Chipbond Technology Corporation

Organization

Hsinchu, TW

Organizations

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Patents Grantslast 30 patents

Information Patent Grant
Electronic package and method of manufacturing the same
- Patent number 12,317,462
- Issue date May 27, 2025
- Chipbond Technology Corporation
- Chen-Yu Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface acoustic wave device and method of manufacturing the same
- Patent number 12,224,734
- Issue date Feb 11, 2025
- Chipbond Technology Corporation
- Cheng-Hung Shih
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 12,224,183
- Issue date Feb 11, 2025
- Chipbond Technology Corporation
- Shrane-Ning Jenq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double-sided flexible circuit board
- Patent number 12,089,326
- Issue date Sep 10, 2024
- Chipbond Technology Corporation
- Yin-Chen Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Layout structure of a flexible circuit board
- Patent number 11,812,554
- Issue date Nov 7, 2023
- Chipbond Technology Corporation
- Yu-Chen Ma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Storage device for flexible circuit packages and carrier thereof
- Patent number 11,792,923
- Issue date Oct 17, 2023
- Chipbond Technology Corporation
- Shih-Chieh Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tray
- Patent number 11,764,090
- Issue date Sep 19, 2023
- Chipbond Technology Corporation
- Hsu-Chi Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 11,651,974
- Issue date May 16, 2023
- Chipbond Technology Corporation
- Chih-Ming Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible circuit board
- Patent number 11,606,860
- Issue date Mar 14, 2023
- Chipbond Technology Corporation
- Gwo-Shyan Sheu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board tape and joining method thereof
- Patent number 11,602,047
- Issue date Mar 7, 2023
- Chipbond Technology Corporation
- Yin-Chen Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip chip package and circuit board thereof
- Patent number 11,581,283
- Issue date Feb 14, 2023
- Chipbond Technology Corporation
- Yu-Chen Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface acoustic wave device and method of manufacturing the same
- Patent number 11,522,517
- Issue date Dec 6, 2022
- Chipbond Technology Corporation
- Cheng-Hung Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible circuit board and heat spreader thereof
- Patent number 11,503,698
- Issue date Nov 15, 2022
- Chipbond Technology Corporation
- Yi-Ling Hsieh
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Method of attaching heat sinks to a circuit tape
- Patent number 11,350,518
- Issue date May 31, 2022
- Chipbond Technology Corporation
- Chia-Sung Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip chip interconnection and circuit board thereof
- Patent number 11,322,437
- Issue date May 3, 2022
- Chipbond Technology Corporation
- Yu-Chen Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Layout structure of a flexible circuit board
- Patent number 11,309,238
- Issue date Apr 19, 2022
- Chipbond Technology Corporation
- Yu-Chen Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board
- Patent number 11,234,328
- Issue date Jan 25, 2022
- Chipbond Technology Corporation
- Chia-En Fan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible circuit board
- Patent number 11,206,735
- Issue date Dec 21, 2021
- Chipbond Technology Corporation
- Yin-Chen Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible circuit board
- Patent number 11,178,756
- Issue date Nov 16, 2021
- Chipbond Technology Corporation
- Yin-Chen Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Double-sided flexible circuit board and layout structure thereof
- Patent number 11,177,206
- Issue date Nov 16, 2021
- Chipbond Technology Corporation
- Chun-Te Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Storage container for electronic devices
- Patent number 11,148,864
- Issue date Oct 19, 2021
- Chipbond Technology Corporation
- Cheng-Hung Shih
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Restriction device for preventing deformation of restriction plate...
- Patent number 11,084,684
- Issue date Aug 10, 2021
- Chipbond Technology Corporation
- Chung-Yi Chang
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Semiconductor device having 3D inductor and method of manufacturing...
- Patent number 11,056,555
- Issue date Jul 6, 2021
- Chipbond Technology Corporation
- Cheng-Hung Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board
- Patent number 10,999,928
- Issue date May 4, 2021
- Chipbond Technology Corporation
- Yu-Chen Ma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip package and circuit board thereof
- Patent number 10,993,319
- Issue date Apr 27, 2021
- Chipbond Technology Corporation
- Yu-Chen Ma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board having a predetermined punch area and sheet separated...
- Patent number 10,880,993
- Issue date Dec 29, 2020
- Chipbond Technology Corporation
- Yi-Chen Lien
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electroplating system and pressure device thereof
- Patent number 10,808,331
- Issue date Oct 20, 2020
- Chipbond Technology Corporation
- Cheng-Hung Shih
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Chip package and chip thereof
- Patent number 10,797,213
- Issue date Oct 6, 2020
- Chipbond Technology Corporation
- Chin-Tang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip on film package and flexible substrate thereof
- Patent number 10,580,729
- Issue date Mar 3, 2020
