BOARDTEK ELECTRONICS CORPORATION

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TAOYUAN, TW

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Patents Grantslast 30 patents

Information Patent Grant
Electromagnetic wave transmission board comprising an inner board w...
- Patent number 12,074,357
- Issue date Aug 27, 2024
- BOARDTEK ELECTRONICS CORPORATION
- Chung-Hsing Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board structure with waveguide and method for manufacturing...
- Patent number 11,963,293
- Issue date Apr 16, 2024
- BOARDTEK ELECTRONICS CORPORATION
- Chien-Cheng Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board structure with waveguide and method for manufacturing...
- Patent number 11,803,022
- Issue date Oct 31, 2023
- BOARDTEK ELECTRONICS CORPORATION
- Chien-Cheng Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board having waveguides and method of manufacturing the same
- Patent number 11,678,431
- Issue date Jun 13, 2023
- BOARDTEK ELECTRONICS CORPORATION
- Chien-Cheng Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of electroplating a circuit board
- Patent number 11,129,283
- Issue date Sep 21, 2021
- BOARDTEK ELECTRONICS CORPORATION
- Chien-Cheng Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer electromagnetic wave transmission board assembled by an...
- Patent number 11,063,333
- Issue date Jul 13, 2021
- BOARDTEK ELECTRONICS CORPORATION
- Wen-Feng Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board structure with chips embedded therein and manufacturi...
- Patent number 9,860,990
- Issue date Jan 2, 2018
- BOARDTEK ELECTRONICS CORPORATION
- Chien-Cheng Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board structure and manufacturing method thereof
- Patent number 9,826,642
- Issue date Nov 21, 2017
- BOARDTEK ELECTRONICS CORPORATION
- Chien-Cheng Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and manufacturing method thereof
- Patent number 9,661,760
- Issue date May 23, 2017
- BOARDTEK ELECTRONICS CORPORATION
- Chien-Cheng Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board
- Patent number 9,392,687
- Issue date Jul 12, 2016
- BOARDTEK ELECTRONICS CORPORATION
- Chien-Cheng Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board having interior space
- Patent number 9,320,139
- Issue date Apr 19, 2016
- Boardtek Electronics Corporation
- Chien-Cheng Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board structure manufacturing method
- Patent number 9,271,387
- Issue date Feb 23, 2016
- Boardtek Electronics Corporation
- Chien-Cheng Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate structure and the fabrication method thereof
- Patent number 7,585,419
- Issue date Sep 8, 2009
- Boardtek Electronics Corp.
- Joseph Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package structure of chip and the package method thereof
- Patent number 7,556,984
- Issue date Jul 7, 2009
- Boardtek Electronics Corp.
- Joseph Cheng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
POWER MODULE FOR HIGH-FREQUENCY USE AND METHOD FOR MANUFACTURING TH...
- Publication number 20230411334
- Publication date Dec 21, 2023
- BOARDTEK ELECTRONICS CORPORATION
- CHIEN-CHENG LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE WITH EMBEDDED POWER CHIP AND CIRCUIT BOARD MODU...
- Publication number 20230343694
- Publication date Oct 26, 2023
- BOARDTEK ELECTRONICS CORPORATION
- CHIEN-CHENG LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD STRUCTURE WITH WAVEGUIDE AND METHOD FOR MANUFACTURING...
- Publication number 20230029270
- Publication date Jan 26, 2023
- BOARDTEK ELECTRONICS CORPORATION
- CHIEN-CHENG LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE WITH WAVEGUIDE AND METHOD FOR MANUFACTURING...
- Publication number 20230027319
- Publication date Jan 26, 2023
- BOARDTEK ELECTRONICS CORPORATION
- CHIEN-CHENG LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TRANSMISSION BOARD TO CARRY ELECTROMAGNETIC WAVE WITHOUT LEAKAGE AN...
- Publication number 20230025696
- Publication date Jan 26, 2023
- BOARDTEK ELECTRONICS CORPORATION
- CHUNG-HSING LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD HAVING WAVIEGUIDES AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230011064
- Publication date Jan 12, 2023
- BOARDTEK ELECTRONICS CORPORATION
- CHIEN-CHENG LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTROPLATING METHOD OF CIRCUIT BOARD AND CIRCUIT BOARD MANUFACTUR...
- Publication number 20200170124
- Publication date May 28, 2020
- BOARDTEK ELECTRONICS CORPORATION
- CHIEN-CHENG LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTROMAGNETIC WAVE TRANSMISSION BOARD
- Publication number 20200128702
- Publication date Apr 23, 2020
- BOARDTEK ELECTRONICS CORPORATION
- WEN-FENG CHENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND PLATING METHOD THEREOF
- Publication number 20200128680
- Publication date Apr 23, 2020
- BOARDTEK ELECTRONICS CORPORATION
- CHIEN-CHENG LEE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CIRCUIT BOARD STRUCTURE
- Publication number 20200107456
- Publication date Apr 2, 2020
- BOARDTEK ELECTRONICS CORPORATION
- CHIEN-CHENG LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTROPLATING SYSTEM
- Publication number 20170298529
- Publication date Oct 19, 2017
- BOARDTEK ELECTRONICS CORPORATION
- Wen-Feng Cheng
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROPLATING ANODE ASSEMBLY
- Publication number 20170298530
- Publication date Oct 19, 2017
- BOARDTEK ELECTRONICS CORPORATION
- Wen-Feng Cheng
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20160150643
- Publication date May 26, 2016
- BOARDTEK ELECTRONICS CORPORATION
- CHIEN-CHENG LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD MODULE AND CIRCUIT BOARD STRUCTURE
- Publication number 20160095197
- Publication date Mar 31, 2016
- BOARDTEK ELECTRONICS CORPORATION
- CHIEN-CHENG LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20150382472
- Publication date Dec 31, 2015
- BOARDTEK ELECTRONICS CORPORATION
- CHIEN-CHENG LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD HAVING INTERIOR SPACE
- Publication number 20150359087
- Publication date Dec 10, 2015
- BOARDTEK ELECTRONICS CORPORATION
- CHIEN-CHENG LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20150052742
- Publication date Feb 26, 2015
- BOARDTEK ELECTRONICS CORPORATION
- CHIEN-CHENG LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20150008029
- Publication date Jan 8, 2015
- BOARDTEK ELECTRONICS CORPORATION
- CHIEN-CHENG LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD MANUFACTURING METHOD
- Publication number 20140124124
- Publication date May 8, 2014
- BOARDTEK ELECTRONICS CORPORATION
- CHIEN-CHENG LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD MANUFACTURING METHOD
- Publication number 20140123487
- Publication date May 8, 2014
- BOARDTEK ELECTRONICS CORPORATION
- CHIEN-CHENG LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Trademarklast 30 trademarks

