DiDrew Technology (BVI) Limited

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Tortola, VG

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Patents Grantslast 30 patents

Information Patent Grant
Method for debonding temporarily adhesive-bonded carrier-workpiece...
- Patent number 10,913,254
- Issue date Feb 9, 2021
- DIDREW TECHNOLOGY (BVI) LIMITED
- Chunbin Zhang
- B32 - LAYERED PRODUCTS
Information Patent Grant
Hermetic flat top integrated heat spreader (IHS)/electromagnetic in...
- Patent number 10,734,326
- Issue date Aug 4, 2020
- DIDREW TECHNOLOGY (BVI) LIMITED
- Minghao Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded cavity fanout package without using a carrier and method of...
- Patent number 10,347,509
- Issue date Jul 9, 2019
- DIDREW TECHNOLOGY (BVI) LIMITED
- Minghao Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method of manufacturing frameless LCD display
- Patent number 10,209,597
- Issue date Feb 19, 2019
- DIDREW TECHNOLOGY (BVI) LIMITED
- Minghao Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for debonding temporarily adhesive-bonded carrier-workpiece...
- Patent number 10,211,077
- Issue date Feb 19, 2019
- DIDREW TECHNOLOGY (BVI) LIMITED
- Chunbin Zhang
- B32 - LAYERED PRODUCTS
Information Patent Grant
System and method of embedding driver IC (EmDIC) in LCD display sub...
- Patent number 10,209,542
- Issue date Feb 19, 2019
- DIDREW TECHNOLOGY (BVI) LIMITED
- Minghao Shen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTERPOSER STRUCTURE CONTAINING EMBEDDED SILICON-LESS LINK CHIPLET
- Publication number 20220302010
- Publication date Sep 22, 2022
- DIDREW TECHNOLOGY (BVI) LIMITED
- Minghao SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED MOLDING FAN-OUT (EMFO) PACKAGING AND METHOD OF MANUFACTURI...
- Publication number 20210287953
- Publication date Sep 16, 2021
- DiDrew Technology (BVI) Limited
- Minghao Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF DEBONDING WORK-CARRIER PAIR WITH THIN DEVICES
- Publication number 20190295877
- Publication date Sep 26, 2019
- DIDREW TECHNOLOGY (BVI) LIMITED
- Chunbin Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS FRAME FAN OUT PACKAGING AND METHOD OF MANUFACTURING THEREOF
- Publication number 20190259675
- Publication date Aug 22, 2019
- DiDrew Technology (BVI) Limited
- Minghao Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE WAFERS FABRICATION TECHNIQUE ON LARGE CARRIER WITH WARPAGE...
- Publication number 20190252278
- Publication date Aug 15, 2019
- DiDrew Technology (BVI) Limited
- Minghao Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HERMETIC FLAT TOP INTEGRATED HEAT SPREADER ( IHS)/ELECTROMAGNETIC I...
- Publication number 20190252324
- Publication date Aug 15, 2019
- DIDREW TECHNOLOGY (BVI) LIMITED
- Minghao Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR DEBONDING TEMPORARILY ADHESIVE-BONDED CARRIER-WORKPIECE...
- Publication number 20180264797
- Publication date Sep 20, 2018
- DIDREW TECHNOLOGY (BVI) LIMITED
- Chunbin Zhang
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD FOR DEBONDING TEMPORARILY ADHESIVE-BONDED CARRIER-WORKPIECE...
- Publication number 20180269077
- Publication date Sep 20, 2018
- DIDREW TECHNOLOGY (BVI) LIMITED
- Chunbin Zhang
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

DiDrew Technology (BVI) Limited

Organization

Patents Grantslast 30 patents

Method for debonding temporarily adhesive-bonded carrier-workpiece...

Hermetic flat top integrated heat spreader (IHS)/electromagnetic in...

Molded cavity fanout package without using a carrier and method of...

System and method of manufacturing frameless LCD display

Method for debonding temporarily adhesive-bonded carrier-workpiece...

System and method of embedding driver IC (EmDIC) in LCD display sub...

Patents Applicationslast 30 patents

INTERPOSER STRUCTURE CONTAINING EMBEDDED SILICON-LESS LINK CHIPLET

EMBEDDED MOLDING FAN-OUT (EMFO) PACKAGING AND METHOD OF MANUFACTURI...

METHOD OF DEBONDING WORK-CARRIER PAIR WITH THIN DEVICES

GLASS FRAME FAN OUT PACKAGING AND METHOD OF MANUFACTURING THEREOF

MULTIPLE WAFERS FABRICATION TECHNIQUE ON LARGE CARRIER WITH WARPAGE...

HERMETIC FLAT TOP INTEGRATED HEAT SPREADER ( IHS)/ELECTROMAGNETIC I...

METHOD FOR DEBONDING TEMPORARILY ADHESIVE-BONDED CARRIER-WORKPIECE...

METHOD FOR DEBONDING TEMPORARILY ADHESIVE-BONDED CARRIER-WORKPIECE...

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