AG MATERIALS TECHNOLOGY CO., LTD.

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Hsinchu City, TW

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Patents Grantslast 30 patents

Information Patent Grant
Nano-twinned structure on metallic thin film surface and method for...
- Patent number 12,191,274
- Issue date Jan 7, 2025
- AG MATERIALS TECHNOLOGY CO., LTD.
- Tung-Han Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structures and methods for forming the same
- Patent number 12,148,725
- Issue date Nov 19, 2024
- AG MATERIALS TECHNOLOGY CO., LTD.
- Tung-Han Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structures and methods for forming the same
- Patent number 11,837,568
- Issue date Dec 5, 2023
- AG MATERIALS TECHNOLOGY CO., LTD.
- Tung-Han Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silver nano-twinned thin film structure and method for forming the...
- Patent number 11,488,920
- Issue date Nov 1, 2022
- AG MATERIALS TECHNOLOGY CO., LTD.
- Hsing-Hua Tsai
- H01 - BASIC ELECTRIC ELEMENTS

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Patents Applicationslast 30 patents

Information Patent Application
BACK SIDE METALLIZATION THIN FILM STRUCTURE AND METHOD FOR FORMING...
- Publication number 20240170434
- Publication date May 23, 2024
- AG MATERIALS TECHNOLOGY CO., LTD.
- Chien-Hsun CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANO-TWINNED ULTRA-THIN METALLIC FILM STRUCTURE AND METHODS FOR FOR...
- Publication number 20240158907
- Publication date May 16, 2024
- AG MATERIALS TECHNOLOGY CO., LTD.
- Chien-Hsun CHUANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
NANO-TWINNED STRUCTURE ON METALLIC THIN FILM SURFACE AND METHOD FOR...
- Publication number 20230090030
- Publication date Mar 23, 2023
- AG MATERIALS TECHNOLOGY CO., LTD.
- Tung-Han CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METALLIC NANO-TWINNED THIN FILM STRUCTURE AND METHOD FOR FORMING TH...
- Publication number 20230057312
- Publication date Feb 23, 2023
- AG MATERIALS TECHNOLOGY CO., LTD.
- Tung-Han CHUANG
- B82 - NANO-TECHNOLOGY
Information Patent Application
BONDING STRUCTURES AND METHODS FOR FORMING THE SAME
- Publication number 20230027664
- Publication date Jan 26, 2023
- AG MATERIALS TECHNOLOGY CO., LTD.
- Tung-Han CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURES AND METHODS FOR FORMING THE SAME
- Publication number 20220344298
- Publication date Oct 27, 2022
- AG MATERIALS TECHNOLOGY CO., LTD.
- Tung-Han CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDING STRUCTURES AND METHOD FOR FORMING THE SAME
- Publication number 20220336407
- Publication date Oct 20, 2022
- AG MATERIALS TECHNOLOGY CO., LTD.
- Tung-Han CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILVER NANO-TWINNED THIN FILM STRUCTURE AND METHOD FOR FORMING THE...
- Publication number 20210225793
- Publication date Jul 22, 2021
- AG MATERIALS TECHNOLOGY CO.,LTD.
- Hsing-Hua TSAI
- H01 - BASIC ELECTRIC ELEMENTS

AG MATERIALS TECHNOLOGY CO., LTD.

Organization

Patents Grantslast 30 patents

Nano-twinned structure on metallic thin film surface and method for...

Bonding structures and methods for forming the same

Bonding structures and methods for forming the same

Silver nano-twinned thin film structure and method for forming the...

Patents Applicationslast 30 patents

BACK SIDE METALLIZATION THIN FILM STRUCTURE AND METHOD FOR FORMING...

NANO-TWINNED ULTRA-THIN METALLIC FILM STRUCTURE AND METHODS FOR FOR...

NANO-TWINNED STRUCTURE ON METALLIC THIN FILM SURFACE AND METHOD FOR...

METALLIC NANO-TWINNED THIN FILM STRUCTURE AND METHOD FOR FORMING TH...

BONDING STRUCTURES AND METHODS FOR FORMING THE SAME

BONDING STRUCTURES AND METHODS FOR FORMING THE SAME

DIE BONDING STRUCTURES AND METHOD FOR FORMING THE SAME

SILVER NANO-TWINNED THIN FILM STRUCTURE AND METHOD FOR FORMING THE...