ELPIS TECHNOLOGIES INC

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OTTAWA, CA

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Patents Grantslast 30 patents

Information Patent Grant
Single process for liner and metal fill
- Patent number 11,322,359
- Issue date May 3, 2022
- ELPIS TECHNOLOGIES INC.
- Praneet Adusumilli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power decoupling attachment
- Patent number 11,297,717
- Issue date Apr 5, 2022
- ELPIS TECHNOLOGIES INC.
- Lei Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhancement of iso-via reliability
- Patent number 11,227,796
- Issue date Jan 18, 2022
- ELPIS TECHNOLOGIES INC.
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive contacts in semiconductor on insulator substrate
- Patent number 11,177,285
- Issue date Nov 16, 2021
- ELPIS TECHNOLOGIES INC.
- Kangguo Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wimpy device by selective laser annealing
- Patent number 11,088,026
- Issue date Aug 10, 2021
- ELPIS TECHNOLOGIES INC.
- Kangguo Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-limiting fin spike removal
- Patent number 11,063,129
- Issue date Jul 13, 2021
- ELPIS TECHNOLOGIES INC.
- Kangguo Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical transport fin field effect transistor with asymmetric chan...
- Patent number 10,985,257
- Issue date Apr 20, 2021
- ELPIS TECHNOLOGIES INC.
- Choonghyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming the semiconductor device
- Patent number 10,978,454
- Issue date Apr 13, 2021
- ELPIS TECHNOLOGIES INC.
- Brent Alan Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for vertical FET gate length control
- Patent number 10,978,576
- Issue date Apr 13, 2021
- ELPIS TECHNOLOGIES INC.
- Chi-Chun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat pipe and vapor chamber heat dissipation
- Patent number 10,966,351
- Issue date Mar 30, 2021
- ELPIS TECHNOLOGIES INC.
- Xiaojin Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Removal of trilayer resist without damage to underlying structure
- Patent number 10,957,536
- Issue date Mar 23, 2021
- ELPIS TECHNOLOGIES INC.
- Muthumanickam Sankarapandian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with self-aligned carbon nanotube gate
- Patent number 10,943,786
- Issue date Mar 9, 2021
- ELPIS TECHNOLOGIES INC.
- Qing Cao
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Vertical transport FETs having a gradient threshold voltage
- Patent number 10,937,883
- Issue date Mar 2, 2021
- ELPIS TECHNOLOGIES INC.
- Choonghyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with buried local interconnects
- Patent number 10,916,468
- Issue date Feb 9, 2021
- ELPIS TECHNOLOGIES INC.
- Effendi Leobandung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Close proximity and lateral resistance reduction for bottom source/...
- Patent number 10,886,403
- Issue date Jan 5, 2021
- ELPIS TECHNOLOGIES INC.
- Alexander Reznicek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-forming spacers using oxidation
- Patent number 10,833,156
- Issue date Nov 10, 2020
- ELPIS TECHNOLOGIES INC.
- Kevin K. Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and structures for forming uniform fins when using hardmask...
- Patent number 10,832,955
- Issue date Nov 10, 2020
- ELPIS TECHNOLOGIES INC.
- Peng Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Simultaneously fabricating a high voltage transistor and a FinFET
- Patent number 10,811,410
- Issue date Oct 20, 2020
- ELPIS TECHNOLOGIES INC.
- Kangguo Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Well and punch through stopper formation using conformal doping
- Patent number 10,804,107
- Issue date Oct 13, 2020
- ELPIS TECHNOLOGIES INC.
- Effendi Leobandung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated gate driver
- Patent number 10,804,366
- Issue date Oct 13, 2020
- ELPIS TECHNOLOGIES INC.
- Bahman Hekmatshoartabari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density programmable e-fuse co-integrated with vertical FETs
- Patent number 10,804,278
- Issue date Oct 13, 2020
- ELPIS TECHNOLOGIES INC.
- Karthik Balakrishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Porous silicon relaxation medium for dislocation free CMOS devices
- Patent number 10,804,166
- Issue date Oct 13, 2020
- ELPIS TECHNOLOGIES INC.
- Kangguo Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside contact to a final substrate
- Patent number 10,790,190
- Issue date Sep 29, 2020
- ELPIS TECHNOLOGIES INC.
- Jeffrey P. Gambino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spacer for trench epitaxial structures
- Patent number 10,790,284
- Issue date Sep 29, 2020
- ELPIS TECHNOLOGIES INC.
- Injo Ok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual channel silicon/silicon germanium complementary metal oxide se...
- Patent number 10,790,199
- Issue date Sep 29, 2020
- ELPIS TECHNOLOGIES INC.
- Ruqiang Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package assembly for thin wafer shipping and method of use
- Patent number 10,784,137
- Issue date Sep 22, 2020
- ELPIS TECHNOLOGIES INC.
- Damyon L. Corbin
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Fin-type FET with low source or drain contact resistance
- Patent number 10,777,647
- Issue date Sep 15, 2020
- ELPIS TECHNOLOGIES INC.
- Kangguo Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multipart lid for a semiconductor package with multiple components
- Patent number 10,777,482
- Issue date Sep 15, 2020
- ELPIS TECHNOLOGIES INC.
- Charles L. Arvin
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Gas-controlled bonding platform for edge defect reduction during wa...
- Patent number 10,777,433
- Issue date Sep 15, 2020
- ELPIS TECHNOLOGIES INC.
- Wei Lin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Effective junction formation in vertical transistor structures by e...
- Patent number 10,763,343
- Issue date Sep 1, 2020
- ELPIS TECHNOLOGIES INC.
- Alexander Reznicek
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SINGLE PROCESS FOR LINER AND METAL FILL
- Publication number 20200273708
- Publication date Aug 27, 2020
- ELPIS TECHNOLOGIES INC.
- Praneet Adusumilli
- H01 - BASIC ELECTRIC ELEMENTS

ELPIS TECHNOLOGIES INC

Organization

Patents Grantslast 30 patents

Single process for liner and metal fill

Power decoupling attachment

Enhancement of iso-via reliability

Conductive contacts in semiconductor on insulator substrate

Wimpy device by selective laser annealing

Self-limiting fin spike removal

Vertical transport fin field effect transistor with asymmetric chan...

Semiconductor device and method of forming the semiconductor device

Techniques for vertical FET gate length control

Heat pipe and vapor chamber heat dissipation

Removal of trilayer resist without damage to underlying structure

Semiconductor device with self-aligned carbon nanotube gate

Vertical transport FETs having a gradient threshold voltage

Semiconductor device with buried local interconnects

Close proximity and lateral resistance reduction for bottom source/...

Self-forming spacers using oxidation

Methods and structures for forming uniform fins when using hardmask...

Simultaneously fabricating a high voltage transistor and a FinFET

Well and punch through stopper formation using conformal doping

Integrated gate driver

High density programmable e-fuse co-integrated with vertical FETs

Porous silicon relaxation medium for dislocation free CMOS devices

Backside contact to a final substrate

Spacer for trench epitaxial structures

Dual channel silicon/silicon germanium complementary metal oxide se...

Package assembly for thin wafer shipping and method of use

Fin-type FET with low source or drain contact resistance

Multipart lid for a semiconductor package with multiple components

Gas-controlled bonding platform for edge defect reduction during wa...

Effective junction formation in vertical transistor structures by e...

Patents Applicationslast 30 patents

SINGLE PROCESS FOR LINER AND METAL FILL

Trademarklast 30 trademarks