CHIPMOS TECHNOLOGIES(SHANGHAI) LTD.

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SHANGHAI, CN

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Patents Grantslast 30 patents

Information Patent Grant
Chip package structure and fabricating method thereof
- Patent number 8,039,946
- Issue date Oct 18, 2011
- ChipMOS Technologies (Shanghai) Ltd.
- Hua Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure
- Patent number 7,361,984
- Issue date Apr 22, 2008
- ChipMOS Technologies (Shanghai) Ltd.
- Yan-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS

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Patents Applicationslast 30 patents

Information Patent Application
CHIP PACKAGE STRUCTURE AND FABRICATING METHOD THREROF
- Publication number 20100078801
- Publication date Apr 1, 2010
- CHIPMOS TECHNOLOGIES(SHANGHAI) LTD.
- Hua Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND FABRICATING METHOD THREROF
- Publication number 20100078802
- Publication date Apr 1, 2010
- CHIPMOS TECHNOLOGIES(SHANGHAI) LTD.
- Hua Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE
- Publication number 20080093719
- Publication date Apr 24, 2008
- CHIPMOS TECHNOLOGIES(SHANGHAI) LTD.
- Yan-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE
- Publication number 20080017958
- Publication date Jan 24, 2008
- CHIPMOS TECHNOLOGIES(SHANGHAI) LTD.
- Yan-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND FABRICATING METHOD THREROF
- Publication number 20080012106
- Publication date Jan 17, 2008
- CHIPMOS TECHNOLOGIES(SHANGHAI) LTD.
- Hua Pan
- H01 - BASIC ELECTRIC ELEMENTS