Amkor Electronics, Inc.

Organization

Chandler, AZ, US

Organizations

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package having light, thin, simple and compact structure
- Patent number 5,986,334
- Issue date Nov 16, 1999
- ANAM Industrial Co., Ltd.
- Seon Goo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing an alumina-silicon carbide nanocomposite
- Patent number 5,894,008
- Issue date Apr 13, 1999
- Anam Industrial Co., Ltd.
- Seok Ho Na
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Unit printed circuit board carrier frame for ball grid array semico...
- Patent number 5,854,741
- Issue date Dec 29, 1998
- Amkor Electronics, Inc.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer map conversion method
- Patent number 5,838,951
- Issue date Nov 17, 1998
- Anam Industrial Co., Ltd.
- Chee Jung Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a heat sink-integrated semiconductor package
- Patent number 5,807,768
- Issue date Sep 15, 1998
- Anam Industrial Co., Ltd.
- Won Sun Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board having epoxy barrier around a throughout slot...
- Patent number 5,767,446
- Issue date Jun 16, 1998
- Anam Industrial Co., Ltd.
- Sun Ho Ha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding method for semiconductor chips
- Patent number 5,740,956
- Issue date Apr 21, 1998
- Anam Industrial Co., Ltd.
- Seong Min Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array semiconductor package with improved heat dissipatio...
- Patent number 5,729,432
- Issue date Mar 17, 1998
- Anam Industrial Col, Ltd.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor lead frame having connection bar and guide rings
- Patent number 5,723,899
- Issue date Mar 3, 1998
- Amkor Electronics, Inc.
- Won Sun Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a packaged semiconductor die including heat sink w...
- Patent number 5,722,161
- Issue date Mar 3, 1998
- Amkor Electronics, Inc.
- Robert C. Marrs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array semiconductor package with ring-type heat sink
- Patent number 5,708,567
- Issue date Jan 13, 1998
- Anam Industrial Co., Ltd.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor die including heat sink with locking feature
- Patent number 5,701,034
- Issue date Dec 23, 1997
- Amkor Electronics, Inc.
- Robert C. Marrs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interdigitated wirebond programmable fixed voltage planes
- Patent number 5,672,909
- Issue date Sep 30, 1997
- Amkor Electronics, Inc.
- Thomas P. Glenn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip mounting plate construction of lead frame for semiconductor pa...
- Patent number 5,661,338
- Issue date Aug 26, 1997
- Anam Industrial Co., Ltd.
- Youn Cheol Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat spreader suitable for use in semiconductor packages having dif...
- Patent number 5,641,987
- Issue date Jun 24, 1997
- Anam Industrial Co., Ltd.
- Myung Jun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and circuit board structure for leveling solder balls in bal...
- Patent number 5,641,946
- Issue date Jun 24, 1997
- Anam Industrial Co., Ltd.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for molding of integrated circuit package
- Patent number 5,637,273
- Issue date Jun 10, 1997
- Anam Industrial Co., Ltd.
- Lee Goo
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Mold runner removal from a substrate-based packaged electronic device
- Patent number 5,635,671
- Issue date Jun 3, 1997
- Amkor Electronics, Inc.
- Bruce J. Freyman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with integral heat dissipator
- Patent number 5,629,561
- Issue date May 13, 1997
- Anam Industrial Co., Ltd.
- Won S. Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plastic packaged integrated circuit with heat spreader
- Patent number 5,596,485
- Issue date Jan 21, 1997
- Amkor Electronics, Inc.
- Thomas P. Glenn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array integrated circuit package with thermal conductor
- Patent number 5,583,378
- Issue date Dec 10, 1996
- Amkor Electronics, Inc.
- Robert C. Marrs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper oxide-filled polymer die attach adhesive composition for sem...
- Patent number 5,582,772
- Issue date Dec 10, 1996
- Anam Industrial Co., Ltd.
- Cheol W. Kwak
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor device having a thermal dissipator and electromagneti...
- Patent number 5,485,037
- Issue date Jan 16, 1996
- Amkor Electronics, Inc.
- Robert C. Marrs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for applying flux to ball grid array package
- Patent number 5,482,736
- Issue date Jan 9, 1996
- Amkor Electronics, Inc.
- Thomas P. Glenn
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming a semiconductor device having a thermal dissipat...
- Patent number 5,482,898
- Issue date Jan 9, 1996
- Amkor Electronics, Inc.
- Robert C. Marrs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package with via interconnections formed in a su...
- Patent number 5,483,100
- Issue date Jan 9, 1996
- Amkor Electronics, Inc.
- Robert C. Marrs
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for interconnection of integrated circuit chip and substrate
- Patent number 5,478,007
- Issue date Dec 26, 1995
- Amkor Electronics, Inc.
- Robert C. Marrs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plastic molded package with heat sink for integrated circuit devices
- Patent number 5,455,462
- Issue date Oct 3, 1995
- Amkor Electronics, Inc.
- Robert C. Marrs
- H01 - BASIC ELECTRIC ELEMENTS

