Advanced Interconnect Technologies Limited

Organization

Batam Island, ID

Organizations

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Patents Grantslast 30 patents

Information Patent Grant
Lead frame with included passive devices
- Patent number 7,489,021
- Issue date Feb 10, 2009
- Advanced Interconnect Technologies Limited
- Frank J. Juskey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die pad for semiconductor packages and methods of making and using...
- Patent number 7,262,491
- Issue date Aug 28, 2007
- Advanced Interconnect Technologies Limited
- Shafidul Islam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal enhanced package for block mold assembly
- Patent number 7,259,445
- Issue date Aug 21, 2007
- Advanced Interconnect Technologies Limited
- Daniel K. Lau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin multiple semiconductor die package
- Patent number 7,247,933
- Issue date Jul 24, 2007
- Advanced Interconnect Technologies Limited
- Frank J. Juskey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Partially patterned lead frames and methods of making and using the...
- Patent number 7,129,116
- Issue date Oct 31, 2006
- Advanced Interconnect Technologies Limited
- Shafidul Islam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Partially patterned lead frames and methods of making and using the...
- Patent number 6,812,552
- Issue date Nov 2, 2004
- Advanced Interconnect Technologies Limited
- Shafidul Islam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Partially patterned lead frames and methods of making and using the...
- Patent number 6,777,265
- Issue date Aug 17, 2004
- Advanced Interconnect Technologies Limited
- Shafidul Islam
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method of making thermally enhanced substrate-base package
- Publication number 20070284733
- Publication date Dec 13, 2007
- Advanced Interconnect Technologies Limited, a Corporation of Mauritius.
- Timothy Leung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for making QFN package with power and ground rings
- Publication number 20070215990
- Publication date Sep 20, 2007
- Advanced Interconnect Technologies Limited, a corporation of the Country of M...
- Romarico S. San Antonio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leadless semiconductor package and method of manufacture
- Publication number 20070126092
- Publication date Jun 7, 2007
- Advanced Interconnect Technologies Limited, a corporation of the Republic of...
- Romarico S. San Antonio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reversible leadless package and methods of making and using same
- Publication number 20070111374
- Publication date May 17, 2007
- ADVANCED INTERCONNECT TECHNOLOGIES LIMITED
- Shafidul Islam
- H01 - BASIC ELECTRIC ELEMENTS

Trademarklast 30 trademarks

Information Trademark
76088371 - AIT ADVANCED INTERCONNECT TECHNOLOGIES
- Serial number 76088371
- Registration number 2679569
- Filing date Jul 12, 2000
- Advanced Interconnect Technologies, Limited
- 40 - Treatment of materials
Information Trademark
76088372 - ADVANCED INTERCONNECT TECHNOLOGIES
- Serial number 76088372
- Filing date Jul 12, 2000
- Advanced Interconnect Technologies, Limited
- 40 - Treatment of materials

Advanced Interconnect Technologies Limited

Organization

Patents Grantslast 30 patents

Lead frame with included passive devices

Die pad for semiconductor packages and methods of making and using...

Thermal enhanced package for block mold assembly

Thin multiple semiconductor die package

Partially patterned lead frames and methods of making and using the...

Partially patterned lead frames and methods of making and using the...

Partially patterned lead frames and methods of making and using the...

Patents Applicationslast 30 patents

Method of making thermally enhanced substrate-base package

Method for making QFN package with power and ground rings

Leadless semiconductor package and method of manufacture

Reversible leadless package and methods of making and using same

Trademarklast 30 trademarks

76088371 - AIT ADVANCED INTERCONNECT TECHNOLOGIES

76088372 - ADVANCED INTERCONNECT TECHNOLOGIES