Information Trademark
90412382 - BTK
- Serial number 90412382
- Registration number 6860421
- Filing date Dec 25, 2020
- BOARDTEK ELECTRONICS CORPORATION
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
90412387 - BOARDTEK ELEC.
- Serial number 90412387
- Registration number 6958284
- Filing date Dec 25, 2020
- BOARDTEK ELECTRONICS CORPORATION
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
76129522 - BOARDTEK
- Serial number 76129522
- Registration number 2490656
- Filing date Sep 15, 2000
- Boardtek Electronics Corporation
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments

BOARDTEK ELECTRONICS CORPORATION

Organization

Patents Grantslast 30 patents

Electromagnetic wave transmission board comprising an inner board w...

Circuit board structure with waveguide and method for manufacturing...

Circuit board structure with waveguide and method for manufacturing...

Circuit board having waveguides and method of manufacturing the same

Method of electroplating a circuit board

Multilayer electromagnetic wave transmission board assembled by an...

Circuit board structure with chips embedded therein and manufacturi...

Circuit board structure and manufacturing method thereof

Printed circuit board and manufacturing method thereof

Circuit board

Circuit board having interior space

Circuit board structure manufacturing method

Substrate structure and the fabrication method thereof

Package structure of chip and the package method thereof

Patents Applicationslast 30 patents

POWER MODULE FOR HIGH-FREQUENCY USE AND METHOD FOR MANUFACTURING TH...

PACKAGING STRUCTURE WITH EMBEDDED POWER CHIP AND CIRCUIT BOARD MODU...

CIRCUIT BOARD STRUCTURE WITH WAVEGUIDE AND METHOD FOR MANUFACTURING...

CIRCUIT BOARD STRUCTURE WITH WAVEGUIDE AND METHOD FOR MANUFACTURING...

TRANSMISSION BOARD TO CARRY ELECTROMAGNETIC WAVE WITHOUT LEAKAGE AN...

CIRCUIT BOARD HAVING WAVIEGUIDES AND METHOD OF MANUFACTURING THE SAME

ELECTROPLATING METHOD OF CIRCUIT BOARD AND CIRCUIT BOARD MANUFACTUR...

ELECTROMAGNETIC WAVE TRANSMISSION BOARD

CIRCUIT BOARD AND PLATING METHOD THEREOF

CIRCUIT BOARD STRUCTURE

ELECTROPLATING SYSTEM

ELECTROPLATING ANODE ASSEMBLY

CIRCUIT BOARD

CIRCUIT BOARD MODULE AND CIRCUIT BOARD STRUCTURE

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

CIRCUIT BOARD HAVING INTERIOR SPACE

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

PRINTED CIRCUIT BOARD MANUFACTURING METHOD

PRINTED CIRCUIT BOARD MANUFACTURING METHOD

Trademarklast 30 trademarks

90412382 - BTK

90412387 - BOARDTEK ELEC.

76129522 - BOARDTEK