND STENCIL APERTURE DESIGN

METHOD OF ATTACHING A CONNECTOR TO A GLAZING