Chang Wah Technology CO., LTD.

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Kaohsiung City, TW

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Patents Grantslast 30 patents

Information Patent Grant
Lead frame assembly and chip packaging device
- Patent number 12,206,060
- Issue date Jan 21, 2025
- CHANG WAH TECHNOLOGY CO., LTD.
- Chia-Neng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame assembly having a plurality of dicing holes
- Patent number 12,113,001
- Issue date Oct 8, 2024
- CHANG WAH TECHNOLOGY CO., LTD.
- Chia-Neng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame having a die pad with a plurality of grooves on an under...
- Patent number 11,495,523
- Issue date Nov 8, 2022
- CHANG WAH TECHNOLOGY CO., LTD.
- Chia-Neng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Preformed lead frame and lead frame package made from the same
- Patent number 10,937,728
- Issue date Mar 2, 2021
- CHANG WAH TECHNOLOGY CO., LTD.
- Chia-Neng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Preformed lead frame device
- Patent number 10,607,926
- Issue date Mar 31, 2020
- CHANG WAH TECHNOLOGY CO., LTD.
- Chia-Neng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe and method of making the same
- Patent number 10,600,726
- Issue date Mar 24, 2020
- CHANG WAH TECHNOLOGY CO., LTD.
- Chia-Neng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Preformed lead frame device and lead frame package including the same
- Patent number 10,475,730
- Issue date Nov 12, 2019
- CHANG WAH TECHNOLOGY CO., LTD.
- Chia-Neng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device package
- Patent number 10,424,694
- Issue date Sep 24, 2019
- CHANG WAH TECHNOLOGY CO., LTD.
- Chia-Neng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pre-molded leadframe device
- Patent number 10,424,535
- Issue date Sep 24, 2019
- CHANG WAH TECHNOLOGY CO., LTD.
- Chia-Neng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Preformed lead frame and lead frame packaged structure including th...
- Patent number 10,373,886
- Issue date Aug 6, 2019
- CHANG WAH TECHNOLOGY CO., LTD.
- Chia-Neng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Preformed lead frame
- Patent number 10,217,699
- Issue date Feb 26, 2019
- CHANG WAH TECHNOLOGY CO., LTD.
- Chia-Neng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Universal preformed lead frame device
- Patent number 10,068,837
- Issue date Sep 4, 2018
- CHANG WAH TECHNOLOGY CO., LTD.
- Chia-Neng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded lead frame device
- Patent number 9,984,980
- Issue date May 29, 2018
- CHANG WAH TECHNOLOGY CO., LTD.
- Chia-Neng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite lead frame structure
- Patent number 9,847,279
- Issue date Dec 19, 2017
- CHANG WAH TECHNOLOGY CO., LTD.
- Chia-Neng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame device
- Patent number 9,799,613
- Issue date Oct 24, 2017
- CHANG WAH TECHNOLOGY CO., LTD.
- Chia-Neng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual layered lead frame
- Patent number 9,082,760
- Issue date Jul 14, 2015
- CHANG WAH TECHNOLOGY CO., LTD.
- Chia-Neng Huang
- H01 - BASIC ELECTRIC ELEMENTS

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Patents Applicationslast 30 patents

