Zinc-copper alloy electroplating baths

Abstract

The present invention relates to additives for electroplating baths used for the electrodeposition of zinc-copper alloys, and particularly to such alloys designed to be used as undercoats for subsequently applied metal coatings. The improvement comprises additives for incorporation into conventional zinc-copper electrolytes, comprising a mixture of a buffering agent selected from the group consisting of boric acid, alkali metal borates, alkali metal carbonates, alkali metal phosphates and glycine, a metal ion selected from the group consisting of nickel ion and cobalt ion, and ethylenediaminetetra acetic acid (as the alkali metal salt).

Description

The present invention relates to the electrodeposition of zinc-copper alloys. More particularly, it relates to additives for use in electroplating baths used for the electrodeposition of zinc-copper alloys.

Electrodeposited zinc-copper alloys are useful for numerous purposes, one particularly important use being as an undercoat on which other metals are likewise applied by electrodeposition. When used for such purpose it is particularly important that the electrodeposited coating of zinc-copper alloy be smooth, fine-grained, reflective and uniform in appearance as well in other physical properties even when applied over a wide current density range. If otherwise, the metal coating applied over the zinc-copper alloy will generally be defective and it may be necessary either to discard or else rework the coated article. This is particularly the case where the zinc-copper alloy coating is coarse grained, since the latter will generally show through the subsequent coating. Many efforts have been made to overcome such defects of previous zinc-copper electroplating processes but without too much success.

It has now been discovered in accordance with the present invention that by incorporating certain additives into the conventional zinc-copper electroplating baths, comprising essentially zinc cyanide, copper cyanide, alkali metal cyanide and alkali metal hydroxide, that zinc-copper alloys can be formed by electrodeposition having the above desired properties under operating conditions requiring less supervision and with fewer rejects than has been the case with prior art methods. The additive composition which gives such improved results comprises essentially a mixture of a buffering agent effective in the electroplating bath within the 10 - 13 pH range and selected from the group consisting of boric acid, alkali metal borates, alkali metal phosphates, alkali metal carbonates and glycine; nickel or cobalt ion, preferably in the form of the metal complex; and a soluble salt of ethylenediaminetetra acetic acid, the latter appearing to serve both as a brightening agent and as a complexing agent for the nickel or cobalt.

The plating baths in which the above additive composition has been found to be particularly effective have the following general composition:

Zinc cyanide 13.5 - 40.4 gm/lCopper cyanide 10.6 - 31.7 "Sodium cyanide (free) 30.0 - 52.5 "Sodium hydroxide 15.0 - 45.0 "

The above bath gives a zinc-copper alloy upon electrodeposition having the composition: 70 - 30% zinc to 30 - 70% copper. A preferred composition for subsequent electrodeposition of metal has been found to be of the order of 50 - 45% zinc to 50 - 55% copper.

The additive composition of the present invention used in the above plating bath has the following preferred composition:Boric acid, or alkali metal borate 0.010 - 40.0 gm/lNickel or cobalt metal (in form of nickel or cobalt complex) 0.001 - 0.025 "

For the boric acid or alkali metal borate it has been found that the following can be substituted:

Alkali metal phosphate 0.1 - 20.0 gm/lGlycine 1.0 - 15.0 "Alkali metal carbonate 1.0 - 75.0 "

It has further been found that the above additive may be improved somewhat by incorporating in the above additive composition 0.01 - 2.0 gm/l of ethylenediaminetetra acetic acid (preferably in the form of its alkali metal salt), which acts both as a brightening agent and as a complexing agent for the nickel or cobalt.

The following specific examples are given to illustrate the effect of the individual ingredients of the additive composition of the present invention, as well as how the ingredients of the plating bath may be varied and still obtain the improved results of the instant invention. It is understood also that the composition of the plating bath may be varied in any conventional manner without departing from the scope of the present invention so long as the plating conditions are maintained substantially as described herein.

In each of the first eleven examples the Hull Cell was used, employing an alloy anode containing 52% zinc and 48% copper, and mild air agitation of the anode during the plating operation. Zinc-coated 3 .times. 5 inches steel plates were processed through the following cycle, the plating temperature being maintained at 72.degree. - 80.degree.F:

1. 50% HCl strip - 1 minute2. Rinse3. Electro-clean (reverse) - 1 minute4. Acid dip (10% sulfuric)5. Rinse6. Copper strike7. Rinse8. Brass plate9. Rinse10. Hot water rinse11. Dry12. Evaluate

EXAMPLE I

Zinc cyanide 25.5 gm/lCopper cyanide 22.5 "Sodium cyanide 64.5 "Sodium hydroxide 33.8 " Additive None

The resulting deposit was dull to semi-bright at current densities of 5 - 100 amperes/ft.sup.2 and was regarded as unsatisfactory for subsequent plating.