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Trademarklast 30 trademarks

Information Trademark
75428175 - VISIONPAK
- Serial number 75428175
- Registration number 2393904
- Filing date Feb 3, 1998
- Amkor Electronics, Inc.
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
75417622 - AMKOR TECHNOLOGY
- Serial number 75417622
- Registration number 2478303
- Filing date Jan 13, 1998
- Amkor Electronics, Inc.
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
75229028 - SUPERLGA
- Serial number 75229028
- Filing date Jan 21, 1997
- Amkor Electronics, Inc.
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
75229029 - SUPER LAND GRID ARRAY
- Serial number 75229029
- Filing date Jan 21, 1997
- Amkor Electronics, Inc.
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
75105480 - POWERSOP
- Serial number 75105480
- Registration number 2118551
- Filing date May 16, 1996
- Amkor Electronics, Inc.
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
75105481 - CHIPARRAY
- Serial number 75105481
- Registration number 2159448
- Filing date May 16, 1996
- Amkor Electronics, Inc.
- 17 - Rubber, gutta-percha, gum, asbestos, mica and goods made from these materials and not included in other classes

Amkor Electronics, Inc.

Organization

Patents Grantslast 30 patents

Semiconductor package having light, thin, simple and compact structure

Method for manufacturing an alumina-silicon carbide nanocomposite

Unit printed circuit board carrier frame for ball grid array semico...

Wafer map conversion method

Method for fabricating a heat sink-integrated semiconductor package

Printed circuit board having epoxy barrier around a throughout slot...

Bonding method for semiconductor chips

Ball grid array semiconductor package with improved heat dissipatio...

Semiconductor lead frame having connection bar and guide rings

Method of making a packaged semiconductor die including heat sink w...

Ball grid array semiconductor package with ring-type heat sink

Packaged semiconductor die including heat sink with locking feature

Interdigitated wirebond programmable fixed voltage planes

Chip mounting plate construction of lead frame for semiconductor pa...

Heat spreader suitable for use in semiconductor packages having dif...

Method and circuit board structure for leveling solder balls in bal...

Method for molding of integrated circuit package

Mold runner removal from a substrate-based packaged electronic device

Semiconductor package with integral heat dissipator

Plastic packaged integrated circuit with heat spreader

Ball grid array integrated circuit package with thermal conductor

Copper oxide-filled polymer die attach adhesive composition for sem...

Semiconductor device having a thermal dissipator and electromagneti...

Method for applying flux to ball grid array package

Method for forming a semiconductor device having a thermal dissipat...

Integrated circuit package with via interconnections formed in a su...

Method for interconnection of integrated circuit chip and substrate

Plastic molded package with heat sink for integrated circuit devices

Trademarklast 30 trademarks

75428175 - VISIONPAK

75417622 - AMKOR TECHNOLOGY

75229028 - SUPERLGA

75229029 - SUPER LAND GRID ARRAY

75105480 - POWERSOP

75105481 - CHIPARRAY