AMBIT MICROSYSTEMS (ZHONGSHAN) LTD.

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Zhongshan City, CN

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Patents Grantslast 30 patents

Information Patent Grant
Package structure with electronic component and method for manufact...
- Patent number 8,625,297
- Issue date Jan 7, 2014
- Ambit Microsystems (Zhongshan) Ltd.
- Jun-Yi Xiao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor chip package and method of making same
- Patent number 8,614,120
- Issue date Dec 24, 2013
- Ambit Microsystems (Zhongshan) Ltd.
- Jun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame and semiconductor package using the same
- Patent number 8,587,100
- Issue date Nov 19, 2013
- Ambit Microsystems (Zhongshan) Ltd.
- Wang-Lai Yang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
LED package structure
- Patent number 8,378,370
- Issue date Feb 19, 2013
- Ambit Microsystems (Zhongshan) Ltd.
- Jun Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optical transceiver and packaging method thereof
- Patent number 8,369,709
- Issue date Feb 5, 2013
- Ambit Microsystems (Zhongshan) Ltd.
- Xiao-Ya Guo
- G02 - OPTICS

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Patents Applicationslast 30 patents

Information Patent Application
PACKAGE ASSEMBLY FOR CHIP AND METHOD OF MANUFACTURING SAME
- Publication number 20150048504
- Publication date Feb 19, 2015
- AMBIT MICROSYSTEMS (ZHONGSHAN) LTD.
- YUE-RONG WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE FOR DUPLEXER, METHOD OF MANUFACTURING THE SAME AN...
- Publication number 20150028964
- Publication date Jan 29, 2015
- AMBIT MICROSYSTEMS (ZHONGSHAN) LTD.
- XIAO-YA GUO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD WITH SHALLOW SOLDER PAD AND METHOD FOR MANUFA...
- Publication number 20140326485
- Publication date Nov 6, 2014
- AMBIT MICROSYSTEMS (ZHONGSHAN) LTD.
- AI-HUA LIANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONCENTRATING PHOTOVOLTAIC CHIP ASSEMBLY, METHOD FOR MANUFACTURING...
- Publication number 20140283909
- Publication date Sep 25, 2014
- AMBIT MICROSYSTEMS (ZHONGSHAN) LTD.
- FEI REN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THICK-FILM HYBRID CIRCUIT STRUCTURE AND METHOD OF MANUFACTURE THE SAME
- Publication number 20140085845
- Publication date Mar 27, 2014
- HON HAI PRECISION INDUSTRY CO., LTD.
- HONG-GUANG HUANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING PACKAGE STRUCTURE WITH ELECTRONIC COMPONENT
- Publication number 20140080256
- Publication date Mar 20, 2014
- AMBIT MICROSYSTEMS (ZHONGSHAN) LTD.
- JUN-YI XIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ASSEMBLY AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140054792
- Publication date Feb 27, 2014
- HON HAI PRECISION INDUSTRY CO., LTD.
- WANG-LAI YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING LEAD FRAME AND SEMICONDUCTOR PACKAGE USING...
- Publication number 20130239409
- Publication date Sep 19, 2013
- AMBIT MICROSYSTEMS (ZHONGSHAN) LTD.
- WANG-LAI YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP PACKAGE AND METHOD OF MAKING SAME
- Publication number 20130075879
- Publication date Mar 28, 2013
- HON HAI Precision Industry CO., LTD.
- JUN YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDING DEVICE FOR SEMICONDUCTOR CHIP PACKAGE
- Publication number 20130071505
- Publication date Mar 21, 2013
- HON HAI Precision Industry CO., LTD.
- JUN-YI XIAO
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
MULTI-LAYER CERAMIC ELECTRONIC COMPONENT WITH SOLDER BLOCKING LAYER
- Publication number 20130063864
- Publication date Mar 14, 2013
- HON HAI Precision Industry CO., LTD.
- JUN-YI XIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING SAME
- Publication number 20130048351
- Publication date Feb 28, 2013
- HON HAI Precision Industry CO., LTD.
- JUN-YI XIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH ELECTRONIC COMPONENT AND METHOD FOR MANUFACT...
- Publication number 20130021772
- Publication date Jan 24, 2013
- HON HAI Precision Industry CO., LTD.
- JUN-YI XIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH ELECTRONIC COMPONENT AND METHOD FOR MANUFACT...
- Publication number 20120279771
- Publication date Nov 8, 2012
- HON HAI Precision Industry CO., LTD.
- JUN-YI XIAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LED PACKAGE STRUCTURE
- Publication number 20120261692
- Publication date Oct 18, 2012
- HON HAI Precision Industry CO., LTD.
- JUN YANG
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
OPTICAL TRANSCEIVER AND PACKAGING METHOD THEREOF
- Publication number 20120045216
- Publication date Feb 23, 2012
- HON HAI Precision Industry CO., LTD.
- XIAO-YA GUO
- G02 - OPTICS
Information Patent Application
LEAD FRAME, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR PAC...
- Publication number 20110309484
- Publication date Dec 22, 2011
- HON HAI Precision Industry CO., LTD.
- WANG-LAI YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE HAVING A LIQUID CRYSTAL DISPLAY MODULE
- Publication number 20110261285
- Publication date Oct 27, 2011
- HON HAI Precision Industry CO., LTD.
- Shao-Ping Wang
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR ASSEMBLY PACKAGE HAVING SHIELDING LAYER AND METHOD TH...
- Publication number 20110221046
- Publication date Sep 15, 2011
- AMBIT MICROSYSTEMS (ZHONGSHAN) LTD.
- JUN-YI XIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL TRANSCEIVER AND PACKAGING METHOD THEREOF
- Publication number 20110150494
- Publication date Jun 23, 2011
- AMBIT MICROSYSTEMS (ZHONGSHAN) LTD.
- XIAO-YA GUO
- G02 - OPTICS