EXAMPLE IIZinc cyanide 25.5 gm/lCopper cyanide 22.5 "Sodium cyanide 64.5 "Sodium hydroxide 33.8 " Additive: Boric acid 15.0 "

The resulting deposit was semi-bright and reflective at current densities of 5 - 70 amperes/ft.sup.2 and showed a decided improvement over the use of no additive but still was not satisfactory for subsequent plating.

EXAMPLE IIIZinc cyanide 25.5 gm/lCopper cyanide 22.5 "Sodium cyanide 64.5 "Sodium hydroxide 33.8 " Additive: Nickel ion (as complex) 0.005 " Ethylenediaminetetra acetic acid (as Na salt) 0.05 "

The resulting deposit was bright at current densities of 5 - 40 amperes/ft.sup.2 and dull over the remainder of the current density range but still not satisfactory for subsequent plating.

EXAMPLE IV

Zinc cyanide 25.5 gm/lCopper cyanide 22.5 "Sodium cyanide 64.5 "Sodium hydroxide 33.8 " Additive: Boric acid 15.0 " Nickel ion (as complex) 0.005 " Ethylenediaminetetra acetic acid (as Na salt) 0.05 "

The resulting deposit was smooth, bright and uniform and generally excellent over the current density of 5 - 80 amperes/ft.sup.2 and made an excellent undercoat for subsequent plating.

EXAMPLE V

Zinc cyanide 25.5 gm/lCopper cyanide 22.5 "Sodium cyanide 64.5 "Sodium hydroxide 33.8 " Additive: Sodium carbonate 30.0 " Boric acid 15.0 " Nickel ion (as complex) 0.005 " Ethylenediaminetetra acetic acid (as Na salt) 0.05 "

The resulting deposit was smooth, bright and uniform and generally excellent over the current density range of 5 - 100 amperes/ft.sup.2.

The following examples show the results obtained with buffering agents other than the boric acid used in the preceding examples.

EXAMPLE VI

Zinc cyanide 25.5 gm/l Copper cyanide 22.5 " Sodium cyanide 64.5 " Sodium hydroxide 33.8 " Additive: Sodium phosphate 5.0 "

The resulting deposit was semi-bright, smooth and reflective at current densities of 5 - 70 amperes/ft.sup.2.

EXAMPLE VII

Zinc cyanide 25.5 gm/lCopper cyanide 22.5 "Sodium cyanide 64.5 "Sodium hydroxide 33.8 " Additive: Sodium phosphate 5.0 " Nickel ion (as complex) 0.005 " Ethylenediaminetetra acetic acid (as Na salt) 0.05 "

The resulting deposit was bright at 5 - 50 amperes/ft.sup.2 current density, semi-bright at 50 - 100 amperes/ft.sup.2 and smooth and reflective throughout the current density range.

EXAMPLE VIII

Zinc cyanide 25.5 gm/l Copper cyanide 22.5 " Sodium cyanide 64.5 " Sodium hydroxide 33.8 " Additive: Glycine 10.0 "

The resulting deposit was dull at current densities of 5 - 10 amperes/ft.sup.2, semi-bright and reflective at 10 - 40 amperes/ft.sup.2, and dull in the range 40 - 100 amperes/ft.sup.2.

EXAMPLE IX

Zinc cyanide 25.5 gm/lCopper cyanide 22.5 "Sodium cyanide 64.5 "Sodium hydroxide 33.8 " Additive: Glycine 10.0 " Nickel ion (as complex) 0.005 " Ethylenediaminetetra acetic acid (as Na salt) 0.05 "

The resulting deposit was dull at current densities of 5 - 10 amperes/ft.sup.2, semi-bright, smooth and reflective at 10 - 60 amperes/ft.sup.2 and dull at 60 - 100 amperes/ft.sup.2.

EXAMPLE X

Zinc cyanide 25.5 gm/lCopper cyanide 22.5 "Sodium cyanide 64.5 "Sodium hydroxide 33.8 " Additive: Boric acid 15.0 " Cobalt ion (as complex) 0.005 " Ethylenediaminetetra acetic acid (as Na salt) 0.05 "

The resulting deposit was bright, uniform and smooth at current densities of 5 - 80 amperes/ft.sup.2.

EXAMPLE XI

Zinc cyanide 25.5 gm/l Copper cyanide 22.5 " Sodium cyanide 64.5 " Sodium hydroxide 33.8 " Additive: Sodium carbonate 30.0 "

The resulting deposit was bright to semi-bright at 5 - 30 amperes/ft.sup.2 current density and dull throughout the remainder of the current density range. (Compare with Example V).

