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Patents Grantslast 30 patents

Information Patent Grant
Resonant power converter
- Patent number 11,594,972
- Issue date Feb 28, 2023
- 3D Plus
- Cédric Colonna
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Process for producing a high-frequency-compatible electronic module
- Patent number 11,587,911
- Issue date Feb 21, 2023
- 3D Plus
- Christian Val
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for burning in electronic components
- Patent number 11,067,621
- Issue date Jul 20, 2021
- 3D Plus
- Mohamed Boussadia
- G01 - MEASURING TESTING
Information Patent Grant
High frequency DC voltage converter of the quasi-resonant buck type
- Patent number 10,727,748
- Issue date Jul 28, 2020
- 3D Plus
- Patrick Dubus
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
3D imaging optoelectronic module
- Patent number 10,466,097
- Issue date Nov 5, 2019
- 3D Plus
- Didier Gambart
- G01 - MEASURING TESTING
Information Patent Grant
Method of miniaturized chip on chip interconnection of a 3D electro...
- Patent number 10,332,863
- Issue date Jun 25, 2019
- 3D Plus
- Christian Val
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D electronic module comprising a ball grid array stack
- Patent number 10,064,278
- Issue date Aug 28, 2018
- 3D Plus
- Christian Val
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of collective fabrication of 3D electronic modules configure...
- Patent number 9,899,250
- Issue date Feb 20, 2018
- 3D Plus
- Christian Val
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for manufacturing a 3D electronic module comprising externa...
- Patent number 9,659,846
- Issue date May 23, 2017
- 3D Plus
- Alexandre Val
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing reconstituted wafers with support of the chips...
- Patent number 9,111,688
- Issue date Aug 18, 2015
- 3D Plus
- Christian Val
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Method for positioning chips during the production of a reconstitut...
- Patent number 8,735,220
- Issue date May 27, 2014
- 3D Plus
- Christian Val
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for collective fabrication of 3D electronic modules comprisi...
- Patent number 8,716,036
- Issue date May 6, 2014
- 3D Plus
- Christian Val
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for the vertical interconnection of 3D electronic modules b...
- Patent number 8,567,051
- Issue date Oct 29, 2013
- 3D Plus
- Christian Val
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for positioning chips during the production of a reconstitut...
- Patent number 8,546,190
- Issue date Oct 1, 2013
- 3D Plus
- Christian Val
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for the wafer-scale fabrication of electronic modules for s...
- Patent number 8,359,740
- Issue date Jan 29, 2013
- 3D Plus
- Christian Val
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
3D electronic module
- Patent number 8,264,853
- Issue date Sep 11, 2012
- 3D Plus
- Christian Val
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low-thickness electronic module comprising a stack of electronic pa...
- Patent number 8,243,468
- Issue date Aug 14, 2012
- 3D Plus
- Christian Val
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of interconnecting electronic wafers
- Patent number 8,136,237
- Issue date Mar 20, 2012
- 3D Plus
- Christian Val
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Process for the collective fabrication of 3D electronic modules
- Patent number 7,951,649
- Issue date May 31, 2011
- 3D Plus
- Christian Val
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Process for the collective fabrication of 3D electronic modules
- Patent number 7,877,874
- Issue date Feb 1, 2011
- 3D Plus
- Christian Val
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for the interconnection of active and passive components and...
- Patent number 7,635,639
- Issue date Dec 22, 2009
- 3D Plus
- Christian Val
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with integrated heat distributor
- Patent number 7,476,965
- Issue date Jan 13, 2009
- 3D Plus
- Christian Val
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device for interconnecting, in three dimensions, electronic components
- Patent number 6,809,367
- Issue date Oct 26, 2004
- 3D Plus
- Christian Val
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Three dimensional interconnection method and electronic device obta...
- Patent number 6,716,672
- Issue date Apr 6, 2004
- 3D Plus
- Christian Val
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INNOVATIVE PLANAR ELECTROMAGNETIC COMPONENT STRUCTURE
- Publication number 20230130364
- Publication date Apr 27, 2023
- 3D PLUS
- Cédric COLONNA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESONANT POWER CONVERTER
- Publication number 20210391801
- Publication date Dec 16, 2021