AMBIT MICROSYSTEMS (ZHONGSHAN) LTD.

Organization

Patents Grantslast 30 patents

Package structure with electronic component and method for manufact...

Semiconductor chip package and method of making same

Lead frame and semiconductor package using the same

LED package structure

Optical transceiver and packaging method thereof

Patents Applicationslast 30 patents

PACKAGE ASSEMBLY FOR CHIP AND METHOD OF MANUFACTURING SAME

PACKAGE STRUCTURE FOR DUPLEXER, METHOD OF MANUFACTURING THE SAME AN...

PRINTED CIRCUIT BOARD WITH SHALLOW SOLDER PAD AND METHOD FOR MANUFA...

CONCENTRATING PHOTOVOLTAIC CHIP ASSEMBLY, METHOD FOR MANUFACTURING...

THICK-FILM HYBRID CIRCUIT STRUCTURE AND METHOD OF MANUFACTURE THE SAME

METHOD FOR MANUFACTURING PACKAGE STRUCTURE WITH ELECTRONIC COMPONENT

PACKAGE ASSEMBLY AND METHOD OF MANUFACTURING THE SAME

METHOD OF MANUFACTURING LEAD FRAME AND SEMICONDUCTOR PACKAGE USING...

SEMICONDUCTOR CHIP PACKAGE AND METHOD OF MAKING SAME

MOLDING DEVICE FOR SEMICONDUCTOR CHIP PACKAGE

MULTI-LAYER CERAMIC ELECTRONIC COMPONENT WITH SOLDER BLOCKING LAYER

ELECTRONIC PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING SAME

PACKAGE STRUCTURE WITH ELECTRONIC COMPONENT AND METHOD FOR MANUFACT...

PACKAGE STRUCTURE WITH ELECTRONIC COMPONENT AND METHOD FOR MANUFACT...

LED PACKAGE STRUCTURE

OPTICAL TRANSCEIVER AND PACKAGING METHOD THEREOF

LEAD FRAME, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR PAC...

ELECTRONIC DEVICE HAVING A LIQUID CRYSTAL DISPLAY MODULE

SEMICONDUCTOR ASSEMBLY PACKAGE HAVING SHIELDING LAYER AND METHOD TH...

OPTICAL TRANSCEIVER AND PACKAGING METHOD THEREOF