ADVANCE MATERIALS CORPORATION

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PITTSBURGH, PA, US

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Patents Grantslast 30 patents

Information Patent Grant
Fabrication method of packaging substrate
- Patent number 9,084,341
- Issue date Jul 14, 2015
- Advance Materials Corporation
- Lee-Sheng Yen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for making circuit board
- Patent number 8,987,060
- Issue date Mar 24, 2015
- Advance Materials Corporation
- Lee-Sheng Yen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board structure and package structure
- Patent number 8,836,108
- Issue date Sep 16, 2014
- Advance Materials Corporation
- Lee-Sheng Yen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for making circuit board
- Patent number 8,748,234
- Issue date Jun 10, 2014
- Advance Materials Corporation
- Lee-Sheng Yen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board structure and packaging structure comprising the circ...
- Patent number 8,742,567
- Issue date Jun 3, 2014
- Advance Materials Corporation
- Lee-Sheng Yen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaging substrate and fabrication method thereof
- Patent number 8,698,008
- Issue date Apr 15, 2014
- Advance Materials Corporation
- Lee-Sheng Yen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a package substrate
- Patent number 8,628,636
- Issue date Jan 14, 2014
- Advance Materials Corporation
- Lee-Sheng Yen
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Pad structure with a nano-structured coating film
- Patent number 8,102,063
- Issue date Jan 24, 2012
- Advance Materials Corporation
- Lee-Sheng Yen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Photothermosetting composition comprising acrylated epoxy resin
- Patent number 6,555,592
- Issue date Apr 29, 2003
- Advance Materials Corporation
- Chao-Hui Tseng
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
FABRICATION METHOD OF PACKAGING SUBSTRATE
- Publication number 20140174644
- Publication date Jun 26, 2014
- ADVANCE MATERIALS CORPORATION
- Lee-Sheng Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A PACKAGE SUBSTRATE
- Publication number 20130180651
- Publication date Jul 18, 2013
- ADVANCE MATERIALS CORPORATION
- Lee-Sheng Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATE AND FABRICATION METHOD THEREOF
- Publication number 20130146336
- Publication date Jun 13, 2013
- ADVANCE MATERIALS CORPORATION
- Lee-Sheng Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dielectric constant adjustable resin composition, prepreg and coppe...
- Publication number 20060093805
- Publication date May 4, 2006
- INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Chien-Ting Lin
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

ADVANCE MATERIALS CORPORATION

Organization

Patents Grantslast 30 patents

Fabrication method of packaging substrate

Method for making circuit board

Circuit board structure and package structure

Method for making circuit board

Circuit board structure and packaging structure comprising the circ...

Packaging substrate and fabrication method thereof

Method of manufacturing a package substrate

Pad structure with a nano-structured coating film

Photothermosetting composition comprising acrylated epoxy resin

Patents Applicationslast 30 patents

FABRICATION METHOD OF PACKAGING SUBSTRATE

METHOD OF MANUFACTURING A PACKAGE SUBSTRATE

PACKAGING SUBSTRATE AND FABRICATION METHOD THEREOF

Dielectric constant adjustable resin composition, prepreg and coppe...

Trademarklast 30 trademarks