- 3D PLUS
- Cédric COLONNA
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
PROCESS FOR PRODUCING A HIGH-FREQUENCY-COMPATIBLE ELECTRONIC MODULE
- Publication number 20210335755
- Publication date Oct 28, 2021
- 3D PLUS
- Christian Val
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR METALLIZING HOLES OF AN ELECTRONIC MODULE BY LIQUID-PHA...
- Publication number 20210040620
- Publication date Feb 11, 2021
- 3D PLUS
- Christian VAL
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
APPARATUS FOR BURNING IN ELECTRONIC COMPONENTS
- Publication number 20200003826
- Publication date Jan 2, 2020
- 3D PLUS
- Mohamed BOUSSADIA
- G01 - MEASURING TESTING
Information Patent Application
HIGH FREQUENCY DC VOLTAGE CONVERTER OF THE QUASI-RESONANT BUCK TYPE
- Publication number 20190356228
- Publication date Nov 21, 2019
- 3D PLUS
- Patrick DUBUS
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
METHOD OF MINIATURIZED CHIP ON CHIP INTERCONNECTION OF A 3D ELECTRO...
- Publication number 20190103380
- Publication date Apr 4, 2019
- 3D PLUS
- Christian Val
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D IMAGING OPTOELECTRONIC MODULE
- Publication number 20180172504
- Publication date Jun 21, 2018
- 3D PLUS
- Didier GAMBART
- G01 - MEASURING TESTING
Information Patent Application
ELECTRONIC CHIP DEVICE WITH IMPROVED THERMAL RESISTANCE AND ASSOCIA...
- Publication number 20180061731
- Publication date Mar 1, 2018
- 3D PLUS
- Christian VAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF COLLECTIVE FABRICATION OF 3D ELECTRONIC MODULES CONFIGURE...
- Publication number 20170372935
- Publication date Dec 28, 2017
- 3D PLUS
- Christian VAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D ELECTRONIC MODULE COMPRISING A BALL GRID ARRAY STACK
- Publication number 20160381799
- Publication date Dec 29, 2016
- 3D PLUS
- Christian Val
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESS FOR MANUFACTURING A 3D ELECTRONIC MODULE COMPRISING EXTERNA...
- Publication number 20160247750
- Publication date Aug 25, 2016
- 3D PLUS
- Alexandre VAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING RECONSTITUTED WAFERS WITH SUPPORT OF THE CHIPS...
- Publication number 20140349008
- Publication date Nov 27, 2014
- 3D PLUS
- Christian Val
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
Process For Flip-Chip Connection of an Electronic Component
- Publication number 20130344654
- Publication date Dec 26, 2013
- 3D PLUS
- Olivier Limousin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Collective Fabrication of 3D Electronic Modules Comprisi...
- Publication number 20130171752
- Publication date Jul 4, 2013
- 3D PLUS
- Christian Val
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Positioning Chips During the Production of a Reconstitut...
- Publication number 20120094439
- Publication date Apr 19, 2012
- 3D PLUS
- Christian Val
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR POSITIONING CHIPS DURING THE PRODUCTION OF A RECONSTITUT...
- Publication number 20110312132
- Publication date Dec 22, 2011
- 3D PLUS
- Christian Val
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR THE WAFER-SCALE FABRICATION OF ELECTRONIC MODULES FOR S...
- Publication number 20110247210
- Publication date Oct 13, 2011
- 3D PLUS
- Christian Val
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF INTERCONNECTING ELECTRONIC WAFERS
- Publication number 20100276081
- Publication date Nov 4, 2010
- 3D PLUS
- Christian Val
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR THE VERTICAL INTERCONNECTION OF 3D ELECTRONIC MODULES B...
- Publication number 20090260228
- Publication date Oct 22, 2009
- 3D Plus
- Christian Val
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR THE COLLECTIVE FABRICATION OF 3D ELECTRONIC MODULES
- Publication number 20090209052
- Publication date Aug 20, 2009
- 3D PLUS
- Christian Val
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D Electronic Module
- Publication number 20080316727
- Publication date Dec 25, 2008
- 3D Plus
- Christian Val
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Process for the Collective Fabrication of 3D Electronic Modules
- Publication number 20080289174
- Publication date Nov 27, 2008
- 3D PLUS
- Christian Val
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low-Thickness Electronic Module Comprising a Stack of Electronic Pa...
- Publication number 20080170374
- Publication date Jul 17, 2008
- 3D PLUS
- Christian Val
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Electronic Device with Integrated Heat Distributor
- Publication number 20070262443
- Publication date Nov 15, 2007
- 3D PLUS
- Christian Val
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for interconnecting active and passive components, and a res...
- Publication number 20070117369
- Publication date May 24, 2007
- 3D PLUS
- Christian Val
- H01 - BASIC ELECTRIC ELEMENTS