Information Patent Application
LEAD FRAME ASSEMBLY
- Publication number 20230187324
- Publication date Jun 15, 2023
- Chang Wah Technology CO., LTD.
- Chia-Neng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME ASSEMBLY AND CHIP PACKAGING DEVICE
- Publication number 20230155091
- Publication date May 18, 2023
- Chang Wah Technology CO., LTD.
- Chia-Neng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE LEAD FRAME AND LIGHT-EMITTING DIODE PACKAGE STRUCTURE INC...
- Publication number 20220231208
- Publication date Jul 21, 2022
- Chang Wah Technology CO., LTD.
- Chia-Neng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME
- Publication number 20220093494
- Publication date Mar 24, 2022
- Chang Wah Technology CO., LTD.
- Chia-Neng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20210098358
- Publication date Apr 1, 2021
- Chang Wah Technology CO., LTD.
- Chia-Neng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PREFORMED LEAD FRAME AND LEAD FRAME PACKAGE MADE FROM THE SAME
- Publication number 20200251412
- Publication date Aug 6, 2020
- Chang Wah Technology CO., LTD.
- Chia-Neng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20200227343
- Publication date Jul 16, 2020
- Chang Wah Technology CO., LTD.
- Chia-Neng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME AND METHOD OF MAKING THE SAME
- Publication number 20200027822
- Publication date Jan 23, 2020
- Chang Wah Technology CO., LTD.
- Chia-Neng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PREFORMED LEAD FRAME AND LEAD FRAME PACKAGE MADE FROM THE SAME
- Publication number 20190341338
- Publication date Nov 7, 2019
- Chang Wah Technology CO., LTD.
- Chia-Neng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRE-MOLDED LEADFRAME DEVICE
- Publication number 20190181074
- Publication date Jun 13, 2019
- Chang Wah Technology CO., LTD.
- Chia-Neng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE PACKAGE
- Publication number 20190181305
- Publication date Jun 13, 2019
- Chang Wah Technology CO., LTD.
- Chia-Neng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PREFORMED LEAD FRAME AND LEAD FRAME PACKAGED STRUCTURE INCLUDING TH...
- Publication number 20180211903
- Publication date Jul 26, 2018
- CHANG WAH TECHNOLOGY CO., LTD.
- Chia-Neng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PREFORMED LEAD FRAME
- Publication number 20180190574
- Publication date Jul 5, 2018
- CHANG WAH TECHNOLOGY CO., LTD.
- Chia-Neng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED LEAD FRAME DEVICE
- Publication number 20180096953
- Publication date Apr 5, 2018
- Chang Wah Technology CO., LTD.
- Chia-Neng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PREFORMED LEAD FRAME DEVICE AND LEAD FRAME PACKAGE INCLUDING THE SAME
- Publication number 20170263542
- Publication date Sep 14, 2017
- CHANG WAH TECHNOLOGY CO., LTD.
- Chia-Neng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME AND SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20170194235
- Publication date Jul 6, 2017
- Chang Wah Technology CO., LTD.
- Chia-Neng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Composite Lead Frame Structure
- Publication number 20160043019
- Publication date Feb 11, 2016
- Chang Wah Technology CO., LTD.
- Chia-Neng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS OF MAKING A STRUCTURE FOR ENCAPSULATING LED CHIPS AND THE L...
- Publication number 20140110724
- Publication date Apr 24, 2014
- CHANG WAH TECHNOLOGY CO.,LTD.
- Chia-Neng Huang
- H01 - BASIC ELECTRIC ELEMENTS

Chang Wah Technology CO., LTD.

Organization

Patents Grantslast 30 patents

Lead frame assembly and chip packaging device

Lead frame assembly having a plurality of dicing holes

Lead frame having a die pad with a plurality of grooves on an under...

Preformed lead frame and lead frame package made from the same

Preformed lead frame device

Leadframe and method of making the same

Preformed lead frame device and lead frame package including the same

Light emitting device package

Pre-molded leadframe device

Preformed lead frame and lead frame packaged structure including th...

Preformed lead frame

Universal preformed lead frame device

Molded lead frame device

Composite lead frame structure

Lead frame device

Dual layered lead frame

Patents Applicationslast 30 patents

LEAD FRAME ASSEMBLY

LEAD FRAME ASSEMBLY AND CHIP PACKAGING DEVICE

COMPOSITE LEAD FRAME AND LIGHT-EMITTING DIODE PACKAGE STRUCTURE INC...

LEAD FRAME

SEMICONDUCTOR PACKAGE

PREFORMED LEAD FRAME AND LEAD FRAME PACKAGE MADE FROM THE SAME

SEMICONDUCTOR DEVICE PACKAGE

LEADFRAME AND METHOD OF MAKING THE SAME

PREFORMED LEAD FRAME AND LEAD FRAME PACKAGE MADE FROM THE SAME

PRE-MOLDED LEADFRAME DEVICE

LIGHT EMITTING DEVICE PACKAGE

PREFORMED LEAD FRAME AND LEAD FRAME PACKAGED STRUCTURE INCLUDING TH...

PREFORMED LEAD FRAME

MOLDED LEAD FRAME DEVICE

PREFORMED LEAD FRAME DEVICE AND LEAD FRAME PACKAGE INCLUDING THE SAME

LEAD FRAME AND SEMICONDUCTOR PACKAGE STRUCTURE

Composite Lead Frame Structure

PROCESS OF MAKING A STRUCTURE FOR ENCAPSULATING LED CHIPS AND THE L...