- Chipbond Technology Corporation
- Chin-Tang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and circuit substrate thereof
- Patent number 10,504,828
- Issue date Dec 10, 2019
- Chipbond Technology Corporation
- Chin-Tang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250239568
- Publication date Jul 24, 2025
- Chipbond Technology Corporation
- Cheng-Hung Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250239491
- Publication date Jul 24, 2025
- Chipbond Technology Corporation
- Cheng-Hung Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEST PAD
- Publication number 20250220807
- Publication date Jul 3, 2025
- Chipbond Technology Corporation
- Kung-Tzu Tu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE CIRCUIT BOARD
- Publication number 20250203770
- Publication date Jun 19, 2025
- Chipbond Technology Corporation
- Ting-Yi Kuo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE CIRCUIT BOARD
- Publication number 20250159801
- Publication date May 15, 2025
- Chipbond Technology Corporation
- Kung-Tzu Tu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLIP CHIP STRUCTURE AND CIRCUIT BOARD THEREOF
- Publication number 20250157970
- Publication date May 15, 2025
- Chipbond Technology Corporation
- Kung-Tzu Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE CIRCUIT BOARD FOR CHIP INTEGRATION AND ELECTRONIC DEVICE H...
- Publication number 20250142719
- Publication date May 1, 2025
- Chipbond Technology Corporation
- Chiu-Hong Lai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE CIRCUIT BOARD
- Publication number 20250071889
- Publication date Feb 27, 2025
- Chipbond Technology Corporation
- Kung-Tzu Tu
- G01 - MEASURING TESTING
Information Patent Application
FLEXIBLE CIRCUIT TAPE AND FLEXIBLE CIRCUIT BOARD THEREOF
- Publication number 20250071895
- Publication date Feb 27, 2025
- Chipbond Technology Corporation
- Chih-Hsiung Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250038052
- Publication date Jan 30, 2025
- Chipbond Technology Corporation
- Cheng-Hung Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INNER LEAD STRUCTURE OF FLEXIBLE CIRCUIT BOARD
- Publication number 20250038129
- Publication date Jan 30, 2025
- Chipbond Technology Corporation
- Wen-Ping Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER AND CHIP THEREOF
- Publication number 20250038130
- Publication date Jan 30, 2025
- Chipbond Technology Corporation
- Sheng-Han Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP
- Publication number 20250038143
- Publication date Jan 30, 2025
- Chipbond Technology Corporation
- Chun-Chia Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM CIRCUIT BOARD
- Publication number 20240389224
- Publication date Nov 21, 2024
- Chipbond Technology Corporation
- Kung-Tzu Tu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAYOUT STRUCTURE OF FLEXIBLE CIRCUIT BOARD
- Publication number 20240371741
- Publication date Nov 7, 2024
- Chipbond Technology Corporation
- Hou-Chang Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND CHIP THEREOF
- Publication number 20240347493
- Publication date Oct 17, 2024
- CHIPBOND TECHNOLOGY CORPORATION
- Wei-Hsin Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240194646
- Publication date Jun 13, 2024
- Chipbond Technology Corporation
- Chin-Tang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240105664
- Publication date Mar 28, 2024
- Chipbond Technology Corporation
- Yu-Chung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD
- Publication number 20240074041
- Publication date Feb 29, 2024
- Chipbond Technology Corporation
- Gwo-Shyan Sheu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240074127
- Publication date Feb 29, 2024
- Chipbond Technology Corporation
- Chen-Yu Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLIP CHIP PACKAGE AND SUBSTRATE THEREOF
- Publication number 20240014118
- Publication date Jan 11, 2024
- Chipbond Technology Corporation
- Chun-Te Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND CIRCUIT BOARD THEREOF
- Publication number 20240008171
- Publication date Jan 4, 2024
- Chipbond Technology Corporation
- Wei-Teng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLAMP ASSEMBLY
- Publication number 20230420287
- Publication date Dec 28, 2023
- Chipbond Technology Corporation
- Ching-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TAPE AND MANUFACTURING METHOD THEREOF
- Publication number 20230380072
- Publication date Nov 23, 2023
- Chipbond Technology Corporation
- Yi-Hui Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLIP-CHIP BONDING STRUCTURE AND CIRCUIT BOARD THEREOF
- Publication number 20230380053
- Publication date Nov 23, 2023
- Chipbond Technology Corporation
- Chun-Te Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP BONDING STRUCTURE AND SUBSTRATE THEREOF
- Publication number 20230378044
- Publication date Nov 23, 2023
- Chipbond Technology Corporation
- Chin-Tang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-ON-FILM PACKAGE
- Publication number 20230326896
- Publication date Oct 12, 2023
- Chipbond Technology Corporation
- Sheng-Jen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP BONDING METHOD AND CHIP USED THEREIN
- Publication number 20230326894
- Publication date Oct 12, 2023
- Chipbond Technology Corporation
- Fei-Jain Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230187378
- Publication date Jun 15, 2023
- Chipbond Technology Corporation
- Shrane-Ning Jenq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230170301
- Publication date Jun 1, 2023
- Chipbond Technology Corporation
- Chin-Tang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS

Chipbond Technology Corporation

Organization

Patents Grantslast 30 patents

Electronic package and method of manufacturing the same

Surface acoustic wave device and method of manufacturing the same

Method of manufacturing semiconductor device

Double-sided flexible circuit board

Layout structure of a flexible circuit board

Storage device for flexible circuit packages and carrier thereof

Tray

Semiconductor package and method of fabricating the same

Flexible circuit board

Circuit board tape and joining method thereof

Flip chip package and circuit board thereof

Surface acoustic wave device and method of manufacturing the same

Flexible circuit board and heat spreader thereof

Method of attaching heat sinks to a circuit tape

Flip chip interconnection and circuit board thereof

Layout structure of a flexible circuit board

Circuit board

Flexible circuit board

Flexible circuit board

Double-sided flexible circuit board and layout structure thereof

Storage container for electronic devices

Restriction device for preventing deformation of restriction plate...

Semiconductor device having 3D inductor and method of manufacturing...

Circuit board

Chip package and circuit board thereof

Circuit board having a predetermined punch area and sheet separated...

Electroplating system and pressure device thereof

Chip package and chip thereof

Chip on film package and flexible substrate thereof

Semiconductor package and circuit substrate thereof

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

CHIP STRUCTURE AND METHOD OF MANUFACTURING THE SAME

TEST PAD

FLEXIBLE CIRCUIT BOARD

FLEXIBLE CIRCUIT BOARD

FLIP CHIP STRUCTURE AND CIRCUIT BOARD THEREOF

FLEXIBLE CIRCUIT BOARD FOR CHIP INTEGRATION AND ELECTRONIC DEVICE H...

FLEXIBLE CIRCUIT BOARD

FLEXIBLE CIRCUIT TAPE AND FLEXIBLE CIRCUIT BOARD THEREOF

CHIP STRUCTURE AND METHOD OF MANUFACTURING THE SAME

INNER LEAD STRUCTURE OF FLEXIBLE CIRCUIT BOARD

WAFER AND CHIP THEREOF

CHIP

THIN FILM CIRCUIT BOARD

LAYOUT STRUCTURE OF FLEXIBLE CIRCUIT BOARD

SEMICONDUCTOR PACKAGE AND CHIP THEREOF

SEMICONDUCTOR PACKAGE

PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

CIRCUIT BOARD

ELECTRONIC PACKAGE AND METHOD OF MANUFACTURING THE SAME

FLIP CHIP PACKAGE AND SUBSTRATE THEREOF

SEMICONDUCTOR PACKAGE AND CIRCUIT BOARD THEREOF

CLAMP ASSEMBLY

TAPE AND MANUFACTURING METHOD THEREOF

FLIP-CHIP BONDING STRUCTURE AND CIRCUIT BOARD THEREOF

FLIP-CHIP BONDING STRUCTURE AND SUBSTRATE THEREOF

CHIP-ON-FILM PACKAGE

FLIP CHIP BONDING METHOD AND CHIP USED THEREIN

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME

Trademarklast 30 trademarks