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ELECTROPLATING ENGINEERS OF JAPAN LIMITED

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  • TOKYO, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Laminate structure of metal coating
    • Patent number 10,306,774
    • Issue date May 28, 2019
    • Electroplating Engineers of Japan Limited
    • Masahiro Ito
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Non-cyanide based Au—Sn alloy plating solution
    • Patent number 10,301,734
    • Issue date May 28, 2019
    • Electroplating Engineers of Japan Limited
    • Katsunori Hayashi
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Grant

    Pretreatment solution for electroless plating and electroless plati...
    • Patent number 9,932,676
    • Issue date Apr 3, 2018
    • Electroplating Engineers of Japan Limited
    • Masahiro Ito
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Electroless gold plating solution and electroless gold plating method
    • Patent number 8,771,409
    • Issue date Jul 8, 2014
    • Electroplating Engineers of Japan Limited
    • Takanobu Asakawa
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Palladium plating solution
    • Patent number 7,887,692
    • Issue date Feb 15, 2011
    • Electroplating Engineers of Japan Limited
    • Shingo Watanabe
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Plating apparatus
    • Patent number 7,799,186
    • Issue date Sep 21, 2010
    • Electroplating Engineers of Japan Limited
    • Yuji Uchiumi
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Grant

    Cup-shaped plating apparatus
    • Patent number 7,179,359
    • Issue date Feb 20, 2007
    • Electroplating Engineers of Japan, Ltd
    • Hirofumi Ishida
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Plating apparatus and plating method
    • Patent number 7,108,776
    • Issue date Sep 19, 2006
    • Electroplating Engineers of Japan Limited
    • Yasuhiko Sakaki
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Grant

    Cup type plating apparatus
    • Patent number 6,991,711
    • Issue date Jan 31, 2006
    • Electroplating Engineers of Japan Limited
    • Yasuhiko Sakaki
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Plating apparatus for wafer
    • Patent number 6,875,333
    • Issue date Apr 5, 2005
    • Electroplating Engineers of Japan Limited
    • Yasuhiko Sakaki
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Grant

    Displacement gold plating solution
    • Patent number 6,767,392
    • Issue date Jul 27, 2004
    • Electroplating Engineers of Japan Limited
    • Katsunori Hayashi
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Wafer plating apparatus
    • Patent number 6,736,945
    • Issue date May 18, 2004
    • Electroplating Engineers of Japan Limited
    • Hirofumi Ishida
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Cup-type plating apparatus and method for plating wafers
    • Patent number 6,610,182
    • Issue date Aug 26, 2003
    • Electroplating Engineers of Japan, Limited
    • Yasuhiko Sakaki
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Grant

    Gold plating solution and gold plating method using thereof
    • Patent number 6,511,589
    • Issue date Jan 28, 2003
    • Electroplating Engineers of Japan Limited
    • Yoshio Shindo
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Grant

    Cup shaped plating apparatus with a disc shaped stirring device hav...
    • Patent number 6,482,300
    • Issue date Nov 19, 2002
    • Electroplating Engineers of Japan Limited
    • Yasuhiko Sakaki
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Cup type plating apparatus
    • Patent number 6,454,918
    • Issue date Sep 24, 2002
    • Electroplating Engineers of Japan Limited
    • Yasuhiko Sakaki
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Grant

    Cup-type plating apparatus and method for plating wafer using the same
    • Patent number 6,332,963
    • Issue date Dec 25, 2001
    • Electroplating Engineers of Japan Limited
    • Yasuhiko Sakaki
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Grant

    Cup-type plating method and cleaning apparatus used therefor
    • Patent number 6,224,670
    • Issue date May 1, 2001
    • Electroplating Engineers of Japan Limited
    • Hirofumi Ishida
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Automatic wafer plating equipment
    • Patent number 5,935,330
    • Issue date Aug 10, 1999
    • Electroplating Engineers of Japan Ltd.
    • Kazuhiro Taniguchi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Plating method by means of an electroless gold plating solution and...
    • Patent number 5,691,003
    • Issue date Nov 25, 1997
    • Electroplating Engineers Of Japan Limited
    • Takayuki Sone
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Electroless gold plating solution
    • Patent number 5,660,619
    • Issue date Aug 26, 1997
    • Electroplating Engineer of Japan, Limited
    • Hiroshi Wachi
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Electroless gold plating solution
    • Patent number 5,614,004
    • Issue date Mar 25, 1997
    • Electroplating Engineers of Japan, Limited
    • Hiroshi Wachi
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Silver plating baths and silver plating method using the same
    • Patent number 5,601,696
    • Issue date Feb 11, 1997
    • Electroplating Engineers Of Japan Limited
    • Takanobu Asakawa
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Grant

    Electroless gold plating solution
    • Patent number 5,601,637
    • Issue date Feb 11, 1997
    • Electroplating Engineers of Japan, Limited
    • Hiroshi Wachi
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Electroless gold plating solution
    • Patent number 5,560,764
    • Issue date Oct 1, 1996
    • Electroplating Engineers of Japan, Limited
    • Hiroshi Wachi
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Platinum electroforming bath
    • Patent number 5,549,738
    • Issue date Aug 27, 1996
    • Electroplating Engineers of Japan, Limited
    • Katsutsugu Kitada
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Grant

    Platinum electroforming and platinum electroplating
    • Patent number 5,529,680
    • Issue date Jun 25, 1996
    • Electroplating Engineers of Japan, Limited
    • Katsutsugu Kitada
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Grant

