TREA

Chipbond Technology Corporation

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Organization

  • Hsinchu, TW
Organizations

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    FLEXIBLE CIRCUIT BOARD
    • Publication number 20250071889
    • Publication date Feb 27, 2025
    • Chipbond Technology Corporation
    • Kung-Tzu Tu
    • G01 - MEASURING TESTING
  • Information Patent Application

    FLEXIBLE CIRCUIT TAPE AND FLEXIBLE CIRCUIT BOARD THEREOF
    • Publication number 20250071895
    • Publication date Feb 27, 2025
    • Chipbond Technology Corporation
    • Chih-Hsiung Hu
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CHIP STRUCTURE AND METHOD OF MANUFACTURING THE SAME
    • Publication number 20250038052
    • Publication date Jan 30, 2025
    • Chipbond Technology Corporation
    • Cheng-Hung Shih
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INNER LEAD STRUCTURE OF FLEXIBLE CIRCUIT BOARD
    • Publication number 20250038129
    • Publication date Jan 30, 2025
    • Chipbond Technology Corporation
    • Wen-Ping Hsu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER AND CHIP THEREOF
    • Publication number 20250038130
    • Publication date Jan 30, 2025
    • Chipbond Technology Corporation
    • Sheng-Han Yang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CHIP
    • Publication number 20250038143
    • Publication date Jan 30, 2025
    • Chipbond Technology Corporation
    • Chun-Chia Yeh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    THIN FILM CIRCUIT BOARD
    • Publication number 20240389224
    • Publication date Nov 21, 2024
    • Chipbond Technology Corporation
    • Kung-Tzu Tu
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    LAYOUT STRUCTURE OF FLEXIBLE CIRCUIT BOARD
    • Publication number 20240371741
    • Publication date Nov 7, 2024
    • Chipbond Technology Corporation
    • Hou-Chang Kuo
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE AND CHIP THEREOF
    • Publication number 20240347493
    • Publication date Oct 17, 2024
    • CHIPBOND TECHNOLOGY CORPORATION
    • Wei-Hsin Wu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20240194646
    • Publication date Jun 13, 2024
    • Chipbond Technology Corporation
    • Chin-Tang Hsieh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
    • Publication number 20240105664
    • Publication date Mar 28, 2024
    • Chipbond Technology Corporation
    • Yu-Chung Huang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CIRCUIT BOARD
    • Publication number 20240074041
    • Publication date Feb 29, 2024
    • Chipbond Technology Corporation
    • Gwo-Shyan Sheu
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC PACKAGE AND METHOD OF MANUFACTURING THE SAME
    • Publication number 20240074127
    • Publication date Feb 29, 2024
    • Chipbond Technology Corporation
    • Chen-Yu Wang
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    FLIP CHIP PACKAGE AND SUBSTRATE THEREOF
    • Publication number 20240014118
    • Publication date Jan 11, 2024
    • Chipbond Technology Corporation
    • Chun-Te Lee
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE AND CIRCUIT BOARD THEREOF
    • Publication number 20240008171
    • Publication date Jan 4, 2024
    • Chipbond Technology Corporation
    • Wei-Teng Lin
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CLAMP ASSEMBLY
    • Publication number 20230420287
    • Publication date Dec 28, 2023
    • Chipbond Technology Corporation
    • Ching-Wen Chen
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    TAPE AND MANUFACTURING METHOD THEREOF
    • Publication number 20230380072
    • Publication date Nov 23, 2023
    • Chipbond Technology Corporation
    • Yi-Hui Chen
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    FLIP-CHIP BONDING STRUCTURE AND CIRCUIT BOARD THEREOF
    • Publication number 20230380053
    • Publication date Nov 23, 2023
    • Chipbond Technology Corporation
    • Chun-Te Lee
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    FLIP-CHIP BONDING STRUCTURE AND SUBSTRATE THEREOF
    • Publication number 20230378044
    • Publication date Nov 23, 2023
    • Chipbond Technology Corporation
    • Chin-Tang Hsieh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CHIP-ON-FILM PACKAGE
    • Publication number 20230326896
    • Publication date Oct 12, 2023
    • Chipbond Technology Corporation
    • Sheng-Jen Wu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    FLIP CHIP BONDING METHOD AND CHIP USED THEREIN
    • Publication number 20230326894
    • Publication date Oct 12, 2023
    • Chipbond Technology Corporation
    • Fei-Jain Wu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
    • Publication number 20230187378
    • Publication date Jun 15, 2023
    • Chipbond Technology Corporation
    • Shrane-Ning Jenq
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME
    • Publication number 20230170301
    • Publication date Jun 1, 2023
    • Chipbond Technology Corporation
    • Chin-Tang Hsieh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20230163061
    • Publication date May 25, 2023
    • Chipbond Technology Corporation
    • Yu-Chen Ma
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
    • Publication number 20230135424
    • Publication date May 4, 2023
    • Chipbond Technology Corporation
    • Shrane-Ning Jenq
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    METHOD OF STRIPPING PHOTORESIST
    • Publication number 20230102718
    • Publication date Mar 30, 2023
    • Chipbond Technology Corporation
    • Hsueh-Shun Yeh
    • G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
  • Information Patent Application

    LAYOUT STRUCTURE OF FLEXIBLE CIRCUIT BOARD
    • Publication number 20230044345
    • Publication date Feb 9, 2023
    • Chipbond Technology Corporation
    • Yu-Chen Ma
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DOUBLE-SIDED FLEXIBLE CIRCUIT BOARD
    • Publication number 20230039895
    • Publication date Feb 9, 2023
    • Chipbond Technology Corporation
    • Yin-Chen Lin
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    DOUBLE-SIDED FLEXIBLE CIRCUIT BOARD
    • Publication number 20230044473
    • Publication date Feb 9, 2023
    • Chipbond Technology Corporation
    • Yin-Chen Lin
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SURFACE ACOUSTIC WAVE DEVICE AND METHOD OF MANUFACTURING THE SAME
    • Publication number 20220337216
    • Publication date Oct 20, 2022
    • Chipbond Technology Corporation
    • Cheng-Hung Shih
    • H01 - BASIC ELECTRIC ELEMENTS