In the following examples the proportions of the constituents of the plating baths as well as those of the additive compositions were varied. In each instance excellent deposits of zinc-copper alloy were obtained over a wide range of current density.

EXAMPLE XII

Zinc cyanide 22.9 gm/lCopper cyanide 29.6 "Sodium cyanide (Free) 45.0 "Sodium hydroxide 30.0 " Additive: Boric acid 0.15 " Nickel ion (as complex) 0.005 " Ethylenediaminetetra acetic acid (as Na salt) 0.05 "

EXAMPLE XIII

Zinc cyanide 22.9 gm/lCopper cyanide 21.1 "Sodium cyanide (Free) 45.0 "Sodium hydroxide 33.8 " Additive: Boric acid 0.5 " Nickel ion (as complex) 0.01 " Ethylenediaminetetra acetic acid (as Na salt) 0.05 "

EXAMPLE XIV

Zinc cyanide 22.9 gm/lCopper cyanide 20.1 "Sodium cyanide (Free) 41.3 "Sodium hydroxide 28.1 " Additive: Boric acid 0.10 " Nickel ion (as complex) 0.005 " Ethylenediaminetetra acetic acid (as Na salt) 0.075 "

EXAMPLE XV

Zinc cyanide 18.9 gm/lCopper cyanide 19.0 "Sodium cyanide (Free) 39.8 "Sodium hydroxide 30.0 " Additive: Boric acid 0.2 " Nickel ion (as complex) 0.002 " Ethylenediaminetetra acetic acid (as Na salt) 0.1 "

EXAMPLE XVI

Zinc cyanide 33.7 gm/lCopper cyanide 26.4 "Sodium cyanide (Free) 58.8 "Sodium hydroxide 33.8 " Additive: Boric acid 0.15 " Nickel ion (as complex) 0.005 " Ethylenediaminetetra acetic acid (as Na salt) 0.25 "

It is understood, of course, that where the sodium compound is specified that equivalent amounts of potassium metal compounds may be satisfactorily substituted.

The nickel is usually employed in the form of a nickel complex with the ethylenediaminetetra acetic acid, a nickel salt being added to an aqueous solution of the latter, although other conventional nickel complexing agents may be satisfactorily used instead.

Claims

1. An aqueous electroplating bath for the production of zinc-copper alloys by electrodeposition which comprises 13.5 - 40.4 gm/l zinc cyanide, 10.6 - 31.7 gm/l copper cyanide, 30.0 - 52.5 gm/l sodium cyanide (Free), 15 - 45 gm/l sodium hydroxide, 0.01 - 40.0 gm/l boric acid, 0.001 - 0.025 gm/l nickel ion and 0.01 - 2.0 gm/l of ethylenediaminetetra acetic acid (as alkali metal salt).

2. The plating bath of claim 1 further including 1.0 to 75.0 gm/l of alkali metal carbonate.

3. An aqueous electroplating bath for the production of zinc-copper alloys by electrodeposition which comprises 13.5 to 40.4 gm/l zinc cyanide, 10.6 to 31.7 gm/l copper cyanide, 30.0 to 52.5 gm/l sodium cyanide (free) and 15 to 45 gm/l sodium hydroxide having dissolved therein a mixture of additives comprising:

a. an effective amount of at least one buffering agent selected from the group consisting of boric acid, alkali metal borate, alkali metal phosphate, alkali metal carbonate, glycine and mixtures thereof;

b. about 0.001 to about 0.025 gm./l of at least one metallic ionic material selected from the group consisting of nickel ion and cobalt ion and mixtures thereof; and

c. about 0.01 to about 2.0 gm./l of ethylenediaminetetra acetic acid (as alkali metal salt).

4. The aqueous electroplating bath of claim 3 wherein said buffering agent is boric acid which is present in an amount ranging from about 0.010 to about 40.0 gm/l.

5. The aqueous electroplating bath of claim 3 wherein said buffering agent is an alkali metal borate which is present in an amount ranging from about 0.010 to about 40.0 gm/l.

6. The aqueous electroplating bath of claim 3 wherein said buffering agent is an alkali metal phosphate which is present in an amount ranging from about 0.1 to about 20.0 gm/l.

7. The aqueous electroplating bath of claim 3 wherein said buffering agent is glycine which is present in an amount ranging from about 1.0 to about 15.0 gm/l.

8. The aqueous electroplating bath of claim 3 wherein said buffering agent is an alkali metal carbonate which is present in an amount ranging from about 1.0 to about 75.0 gm/l.