Work bonding and supporting method and work bonding and supporting apparatus using the same

Abstract

Tape heating means is allowed to come close to an adhesive tape for support and, in a heating state, the adhesive tape for support is stretched and tensioned with proper tension in a tape width direction and a transport direction. A heated work is bonded to an adhesive face of the tensioned adhesive tape for support, thereby supporting the work.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

For the purpose of illustrating the invention, there are shown in the drawings several forms which are presently preferred, it being understood, however, that the invention is not limited to the precise arrangement and instrumentalities shown.

FIG. 1 is a cutaway perspective view showing a general configuration of a semiconductor wafer mounter;

FIG. 2 is a plan view showing a ring frame transport mechanism and a tape tension mechanism;

FIG. 3 is a front view showing the ring frame transport mechanism;

FIG. 4 is a front view showing the tape tension mechanism;

FIG. 5 is a front view showing a tape cutting mechanism;

FIG. 6 is a plan view showing the tape cutting mechanism;

FIG. 7 is a schematic front view showing a process of heating an adhesive tape for support;

FIG. 8 is a schematic front view showing a process of tensing the adhesive tape for support;

FIG. 9 is a schematic front view showing a process of bonding the adhesive tape for support;

FIG. 10 is a schematic front view showing a process of cutting the bonded adhesive tape for support;

FIG. 11 is a schematic front view showing a work bonding process; and

FIG. 12 is a perspective view showing a ring frame and a work.

Claims

1. A work bonding and supporting method for bonding a work to an adhesive tape for support to support the work, comprising the steps of: heating an adhesive tape for support by tape heating means while tensioning the adhesive tape for support by tape tensioning means; andbonding a work to an adhesive face of the heated and tensioned adhesive tape for support by work bonding means to thereby support the work.

2. The work bonding and supporting method according to claim 1, further comprising the steps of: bonding the heated and tensioned adhesive tape for support to a ring frame by tape bonding means; andbonding the heated work to the adhesive face of the adhesive tape for support bonded to the ring frame by the work bonding means.

3. The work bonding and supporting method according to claim 1, wherein the work is a semiconductor wafer having, on its back side, an adhesive layer to be mounted on a board.

4. A work bonding and supporting apparatus for bonding a work to an adhesive tape for support to support the work, comprising: a ring frame transport mechanism for carrying a ring frame in a tape bonding position;tape supplying means for supplying a continuous adhesive tape for support to the tape bonding position in a posture that an adhesive face of the adhesive tape for support faces the back side of the ring frame;tape tensioning means for stretching the adhesive tape for support supplied to the tape bonding position by holding at least one or both of facing sides in the width direction of the adhesive tape for support and front and rear sides in the supply direction of the adhesive tape for support;tape heating means for heating the adhesive tape for support supplied to the tape bonding position;tape bonding means for pressing the adhesive tape for support against the back side of the ring frame;a tape cutting mechanism for cutting the adhesive tape for support bonded to the back side of the ring frame along the ring frame; andwork bonding means for supplying and bonding a work in a heated state to the adhesion face of the adhesive tape for support bonded to the ring frame.

5. The work bonding and supporting apparatus according to claim 4, wherein the tape heating means is a heat radiation plate facing in parallel with the adhesive tape for support in the tape bonding position.

6. The work bonding and supporting apparatus according to claim 5, wherein the tape cutting mechanism has a cutter traveling along a travel locus corresponding to the shape of the ring frame, and the heat radiation plate is provided on the inside of the travel locus.

7. The work bonding and supporting apparatus according to claim 4, wherein the tape heating means is a nozzle for spraying warm air to the adhesive tape for support in the tape bonding position.

8. The work bonding and supporting apparatus according to claim 4, wherein the work bonding means comprises: a chuck table having therein a heater and vacuum-holding the surface of a work;a holding mechanism for holding a ring frame;a driving mechanism for moving a work to a tape bonding position by making the chuck table and the holding mechanism come close to each other; anda bonding roller that rolls while pressing the adhesive tape from the back side of the ring frame in the tape bonding position to bond the adhesive tape to the work.

9. The work bonding and supporting apparatus according to claim 4, wherein the tape bonding means is a press roller which rolls along the back side of the ring frame.

10. The work bonding and supporting apparatus according to claim 9, wherein a plurality of press rollers as the tape bonding means are disposed at predetermined intervals along an adhesion face of the ring frame, a cutter in the tape cutting mechanism is disposed on the same travel locus as that of the press rollers,the apparatus further comprisesa roller moving mechanism for moving the press roller between a tape bonding position and a standby position apart from the ring frame, andcutter moving means for moving the cutter between a tape cutting position and a standby position apart from the ring frame,both of the roller moving mechanism and the cutter moving means are driven to bond the adhesive tape to the ring frame by the press roller, return the press roller to the standby position, after that, move the cutter to the tape cutting position to cut the adhesive tape.

11. The work bonding and supporting apparatus according to claim 9, wherein a plurality of press rollers as the tape bonding mechanism are disposed at predetermined intervals along an adhesion face of the ring frame, a cutter in the tape cutting mechanism is disposed on the same travel locus as that of the press rollers,the apparatus further comprisesa roller moving mechanism for moving the press roller between a tape bonding position and a standby position apart from the ring frame, andcutter moving means for moving the cutter between a tape cutting position and a standby position apart from the ring frame, andboth of the roller moving mechanism and the cutter moving means are driven so as to cut a bonded adhesive tape by the cutter while bonding the adhesive tape to the ring frame by the press roller.