Trademarklast 30 trademarks

Information Trademark
79155548 - RTIMS
- Serial number 79155548
- Filing date Sep 18, 2014
- 3D PLUS
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
79039648 - WDOD
- Serial number 79039648
- Registration number 3449758
- Filing date Apr 5, 2007
- 3D PLUS SA
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments

Organization

Patents Grantslast 30 patents

Resonant power converter

Process for producing a high-frequency-compatible electronic module

Apparatus for burning in electronic components

High frequency DC voltage converter of the quasi-resonant buck type

3D imaging optoelectronic module

Method of miniaturized chip on chip interconnection of a 3D electro...

3D electronic module comprising a ball grid array stack

Method of collective fabrication of 3D electronic modules configure...

Process for manufacturing a 3D electronic module comprising externa...

Method for producing reconstituted wafers with support of the chips...

Method for positioning chips during the production of a reconstitut...

Method for collective fabrication of 3D electronic modules comprisi...

Process for the vertical interconnection of 3D electronic modules b...

Method for positioning chips during the production of a reconstitut...

Process for the wafer-scale fabrication of electronic modules for s...

3D electronic module

Low-thickness electronic module comprising a stack of electronic pa...

Method of interconnecting electronic wafers

Process for the collective fabrication of 3D electronic modules

Process for the collective fabrication of 3D electronic modules

Method for the interconnection of active and passive components and...

Electronic device with integrated heat distributor

Device for interconnecting, in three dimensions, electronic components

Three dimensional interconnection method and electronic device obta...

Patents Applicationslast 30 patents

INNOVATIVE PLANAR ELECTROMAGNETIC COMPONENT STRUCTURE

RESONANT POWER CONVERTER

PROCESS FOR PRODUCING A HIGH-FREQUENCY-COMPATIBLE ELECTRONIC MODULE

PROCESS FOR METALLIZING HOLES OF AN ELECTRONIC MODULE BY LIQUID-PHA...

APPARATUS FOR BURNING IN ELECTRONIC COMPONENTS

HIGH FREQUENCY DC VOLTAGE CONVERTER OF THE QUASI-RESONANT BUCK TYPE

METHOD OF MINIATURIZED CHIP ON CHIP INTERCONNECTION OF A 3D ELECTRO...

3D IMAGING OPTOELECTRONIC MODULE

ELECTRONIC CHIP DEVICE WITH IMPROVED THERMAL RESISTANCE AND ASSOCIA...

METHOD OF COLLECTIVE FABRICATION OF 3D ELECTRONIC MODULES CONFIGURE...

3D ELECTRONIC MODULE COMPRISING A BALL GRID ARRAY STACK

PROCESS FOR MANUFACTURING A 3D ELECTRONIC MODULE COMPRISING EXTERNA...

METHOD FOR PRODUCING RECONSTITUTED WAFERS WITH SUPPORT OF THE CHIPS...

Process For Flip-Chip Connection of an Electronic Component

Method for Collective Fabrication of 3D Electronic Modules Comprisi...

Method for Positioning Chips During the Production of a Reconstitut...

METHOD FOR POSITIONING CHIPS DURING THE PRODUCTION OF A RECONSTITUT...

PROCESS FOR THE WAFER-SCALE FABRICATION OF ELECTRONIC MODULES FOR S...

METHOD OF INTERCONNECTING ELECTRONIC WAFERS

PROCESS FOR THE VERTICAL INTERCONNECTION OF 3D ELECTRONIC MODULES B...

PROCESS FOR THE COLLECTIVE FABRICATION OF 3D ELECTRONIC MODULES

3D Electronic Module

Process for the Collective Fabrication of 3D Electronic Modules

Low-Thickness Electronic Module Comprising a Stack of Electronic Pa...

Electronic Device with Integrated Heat Distributor

Method for interconnecting active and passive components, and a res...

Trademarklast 30 trademarks

79155548 - RTIMS

79039648 - WDOD