    Method of preventing deformation of lead frames
    • Patent number 5,475,918
    • Issue date Dec 19, 1995
    • Electroplating Engineers of Japan Ltd.
    • Tsuneo Kubota
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Plating device for wafer
    • Patent number 5,447,615
    • Issue date Sep 5, 1995
    • Electroplating Engineers Of Japan Limited
    • Hirofumi Ishida
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Grant

    Plating device for wafer
    • Patent number 5,429,733
    • Issue date Jul 4, 1995
    • Electroplating Engineers of Japan, Ltd.
    • Hirofumi Ishida
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

  • Information Patent Application

    BIOPOLYMER CONCENTRATION METHOD, CRYSTALLIZATION METHOD, AND NANOST...
    • Publication number 20220178050
    • Publication date Jun 9, 2022
    • NATIONAL UNIVERSITY CORPORATION GUNMA UNIVERSITY
    • Tetsuo OKUTSU
    • B82 - NANO-TECHNOLOGY
  • Information Patent Application

    NANOSTRUCTURE SUBSTRATE
    • Publication number 20220145470
    • Publication date May 12, 2022
    • ELECTROPLATING ENGINEERS OF JAPAN LIMITED
    • Masahiro ITO
    • B82 - NANO-TECHNOLOGY
  • Information Patent Application

    LAMINATE STRUCTURE OF METAL COATING
    • Publication number 20190090357
    • Publication date Mar 21, 2019
    • ELECTROPLATING ENGINEERS OF JAPAN LIMITED
    • Masahiro ITO
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    NON-CYANIDE BASED Au-Sn ALLOY PLATING SOLUTION
    • Publication number 20170292200
    • Publication date Oct 12, 2017
    • ELECTROPLATING ENGINEERS OF JAPAN LIMITED
    • Katsunori Hayashi
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    NON-CYANIDE ELECTROLYTIC GOLD PLATING SOLUTION
    • Publication number 20150137356
    • Publication date May 21, 2015
    • ELECTROPLATING ENGINEERS OF JAPAN LIMITED
    • Junko Tsuyuki
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Method of wafer plating
    • Publication number 20070289873
    • Publication date Dec 20, 2007
    • ELECTROPLATING ENGINEERS OF JAPAN LIMITED
    • Yuji Uchiumi
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Palladium plating solution
    • Publication number 20070205109
    • Publication date Sep 6, 2007
    • ELECTROPLATING ENGINEERS OF JAPAN LIMITED
    • Shingo Watanabe
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Plating apparatus
    • Publication number 20070114127
    • Publication date May 24, 2007
    • ELECTROPLATING ENGINEERS OF JAPAN LIMITED
    • Yuji Uchiumi
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Copper plating solution for embedding fine wiring, and copper plati...
    • Publication number 20030085133
    • Publication date May 8, 2003
    • Electroplating Engineers of Japan Limited (Japanese Corporation)
    • Takashi Totsuka
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Cup-type plating apparatus
    • Publication number 20020108850
    • Publication date Aug 15, 2002
    • ELECTROPLATING ENGINEERS OF JAPAN LIMITED
    • Yasuhiko Sakaki
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Cup type plating apparatus
    • Publication number 20020088708
    • Publication date Jul 11, 2002
    • ELECTROPLATING ENGINEERS OF JAPAN LIMITED
    • Yasuhiko Sakaki
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Wafer plating apparatus
    • Publication number 20010017105
    • Publication date Aug 30, 2001
    • ELECTROPLATING ENGINEERS OF JAPAN LIMITED
    • Hirofumi Ishida
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Wafer plating apparatus
    • Publication number 20010017258
    • Publication date Aug 30, 2001
    • ELECTROPLATING ENGINEERS OF JAPAN LIMITED
    • Hirofumi Ishida
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Trademarklast 30 trademarks

  • Information Trademark

    86816282 - RAD-PLATER
    • Serial number 86816282
    • Registration number 5006581
    • Filing date Nov 11, 2015
    • Electroplating Engineers of Japan Limited
    • 7 - Machines and machine tools
  • Information Trademark

    86351283 - ALEXEL
    • Serial number 86351283
    • Filing date Jul 29, 2014
    • ELECTROPLATING ENGINEERS OF JAPAN LIMITED
    • 7 - Machines and machine tools
  • Information Trademark

    75310017 - CUPLAND
    • Serial number 75310017
    • Registration number 2396685
    • Filing date Jun 16, 1997
    • Electroplating Engineers of Japan Ltd.
    • 7 - Machines and machine tools
  • Information Trademark

    74735250 - POSPEC
    • Serial number 74735250
    • Registration number 2088616
    • Filing date Sep 20, 1995
    • Electroplating Engineers of Japan Ltd.
    • 7 - Machines and machine tools
  • Information Trademark

    74728652 - CUP-PLATER
    • Serial number 74728652
    • Registration number 2246316
    • Filing date Sep 13, 1995
    • Electroplating Engineers of Japan Ltd.
    • 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
  • Information Trademark

    74407520 - POSFER
    • Serial number 74407520
    • Registration number 1835285
    • Filing date Jun 30, 1993
    • Electroplating Engineers of Japan Limited
    • 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
  • Information Trademark

    73813697 - SPECTAS
    • Serial number 73813697
    • Registration number 1599338
    • Filing date Jul 20, 1989
    • ELECTROPLATING ENGINEERS OF JAPAN LIMITED
    • 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
  • Information Trademark

    73288454 - AUTO-MASQ
    • Serial number 73288454
    • Registration number 1199328
    • Filing date Dec 4, 1980
    • Electroplating Engineers of Japan
    • 7 - Machines and machine tools