ePack, Inc.

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Ann Arbor, MI, US

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Patents Grantslast 30 patents

Information Patent Grant
MEMS isolation platform with three-dimensional vibration and stress...
- Patent number 10,611,628
- Issue date Apr 7, 2020
- EPACK, INC.
- Sangwoo Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
System with oven control and compensation for detecting motion and/...
- Patent number 10,386,385
- Issue date Aug 20, 2019
- EPACK, INC.
- Jay Mitchell
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
SYSTEM WITH OVEN CONTROL AND COMPENSATION FOR DETECTING MOTION AND/...
- Publication number 20200025795
- Publication date Jan 23, 2020
- EPACK, INC.
- Jay MITCHELL
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
VIBRATION ISOLATOR PLATFORM WITH ELECTRONIC ACCELERATION COMPENSATION
- Publication number 20190256348
- Publication date Aug 22, 2019
- EPACK, INC.
- Jay MITCHELL
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SPACE-EFFICIENT PLANAR INTERPOSER FOR ENVIRONMENT-RESISTANT PACKAGING
- Publication number 20190241428
- Publication date Aug 8, 2019
- EPACK, INC.
- Jay MITCHELL
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS ISOLATION PLATFORM WITH THREE-DIMENSIONAL VIBRATION AND STRESS...
- Publication number 20180230005
- Publication date Aug 16, 2018
- EPACK, INC.
- Sangwoo LEE
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SYSTEM WITH OVEN CONTROL AND COMPENSATION FOR DETECTING MOTION AND/...
- Publication number 20170122976
- Publication date May 4, 2017
- EPACK, INC.
- Jay MITCHELL
- G01 - MEASURING TESTING

Trademarklast 30 trademarks