Aprolase Development Co., LLC

Organization

Wilmington, DE, US

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Patents Grantslast 30 patents

Information Patent Grant
Video event capture, storage and processing method and apparatus
- Patent number 8,934,627
- Issue date Jan 13, 2015
- Aprolase Development Co., LLC
- Randolph S. Carlson
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Stackable layer containing ball grid array package
- Patent number 8,835,218
- Issue date Sep 16, 2014
- Aprolase Development Co., LLC
- Keith Gann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip scale vacuum pump
- Patent number 8,485,793
- Issue date Jul 16, 2013
- Aprolase Development Co., LLC
- Itzhak Sapir
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Grant
Method for precision integrated circuit die singulation using diffe...
- Patent number RE43877
- Issue date Dec 25, 2012
- Aprolase Development Co., LLC
- David Ludwig
- 438 - Semiconductor device manufacturing: process
Information Patent Grant
Stacked ball grid array package module utilizing one or more interp...
- Patent number 8,299,594
- Issue date Oct 30, 2012
- Aprolase Development Co., LLC
- Daniel Michaels
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Three-dimensional ladar module with alignment reference insert circ...
- Patent number RE43722
- Issue date Oct 9, 2012
- Aprolase Development Co., LLC
- John Kennedy
- 356 - Optics: measuring and testing
Information Patent Grant
Stackable layer containing ball grid array package
- Patent number RE43536
- Issue date Jul 24, 2012
- Aprolase Development Co., LLC
- Floyd Eide
- 257 - Active solid-state devices
Information Patent Grant
Three-dimensional LADAR module with alignment reference insert circ...
- Patent number 8,198,576
- Issue date Jun 12, 2012
- Aprolase Development Co., LLC
- John Kennedy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Anti-tamper module
- Patent number 8,074,082
- Issue date Dec 6, 2011
- Aprolase Development Co., LLC
- Volkan H. Ozguz
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Forced vibration piezo generator and piezo actuator
- Patent number 8,040,022
- Issue date Oct 18, 2011
- Aprolase Development Co., LLC
- Itzhak Sapir
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Vertically stacked pre-packaged integrated circuit chips
- Patent number 8,012,803
- Issue date Sep 6, 2011
- Aprolase Development Co., LLC
- Keith Gann
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Ball grid array stack
- Patent number 7,990,727
- Issue date Aug 2, 2011
- Aprolase Development Co., LLC
- Frank Mantz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stackable layer containing ball grid array package
- Patent number 7,982,300
- Issue date Jul 19, 2011
- Aprolase Development Co., LLC
- Keith Gann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tier structure with tier frame having a feedthrough structure
- Patent number 7,919,844
- Issue date Apr 5, 2011
- Aprolase Development Co., LLC
- Volkan Ozguz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Field programmable gate array utilizing dedicated memory stacks in...
- Patent number 7,902,879
- Issue date Mar 8, 2011
- Aprolase Development Co., LLC
- Volkan H. Ozguz
- G01 - MEASURING TESTING

Aprolase Development Co., LLC

Organization

Patents Grantslast 30 patents

Video event capture, storage and processing method and apparatus

Stackable layer containing ball grid array package

Chip scale vacuum pump

Method for precision integrated circuit die singulation using diffe...

Stacked ball grid array package module utilizing one or more interp...

Three-dimensional ladar module with alignment reference insert circ...

Stackable layer containing ball grid array package

Three-dimensional LADAR module with alignment reference insert circ...

Anti-tamper module

Forced vibration piezo generator and piezo actuator

Vertically stacked pre-packaged integrated circuit chips

Ball grid array stack

Stackable layer containing ball grid array package

Tier structure with tier frame having a feedthrough structure

Field programmable gate array utilizing dedicated memory stacks in...